Patents by Inventor Yoshio Nishimura
Yoshio Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11725104Abstract: A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 ?m or less.Type: GrantFiled: June 30, 2020Date of Patent: August 15, 2023Assignee: AJINOMOTO CO., INC.Inventors: Nana Namekata, Yoshio Nishimura
-
Publication number: 20210002475Abstract: A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 ?m or less.Type: ApplicationFiled: June 30, 2020Publication date: January 7, 2021Applicant: AJINOMOTO CO., INC.Inventors: Nana NAMEKATA, Yoshio NISHIMURA
-
Patent number: 9748195Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.Type: GrantFiled: November 5, 2015Date of Patent: August 29, 2017Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
-
Patent number: 9739000Abstract: A multi-needle sewing machine includes a plurality of needle bars, a needle bar case having a thread supply path along which threads are supplied to needles attached to lower ends of the needle bars respectively, the needle bar case supporting the needle bars, an arm on which the needle bar case is mounted, an embroidery frame located below the needle bar case and configured to hold a workpiece cloth, a projector configured to project an image onto the workpiece cloth from above the embroidery frame, and a support member supporting the projector and configured to be capable of switching the projector between a first position where the image is projectable onto the workpiece cloth and a second position differing from the first position.Type: GrantFiled: December 3, 2014Date of Patent: August 22, 2017Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Akie Shimizu, Yoshio Nishimura, Yutaka Nomura, Yuki Ihira, Manami Ota, Hidenori Oka, Satoru Ichiyanagi
-
Patent number: 9477151Abstract: The present invention provides, as a chemically amplified resist, a well-balanced resist or compound which results in improved sensitivity, resolution and line edge roughness (LER) without impairing the fundamental physical properties required as a resist (e.g., pattern shape, dry etching resistance, heat resistance). A mixture of cycloaliphatic ester compounds represented by general formulae (1) to (3), and a process for preparation thereof, as well as a (meth)acrylic copolymer comprising the cycloaliphatic ester compounds of general formulae (1) to (3) and a photosensitive resin composition thereof are provided.Type: GrantFiled: April 22, 2014Date of Patent: October 25, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Shoichi Hayakawa, Yoshio Nishimura, Kikuo Furukawa, Hiroyasu Tanaka
-
Patent number: 9410274Abstract: A sewing machine includes a detection unit configured to detect a moving direction of an object when the object placed on a sewing machine bed is moved in any direction, a cutting needle having a distal end formed with a blade edge and configured to form a cut in the object, an up-down drive mechanism configured to reciprocate the needle in an up-down direction, a rotational drive mechanism configured to rotate the needle about a rotation axis line of the needle, and a control device configured to control the up-down drive mechanism and the rotational drive mechanism based on a result of detection by the detection unit so that an orientation of the blade edge is changed according to the moving direction of the object and the needle is reciprocated to form the cut in the object with the blade edge being in the changed orientation.Type: GrantFiled: February 11, 2015Date of Patent: August 9, 2016Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Manami Ota, Akie Shimizu, Yoshio Nishimura, Yoshinori Nakamura, Yutaka Nomura, Daisuke Abe, Yuki Ihira
-
Patent number: 9360593Abstract: The polycarbonate resin of the present invention has a structural unit represented by general formula (A): (in formula (A), X is an alkylene group having 1 to 4 carbon atoms).Type: GrantFiled: November 1, 2013Date of Patent: June 7, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hirohito Ishizuka, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Kouji Hirose, Kentarou Ishihara, Munenori Shiratake
-
Patent number: 9321887Abstract: Provided is a thermoplastic resin having a high refractive index, which is favorable as an optical material. Provided are a polyformal resin copolymer comprising a high refractive index diol that has a fluorene skeleton and an aromatic diol that has a low glass-transition point when polymerized, and a method for producing the same.Type: GrantFiled: November 6, 2013Date of Patent: April 26, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Munenori Shiratake, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Hirohito Ishizuka
-
Patent number: 9315932Abstract: A sewing machine includes at least one ultrasonic wave detecting portion, a thickness detecting portion, a processor, and a memory. The at least one ultrasonic wave detecting portion is configured to detect an ultrasonic wave. The thickness detecting portion is configured to detect a thickness of a work cloth. The memory configured to store computer-readable instructions that instruct the sewing machine to execute steps that includes identifying a position, on the work cloth, of a transmission source of the ultrasonic wave, based on information pertaining to the ultrasonic wave that has been detected by the at least one ultrasonic wave detecting portion and on the thickness that has been detected by the thickness detecting portion, and controlling sewing on the work cloth based on the position of the transmission source that has been identified.Type: GrantFiled: March 7, 2013Date of Patent: April 19, 2016Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Daisuke Abe, Satoru Ichiyanagi, Yoshinori Nakamura, Yoshio Nishimura, Akie Shimizu, Yuki Ihira, Satoru Makino
-
Publication number: 20160070168Abstract: The present invention provides, as a chemically amplified resist, a well-balanced resist or compound which results in improved sensitivity, resolution and line edge roughness (LER) without impairing the fundamental physical properties required as a resist (e.g., pattern shape, dry etching resistance, heat resistance). A mixture of cycloaliphatic ester compounds represented by general formulae (1) to (3), and a process for preparation thereof, as well as a (meth)acrylic copolymer comprising the cycloaliphatic ester compounds of general formulae (1) to (3) and a photosensitive resin composition thereof are provided.Type: ApplicationFiled: April 22, 2014Publication date: March 10, 2016Inventors: Shoichi Hayakawa, Yoshio Nishimura, Kikuo Furukawa, Hiroyasu Tanaka
-
Publication number: 20160056120Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.Type: ApplicationFiled: November 5, 2015Publication date: February 25, 2016Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Sayaka WAKIOKA, Hiroaki NAKAGAWA, Yoshio NISHIMURA, Shujiro SADANAGA
-
Patent number: 9209155Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.Type: GrantFiled: August 5, 2013Date of Patent: December 8, 2015Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
-
Publication number: 20150284510Abstract: Provided is a thermoplastic resin having a high refractive index, which is favorable as an optical material. Provided are a polyformal resin copolymer comprising a high refractive index diol that has a fluorene skeleton and an aromatic diol that has a low glass-transition point when polymerized, and a method for producing the same.Type: ApplicationFiled: November 6, 2013Publication date: October 8, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Munenori Shiratake, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Hirohito Ishizuka
-
Publication number: 20150285954Abstract: The polycarbonate resin of the present invention has a structural unit represented by general formula (A): (in formula (A), X is an alkylene group having 1 to 4 carbon atoms).Type: ApplicationFiled: November 1, 2013Publication date: October 8, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hirohito Ishizuka, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Kouji Hirose, Kentarou Ishihara, Munenori Shiratake
-
Publication number: 20150259841Abstract: A sewing machine includes a plurality of types of embroidery frames having respective holding parts holding workpiece cloth, the holding parts having forms differing from one type of embroidery frame to another, a carriage to which one of the embroidery frames is selectively attached, the carriage being configured to transfer the embroidery frame, a projector configured to project an image onto the workpiece cloth, a detector configured to detect a type of the embroidery frame attached to the carriage, a storage unit configured to store frame information set for every type of embroidery frame, a setting unit configured to read the frame information according to result of detection by the detector and to set a projection region for an image to be projected, based on the frame information, and a control unit configured to control the projector so that the projector projects the image onto the set projection region.Type: ApplicationFiled: March 12, 2015Publication date: September 17, 2015Inventors: Yuki IHIRA, Daisuke ABE, Yoshinori NAKAMURA, Hidenori OKA, Satoru ICHIYANAGI, Yoshio NISHIMURA, Manami OTA
-
Patent number: 9133572Abstract: A sewing machine that includes a processor, a plurality of detection devices that is configured to be capable of changing mounting positions and configured to detect an ultrasonic wave, and a memory that is configured to store computer-readable instructions that instruct the sewing machine to execute steps comprising, identifying, when a first ultrasonic wave transmitted from a transmission source of the ultrasonic wave is detected by the detection devices, a position of the transmission source of the first ultrasonic wave, based on information relating to the detected first ultrasonic wave, and controlling sewing based on the identified position of the transmission source of the first ultrasonic wave.Type: GrantFiled: March 7, 2013Date of Patent: September 15, 2015Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Yoshio Nishimura, Satoru Makino, Yoshinori Nakamura, Yutaka Nomura, Akie Shimizu, Yuki Ihira, Daisuke Abe
-
Patent number: 9127384Abstract: A sewing machine includes a bed, a sewing device, a projection portion, an item detection portion, and a control portion. The sewing device includes a needle bar and a feed portion that moves a work cloth. The projection portion projects, onto at least one of the bed and the work cloth, a projected image that includes at least one operation item that indicates an operation of the sewing device. The item detection portion detects whether a user's finger has touched a location, on the at least one of the bed and the work cloth onto which the at least one operation item is being projected by the projection portion, where one of the at least one operation item is being projected. The control portion operates the sewing device in accordance with the operation item that has been detected by the item detection portion.Type: GrantFiled: September 12, 2013Date of Patent: September 8, 2015Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventors: Satoru Ichiyanagi, Yutaka Nomura, Yoshio Nishimura, Yoshinori Nakamura, Akie Shimizu, Daisuke Abe, Yuki Ihira
-
Publication number: 20150233032Abstract: A sewing machine includes a detection unit configured to detect a moving direction of an object to be processed when the object placed on a sewing machine bed is moved in any direction, a cutting needle having a distal end formed with a blade edge and configured to form a cut in the object, an up-down drive mechanism configured to reciprocate the cutting needle in an up-down direction, a rotational drive mechanism configured to rotate the cutting needle about a rotation axis line of the cutting needle, and a control device configured to control the up-down drive mechanism and the rotational drive mechanism based on a result of detection by the detection unit so that the cutting needle forms the cut in the object while changing an orientation of the blade edge according to the moving direction of the object.Type: ApplicationFiled: February 11, 2015Publication date: August 20, 2015Inventors: Manami OTA, Akie SHIMIZU, Yoshio NISHIMURA, Yoshinori NAKAMURA, Yutaka NOMURA, Daisuke ABE, Yuki IHIRA
-
Publication number: 20150184321Abstract: A multi-needle sewing machine includes a plurality of needle bars, a needle bar case having a thread supply path along which threads are supplied to needles attached to lower ends of the needle bars respectively, the needle bar case supporting the needle bars, an arm on which the needle bar case is mounted, an embroidery frame located below the needle bar case and configured to hold a workpiece cloth, a projector configured to project an image onto the workpiece cloth from above the embroidery frame, and a support member supporting the projector and configured to be capable of switching the projector between a first position where the image is projectable onto the workpiece cloth and a second position differing from the first position.Type: ApplicationFiled: December 3, 2014Publication date: July 2, 2015Inventors: Akie SHIMIZU, Yoshio NISHIMURA, Yutaka NOMURA, Yuki IHIRA, Manami OTA, Hidenori OKA, Satoru ICHIYANAGI
-
Patent number: 9051256Abstract: The present invention can provide a process for producing a hydroxy adamantane carboxylic acid compound represented by the above formula (2), which comprises (i) reacting an adamantane compound represented by the above formula (1) with carbon monoxide or with a carbon monoxide source in a proton acid solution prepared at a concentration of 90% by mass or more to thereby cause carboxylation of the OX group(s), and then (ii) adding an oxidizing agent to the reaction mixture to cause oxidation of the bridgehead C—H bond to thereby generate a hydroxyl group.Type: GrantFiled: July 11, 2014Date of Patent: June 9, 2015Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Hiroyasu Tanaka, Yoshio Nishimura, Kikuo Furukawa, Shoichi Hayakawa