Patents by Inventor Yoshio Nakasato

Yoshio Nakasato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spring copper alloy for electric and electronic parts
    Patent number: 4761265
    Abstract: A spring copper alloy for electric and electronic parts having a high modulus of elasticity, a good electrical conductivity and a good solderability is disclosed, which alloy consists of 1.5.about.3.0% by weight of Ni, 1.2.about.2.0% by weight of Sn, 0.05.about.0.30% by weight of Mn, 0.01.about.0.1% by weight of P, inevitable impurities and the remainder of Cu.
    Type: Grant
    Filed: September 10, 1987
    Date of Patent: August 2, 1988
    Assignees: Nakasato Limited, Naohiro Igata
    Inventors: Naohiro Igata, Yoshio Nakasato