Abstract: Weight data of articles for sale is stored and a total weight is calculated every order. Measured weight of the prepared articles in a package is compared with the calculated total weight. If the measured weight substantially disagrees with the calculated total weight, error information is provided to the operator to correctly package the articles. Comparison may be effected every order number. An addition flag may be further stored with weight data every article to indicate that the article is a target of weight measuring. A non-addition key indicating that the corresponding article is not packaged may be further provided. When the non-addition key is depressed, the weight of the corresponding article is not included in the total weight. The total weight may be printed on the receipt, so that the operator can compare the printed total weight with the measured weight. The total weight may be printed with bar codes. A balance has a bar code reader for comparison.

Abstract: A plurality of registers having dual functions of entering commodity orders and performing cash tendering are installed at a commodity order position sequentially along a route to a commodity presentation position. A display control unit makes a display sequence of the contents of orders sent from the registers coincide with a sequence in which commodities are presented at the commodity presentation position. A display unit for displaying the content of each order in accordance with the output signal of the display control unit is installed at the commodity presentation position.

Abstract: A process for preparing semiconductor devices by forming an insulation coating, such as a low melting point glass, on the surface of a semiconductor substrate and then forming a shaved groove through the insulation coating to the inner part of the semiconductor substrate. The insulation coating is one that is easily subject to cracking when shaved by a high speed rotating diamond blade having substantially parallel side surfaces.The low melting point glass and the semiconductor substrate are shaved by a diamond blade having a tapered edge which rotates in high speed, without forming a crack in the insulation coating or breaking a part of the semiconductor substrate. The semiconductor substrate is divided along the shaved groove in a dicing step to obtain separated semiconductor pellets.