Abstract: An information-processing apparatus for document editing. The apparatus has multiple editors for editing documents according to the individual document type. An editing operation interlocking work identifier analyzes the meaning of a work corresponding to a give editing operation on a document. Editing operations for the documents, and information about associated works, are defined in an editing operation interlocking work correlating table. The associated work is done in parallel with, or later than, an editing operation for the document. The editing operation interlocking work identifier refers to the correlating table. A process starting controller refers to an interlocking work starting process correlating table in which information about the associated works and starting processes are defined.

Abstract: A device for aiding a software designing process in which software is divided into a plurality of tasks includes a dynamic-specification-information editing unit for defining dynamic behaviors between the tasks to create a dynamic specification, a static-specification-information editing unit for defining static configurations between the tasks to create a static specification, and an editing-unit-coordination controlling unit for coordinating operations of the dynamic-specification-information editing unit and the static-specification-information editing unit.

Abstract: A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole.

Abstract: A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.

Abstract: A printed-wiring board shielded from electromagnetic wave radiation is made by forming a conductive circuit pattern on an insulating substrate, disposing a first insulating layer over the circuit pattern, forming a jumper wire over the first insulating layer and between connecting terminals of the conductive pattern, forming a second insulating layer covering the jumper wire and the first insulating layer, and disposing an electromagnetic wave shielding layer over the conductive pattern. The jumper wire is formed by a printing process using a conductive paste containing a conductive metal such as silver, carbon or copper. The shield layer is formed by a printing process using a conductive metal resin paste such as copper. The shield layer is protected by providing an overcoat layer over the shield layer.

Abstract: A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method comprises steps of providing a substrate for the printed circuit board, forming circuit patterns on one or both sides of the substrate, and shielding the whole or a required part of the circuit patterns by using a shield layer in such a manner that the shield layer and a grounding circuit of the circuit patterns are connected through a resistor. This method of manufacturing a printed circuit board is improved so that adhesion between the shield layer and the junction land of the grounding circuit is enhanced by the joining of the shield layer to the junction land of the grounding circuit through the resistor, and that the noise preventive action of the shield layer is improved by the attenuating of electromagnetic-wave energy received by the shield layer which is to be discharged as electrical current to the grounding circuit.