Patents by Inventor Yoshio Nishimura

Yoshio Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11725104
    Abstract: A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 ?m or less.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: August 15, 2023
    Assignee: AJINOMOTO CO., INC.
    Inventors: Nana Namekata, Yoshio Nishimura
  • Publication number: 20210002475
    Abstract: A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 ?m or less.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Applicant: AJINOMOTO CO., INC.
    Inventors: Nana NAMEKATA, Yoshio NISHIMURA
  • Patent number: 9748195
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: August 29, 2017
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
  • Patent number: 9739000
    Abstract: A multi-needle sewing machine includes a plurality of needle bars, a needle bar case having a thread supply path along which threads are supplied to needles attached to lower ends of the needle bars respectively, the needle bar case supporting the needle bars, an arm on which the needle bar case is mounted, an embroidery frame located below the needle bar case and configured to hold a workpiece cloth, a projector configured to project an image onto the workpiece cloth from above the embroidery frame, and a support member supporting the projector and configured to be capable of switching the projector between a first position where the image is projectable onto the workpiece cloth and a second position differing from the first position.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: August 22, 2017
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Akie Shimizu, Yoshio Nishimura, Yutaka Nomura, Yuki Ihira, Manami Ota, Hidenori Oka, Satoru Ichiyanagi
  • Patent number: 9477151
    Abstract: The present invention provides, as a chemically amplified resist, a well-balanced resist or compound which results in improved sensitivity, resolution and line edge roughness (LER) without impairing the fundamental physical properties required as a resist (e.g., pattern shape, dry etching resistance, heat resistance). A mixture of cycloaliphatic ester compounds represented by general formulae (1) to (3), and a process for preparation thereof, as well as a (meth)acrylic copolymer comprising the cycloaliphatic ester compounds of general formulae (1) to (3) and a photosensitive resin composition thereof are provided.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: October 25, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shoichi Hayakawa, Yoshio Nishimura, Kikuo Furukawa, Hiroyasu Tanaka
  • Patent number: 9410274
    Abstract: A sewing machine includes a detection unit configured to detect a moving direction of an object when the object placed on a sewing machine bed is moved in any direction, a cutting needle having a distal end formed with a blade edge and configured to form a cut in the object, an up-down drive mechanism configured to reciprocate the needle in an up-down direction, a rotational drive mechanism configured to rotate the needle about a rotation axis line of the needle, and a control device configured to control the up-down drive mechanism and the rotational drive mechanism based on a result of detection by the detection unit so that an orientation of the blade edge is changed according to the moving direction of the object and the needle is reciprocated to form the cut in the object with the blade edge being in the changed orientation.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: August 9, 2016
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Manami Ota, Akie Shimizu, Yoshio Nishimura, Yoshinori Nakamura, Yutaka Nomura, Daisuke Abe, Yuki Ihira
  • Patent number: 9360593
    Abstract: The polycarbonate resin of the present invention has a structural unit represented by general formula (A): (in formula (A), X is an alkylene group having 1 to 4 carbon atoms).
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: June 7, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hirohito Ishizuka, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Kouji Hirose, Kentarou Ishihara, Munenori Shiratake
  • Patent number: 9321887
    Abstract: Provided is a thermoplastic resin having a high refractive index, which is favorable as an optical material. Provided are a polyformal resin copolymer comprising a high refractive index diol that has a fluorene skeleton and an aromatic diol that has a low glass-transition point when polymerized, and a method for producing the same.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: April 26, 2016
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Munenori Shiratake, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Hirohito Ishizuka
  • Patent number: 9315932
    Abstract: A sewing machine includes at least one ultrasonic wave detecting portion, a thickness detecting portion, a processor, and a memory. The at least one ultrasonic wave detecting portion is configured to detect an ultrasonic wave. The thickness detecting portion is configured to detect a thickness of a work cloth. The memory configured to store computer-readable instructions that instruct the sewing machine to execute steps that includes identifying a position, on the work cloth, of a transmission source of the ultrasonic wave, based on information pertaining to the ultrasonic wave that has been detected by the at least one ultrasonic wave detecting portion and on the thickness that has been detected by the thickness detecting portion, and controlling sewing on the work cloth based on the position of the transmission source that has been identified.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: April 19, 2016
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Daisuke Abe, Satoru Ichiyanagi, Yoshinori Nakamura, Yoshio Nishimura, Akie Shimizu, Yuki Ihira, Satoru Makino
  • Publication number: 20160070168
    Abstract: The present invention provides, as a chemically amplified resist, a well-balanced resist or compound which results in improved sensitivity, resolution and line edge roughness (LER) without impairing the fundamental physical properties required as a resist (e.g., pattern shape, dry etching resistance, heat resistance). A mixture of cycloaliphatic ester compounds represented by general formulae (1) to (3), and a process for preparation thereof, as well as a (meth)acrylic copolymer comprising the cycloaliphatic ester compounds of general formulae (1) to (3) and a photosensitive resin composition thereof are provided.
    Type: Application
    Filed: April 22, 2014
    Publication date: March 10, 2016
    Inventors: Shoichi Hayakawa, Yoshio Nishimura, Kikuo Furukawa, Hiroyasu Tanaka
  • Publication number: 20160056120
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Application
    Filed: November 5, 2015
    Publication date: February 25, 2016
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka WAKIOKA, Hiroaki NAKAGAWA, Yoshio NISHIMURA, Shujiro SADANAGA
  • Patent number: 9209155
    Abstract: The present invention aims to provide a method for producing a semiconductor device, the method being capable of achieving high reliability by suppressing voids. The present invention also aims to provide a flip-chip mounting adhesive for use in the method for producing a semiconductor device. The present invention relates to a method for producing a semiconductor device, including: step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder; step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and step 3 of removing voids by heating the adhesive under a pressurized atmosphere, wherein the adhesive has an activation energy ?E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260° C.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: December 8, 2015
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Sayaka Wakioka, Hiroaki Nakagawa, Yoshio Nishimura, Shujiro Sadanaga
  • Publication number: 20150284510
    Abstract: Provided is a thermoplastic resin having a high refractive index, which is favorable as an optical material. Provided are a polyformal resin copolymer comprising a high refractive index diol that has a fluorene skeleton and an aromatic diol that has a low glass-transition point when polymerized, and a method for producing the same.
    Type: Application
    Filed: November 6, 2013
    Publication date: October 8, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Munenori Shiratake, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Hirohito Ishizuka
  • Publication number: 20150285954
    Abstract: The polycarbonate resin of the present invention has a structural unit represented by general formula (A): (in formula (A), X is an alkylene group having 1 to 4 carbon atoms).
    Type: Application
    Filed: November 1, 2013
    Publication date: October 8, 2015
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Hirohito Ishizuka, Yoshio Nishimura, Noriyuki Kato, Takashi Ishii, Kouji Hirose, Kentarou Ishihara, Munenori Shiratake
  • Publication number: 20150259841
    Abstract: A sewing machine includes a plurality of types of embroidery frames having respective holding parts holding workpiece cloth, the holding parts having forms differing from one type of embroidery frame to another, a carriage to which one of the embroidery frames is selectively attached, the carriage being configured to transfer the embroidery frame, a projector configured to project an image onto the workpiece cloth, a detector configured to detect a type of the embroidery frame attached to the carriage, a storage unit configured to store frame information set for every type of embroidery frame, a setting unit configured to read the frame information according to result of detection by the detector and to set a projection region for an image to be projected, based on the frame information, and a control unit configured to control the projector so that the projector projects the image onto the set projection region.
    Type: Application
    Filed: March 12, 2015
    Publication date: September 17, 2015
    Inventors: Yuki IHIRA, Daisuke ABE, Yoshinori NAKAMURA, Hidenori OKA, Satoru ICHIYANAGI, Yoshio NISHIMURA, Manami OTA
  • Patent number: 9133572
    Abstract: A sewing machine that includes a processor, a plurality of detection devices that is configured to be capable of changing mounting positions and configured to detect an ultrasonic wave, and a memory that is configured to store computer-readable instructions that instruct the sewing machine to execute steps comprising, identifying, when a first ultrasonic wave transmitted from a transmission source of the ultrasonic wave is detected by the detection devices, a position of the transmission source of the first ultrasonic wave, based on information relating to the detected first ultrasonic wave, and controlling sewing based on the identified position of the transmission source of the first ultrasonic wave.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 15, 2015
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Yoshio Nishimura, Satoru Makino, Yoshinori Nakamura, Yutaka Nomura, Akie Shimizu, Yuki Ihira, Daisuke Abe
  • Patent number: 9127384
    Abstract: A sewing machine includes a bed, a sewing device, a projection portion, an item detection portion, and a control portion. The sewing device includes a needle bar and a feed portion that moves a work cloth. The projection portion projects, onto at least one of the bed and the work cloth, a projected image that includes at least one operation item that indicates an operation of the sewing device. The item detection portion detects whether a user's finger has touched a location, on the at least one of the bed and the work cloth onto which the at least one operation item is being projected by the projection portion, where one of the at least one operation item is being projected. The control portion operates the sewing device in accordance with the operation item that has been detected by the item detection portion.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: September 8, 2015
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Satoru Ichiyanagi, Yutaka Nomura, Yoshio Nishimura, Yoshinori Nakamura, Akie Shimizu, Daisuke Abe, Yuki Ihira
  • Publication number: 20150233032
    Abstract: A sewing machine includes a detection unit configured to detect a moving direction of an object to be processed when the object placed on a sewing machine bed is moved in any direction, a cutting needle having a distal end formed with a blade edge and configured to form a cut in the object, an up-down drive mechanism configured to reciprocate the cutting needle in an up-down direction, a rotational drive mechanism configured to rotate the cutting needle about a rotation axis line of the cutting needle, and a control device configured to control the up-down drive mechanism and the rotational drive mechanism based on a result of detection by the detection unit so that the cutting needle forms the cut in the object while changing an orientation of the blade edge according to the moving direction of the object.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 20, 2015
    Inventors: Manami OTA, Akie SHIMIZU, Yoshio NISHIMURA, Yoshinori NAKAMURA, Yutaka NOMURA, Daisuke ABE, Yuki IHIRA
  • Publication number: 20150184321
    Abstract: A multi-needle sewing machine includes a plurality of needle bars, a needle bar case having a thread supply path along which threads are supplied to needles attached to lower ends of the needle bars respectively, the needle bar case supporting the needle bars, an arm on which the needle bar case is mounted, an embroidery frame located below the needle bar case and configured to hold a workpiece cloth, a projector configured to project an image onto the workpiece cloth from above the embroidery frame, and a support member supporting the projector and configured to be capable of switching the projector between a first position where the image is projectable onto the workpiece cloth and a second position differing from the first position.
    Type: Application
    Filed: December 3, 2014
    Publication date: July 2, 2015
    Inventors: Akie SHIMIZU, Yoshio NISHIMURA, Yutaka NOMURA, Yuki IHIRA, Manami OTA, Hidenori OKA, Satoru ICHIYANAGI
  • Patent number: 9051256
    Abstract: The present invention can provide a process for producing a hydroxy adamantane carboxylic acid compound represented by the above formula (2), which comprises (i) reacting an adamantane compound represented by the above formula (1) with carbon monoxide or with a carbon monoxide source in a proton acid solution prepared at a concentration of 90% by mass or more to thereby cause carboxylation of the OX group(s), and then (ii) adding an oxidizing agent to the reaction mixture to cause oxidation of the bridgehead C—H bond to thereby generate a hydroxyl group.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: June 9, 2015
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroyasu Tanaka, Yoshio Nishimura, Kikuo Furukawa, Shoichi Hayakawa