Patents by Inventor Yoshio Kurita

Yoshio Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240095905
    Abstract: A workpiece quality determination system for determining the quality of a workpiece based on a stripe pattern projected on a surface of the workpiece includes an observation angle setter that sets an observation angle at which the projected stripe pattern on the workpiece is observed, a stripe projection angle setter that sets the stripe projection angle of the projected stripe pattern at the set observation angle, a reference stripe pattern creator that creates a reference stripe pattern from the projected stripe pattern at the set stripe projection angle, and a quality determinator that calculates a difference between the projected stripe pattern and the reference stripe pattern at the stripe projection angle to determine the quality based on the difference.
    Type: Application
    Filed: August 8, 2023
    Publication date: March 21, 2024
    Inventors: Takumi KURITA, Yoshio KANAI
  • Patent number: 6609292
    Abstract: A method of making a small chip resistor properly and efficiently is provided. This method makes chip resistors each of which comprises a unit substrate which is rectangular as viewed in plan and has a predetermined thickness, a resistor element provided on an upper surface of the substrate, and electrodes provided at opposite ends of the unit substrate.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 26, 2003
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Publication number: 20020026706
    Abstract: A method of making a small chip resistor properly and efficiently is provided. This method makes chip resistors each of which comprises a unit substrate which is rectangular as viewed in plan and has a predetermined thickness, a resistor element provided on an upper surface of the substrate, and electrodes provided at opposite ends of the unit substrate.
    Type: Application
    Filed: August 9, 2001
    Publication date: March 7, 2002
    Inventor: Yoshio Kurita
  • Patent number: 5805413
    Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.
    Type: Grant
    Filed: May 9, 1997
    Date of Patent: September 8, 1998
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 5221641
    Abstract: A process is provided for making light emitting diodes by using wire segments each plated with a glossy metal. The process comprises the steps of bending each wire segment generally into a U-shape to have a pair of legs connected together by an integral connecting web, deforming the free end of one leg by transverse compression to provide a cup end, mounting a semiconductor chip in the cup end, connecting the semiconductor chip to the free end of the other leg through a wire, forming a transparent or semitransparent resin package to enclose the respective free ends of the paired legs, and cutting the connecting web off the wire segment.
    Type: Grant
    Filed: May 27, 1992
    Date of Patent: June 22, 1993
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshio Kurita, Yuji Sakamoto, Atsushi Imai
  • Patent number: 5208481
    Abstract: A leadframe facilitates the bonding of leads to semiconductor chips. The leadframe has two longitudinal bands transversely spaced from each other, and connected by bar-like segments initially non-perpendicular to the bands, and spaced longitudinally along the leadframe. The leadframe also includes leads projecting from both of the bands, the leads projecting from one band being interleaved with those projecting from the other band. When one moves the longitudinal bands relative to each other longitudinally, the leads projecting from the first band come into alignment with the leads projecting from the second band. Thus, if one has first bonded semiconductor chips to the ends of the leads projecting from the first band, then movement of the bands longitudinally makes it easy to connect the second leads to each of the semiconductor chips.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: May 4, 1993
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshio Kurita, Akira Akamatsu
  • Patent number: 5095608
    Abstract: A pellet accommodating and aligning jig which includes an upper portion having an upper face formed with a plurality of pellet accommodating recesses in it, and a lower portion having a lower face, with a first through-bore being formed between a bottom face of each of the pellet accommodating recesses and the lower face, the bottom face side of the first through-bore being set to be a vacuum exhaust inlet and the lower face side of it set to be a vacuum exhaust outlet, so as to attract pellets placed on the bottom faces of the pellet accommodating recesses, onto the bottom faces through evacuation from the vaccum exhaust inlet of the first through-bores towards the vacuum exhaust outlets. The pellets accommodating and aligning jig further includes a micromesh member formed with a plurality of independent second through-bores each having a diameter smaller than that of the first through-bore, and disposed at the side of the bottom faces of the pellet accommodating recesses.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: March 17, 1992
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 5068206
    Abstract: The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cuase the pair of leads to move toward each other, so that a semicondductor chip is sandwiched between the pair of leads for bonding.
    Type: Grant
    Filed: December 11, 1990
    Date of Patent: November 26, 1991
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshio Kurita, Akira Akamatsu
  • Patent number: 5038453
    Abstract: The present invention proposes a method of manufacturing semiconductor devices from an elongated leadframe by using a differential overlapping apparatus. The leadframe has longitudinally spaced pairs of staggered leads. The overlapping apparatus functions to deform the leadframe during transfer thereof, so that each pair of staggered leads assumes the same longitudinal position but displaced away from each other perpendicularly to a plane containing the leadframe. The leadframe is further deformed to cause the pair of leads to move toward each other, so that a semiconductor chip is sandwiched between the pair of leads for bonding.
    Type: Grant
    Filed: July 11, 1989
    Date of Patent: August 13, 1991
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshio Kurita, Akira Akamatsu
  • Patent number: 4989845
    Abstract: A pellet accommodating and aligning jig includes an upper portion having an upper surface in which a plurality of pellet accommodating recesses are formed, and a lower portion having a lower surface. A first through-bore extends between the bottom of each of the pellet accommodating recesses and the lower surface. The end of the first through-bore adjacent the bottom of the recesses constitutes a vacuum exhaust inlet and the end adjacent the lower surface constitutes a vacuum exhaust outlet. Pellets placed in the pellet accommodating recesses are attracted toward the bottoms of the recesses when air is evacuated from the vacuum exhaust inlets of the first through-bores towards the vacuum exhaust outlets. The pellet accommodating and aligning jig further includes a micromesh member formed with a plurality of independent second through-bores each having a diameter smaller than that of each first through-bore, and disposed at the bottom of each of the pellet accommodating recesses.
    Type: Grant
    Filed: December 8, 1989
    Date of Patent: February 5, 1991
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 4945398
    Abstract: An overcurrent preventive diode comprises a diode chip sandwiched between respective bonding ends of first and second leads. The bonding end of the first lead is directly bonded to the diode chip into electrical conduction while being also kept in heat conduction with the chip. The bonding end of the second lead is held in heat conduction with the diode chip via a thin electrical insulating layer. The bonding end of the second lead and the insulating layer are shaped to expose an electrical connecting portion of the chip, thereby enabling the second lead bonding end to be electrically connected to the chip through a fusing wire which is designed to be melt-cut upon passage of a predetermined overcurrent.
    Type: Grant
    Filed: October 16, 1989
    Date of Patent: July 31, 1990
    Assignee: Rohm Co., Ltd.
    Inventors: Yoshio Kurita, Katsuhiro Takami, Kenji Tanaka, Yuji Kosumi
  • Patent number: 4467027
    Abstract: A developer composition of an alkaline aqueous solution containing a reducing inorganic salt, typically an alkali metal salt of sulfurous acid such as sodium sulfite, is found to be applicable for development of a lithographic printing plate material containing a photosensitive o-quinonediazide compound and an organic polymer, with reduced deterioration in developing capacity caused by the air and enhanced stability with lapse of time. In particular, a developer composition composed of an alkaline aqueous solution of pH 11 or higher containing a water-soluble sulfurous acid salt is effective for developing both of a lithographic printing plate material having a nega-type photosensitive layer containing a photosensitive diazo compound and an organic polymer, and a lithographic printing plate material having a posi-type photosensitive layer containing an o-quinonediazide compound and an organic polymer.
    Type: Grant
    Filed: May 20, 1982
    Date of Patent: August 21, 1984
    Assignee: Konishiroku Photo Industry Co., Ltd.
    Inventors: Takeshi Yamamoto, Kiyoshi Goto, Yoshio Kurita, Noriyasu Kita, Naoshi Kunieda
  • Patent number: 4362061
    Abstract: A vortex-shedding flow-measuring device in which the flowing velocity of the fluid is determined by measuring the frequency of differential changes of two capacitances formed by an electrode structure and the wall of the vortex-generating body. The electrodes are located in a recess formed in one end of the body and extend in the axial direction of the latter symmetrically with respect to the direction of flow of the fluid, whereby to reduce the effects on the measurement signal of vibration of the pipe or similar noise components.
    Type: Grant
    Filed: February 4, 1981
    Date of Patent: December 7, 1982
    Assignee: Yokogawa Electric Works, Ltd.
    Inventors: Shozo Yokogawa, Isamu Ohno, Yoshio Kurita
  • Patent number: 4257275
    Abstract: Noise signals from a relatively moving object, such as those caused by eddies in a fluid or by protrusions and recesses or gradation on the surface of paper or an iron plate, are sensed at two or more points spaced in the direction of the motion. A difference signal is then obtained from the resulting two noise signals. The relative velocity of the object is detected from the difference signal by utilizing the autocorrelation function or the frequency spectrum of the difference signal.
    Type: Grant
    Filed: September 4, 1979
    Date of Patent: March 24, 1981
    Assignee: Yokogawa Electric Works, Ltd.
    Inventors: Yoshio Kurita, Yukitake Shibata
  • Patent number: 4251619
    Abstract: This invention relates to a process for forming photo-polymerized images in light sensitive layers containing an activated component, a light sensitive resin and a colorable or decolorable component. Upon exposure to activating radiation the colored component is decolored or the decolorable component is colored and the energy involved is transferred to the light sensitive resin for polymerization.
    Type: Grant
    Filed: December 20, 1979
    Date of Patent: February 17, 1981
    Assignee: Konishiroku Photo Industry Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 4229514
    Abstract: A composition containing a photosensitive polymer which becomes insoluble by a light exposure and particularly to a highly photosensitive composition which comprises a photosensitive polymer having in the structure as photosensitive groups both an a,B-unsaturated ketone group having a cyano group at the a-position and an azide group.
    Type: Grant
    Filed: December 29, 1978
    Date of Patent: October 21, 1980
    Assignee: Konishiroku Photo Industry Co., Ltd.
    Inventors: Yoshio Kurita, Akio Iwaki
  • Patent number: 4201083
    Abstract: Noise signals from a relatively moving object, such as those caused by eddies in a fluid or by protrusions and recesses or gradation on the surface of paper or an iron plate, are sensed at two or more points spaced in the direction of the motion. A difference signal is then obtained from the resulting two noise signals. The relative velocity of the object is detected from the difference signal by utilizing the autocorrelation function or the frequency spectrum of the difference signal.
    Type: Grant
    Filed: June 6, 1978
    Date of Patent: May 6, 1980
    Assignee: Yokogawa Electric Works, Ltd.
    Inventors: Yoshio Kurita, Yukitake Shibata
  • Patent number: 4176361
    Abstract: Disclosed is an aqueous ink composition useful for ink jet printing, which comprises 2-12 wt % of a water soluble dye, 35-80 wt % of a polyhydric alcohol having 2-6 carbon atoms.
    Type: Grant
    Filed: May 12, 1976
    Date of Patent: November 27, 1979
    Assignee: Konishiroku Photo Industry Co., Ltd.
    Inventors: Hiroh Kawada, Kiyoshi Goto, Yoshio Kurita
  • Patent number: 3948097
    Abstract: A flow metering apparatus of the type having a vortex generating element with a generally elongate cylindrical shape placed in a stream of flowing fluid so as to produce Karman's vortices at a rate proportional to the velocity of the flowing fluid, with means for detecting the rate of production of vortices to give a linearly related measure of fluid velocity. To improve the correspondence of vortex production rate with flow velocity over wide conditions of flow, the element is formed with a rectangular cross-section in which the depth d along the direction of flow and the height h across the direction of flow are arranged in a ratio d/h of between about 0.5 and 0.9 and preferably in a ratio of 2/3. In the vortex generating element, passageway means extend between openings in the two opposed rectangle sides which are aligned with the direction of flow.
    Type: Grant
    Filed: August 26, 1974
    Date of Patent: April 6, 1976
    Assignee: Yokogawa Electric Works, Ltd.
    Inventors: Yoshio Kurita, Katsumi Takahashi, Toshio Aga