Patents by Inventor Yoshio Karube

Yoshio Karube has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame having semiconductor device mounted thereon and method for fabricating the same
    Publication number: 20020158315
    Abstract: Upper and lower protective protruded portions are formed on an upper and lower surfaces of the lead frame to prevent breakage of resin mold or bending of terminals of semiconductor devices 2 mounted on a lead frame 1 during transportation of the lead frame between fabrication steps thereof. The regions of the upper and lower protective protruded portions are located between adjacent ones of the semiconductor devices. Those protruded portions are formed simultaneously with the resin sealing of the semiconductor devices by using the same resin material.
    Type: Application
    Filed: April 23, 2002
    Publication date: October 31, 2002
    Applicant: NEC Corporation
    Inventor: Yoshio Karube