Patents by Inventor Yoshio Oka

Yoshio Oka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4946193
    Abstract: Utility vehicles having four wheels, one or more seats, a steering column and a forward mounting power unit. The devices are shown to be either two of four wheel drive. Extending from behind the rear wheels to a position behind the steering column, a flat floor provides substantial storage area. When two seats are employed, the driver seat is displaced to one side of the vehicle and racks extend fore-and-aft in the same plane. The passenger's seat back may be lowered to further define that plane. The engine is mounted directly between the front wheels for compactness and protection.
    Type: Grant
    Filed: December 14, 1988
    Date of Patent: August 7, 1990
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Yoshio Oka
  • Patent number: 4574652
    Abstract: An improved transmission in a motor vehicle including a body, an engine located in the vicinity of the center of the body, a pair of footrests attached to the body near the engine, and front and rear wheels. The transmission is integral with the engine and has a casing, a shift spindle having one end projecting from the casing and rotatable for shifting the transmission, and a control lever coupled to the shift spindle. According to the improvement, a cam means is interposed between the control lever and the casing for limiting shifting operation of the control lever. The cam means comprises a cam member having a cam surface and fixed to the casing, a shaft member axially slidably fitted in the control lever and having a control knob on a first end thereof, and a spring disposed between the shaft member and the control lever for urging the shaft member to cause a second end of the shaft member to abut against the cam surface of the cam member.
    Type: Grant
    Filed: August 9, 1984
    Date of Patent: March 11, 1986
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Takashi Shichinohe, Masahiro Imaizumi, Ryoichi Ikejima, Yoshio Oka
  • Patent number: 4147432
    Abstract: This invention relates to an apparatus for thermal diffusion by means of high frequency induction heating suitable for mass production of semiconductor substrates of uniform quality; wherein a plurality of heating bases, each made of a material having good electric conductivity, and carrying semiconductor substrates, are continuously fed through a furnace tube where the bases are heated by means of high frequency wave excitation in order that each semiconductor substrate receives substantially the same thermal treatment.
    Type: Grant
    Filed: November 22, 1976
    Date of Patent: April 3, 1979
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masao Yamawaki, Katsuo Aoki, Yoshio Oka, Takao Suzuki, Masahiko Amano, Hideki Ozaki, Osamu Ishihara
  • Patent number: 4096822
    Abstract: A gaseous atmosphere control apparatus for heat-treating semiconductors in a uniform gaseous atmosphere condition is disclosed. The control apparatus is provided with a reaction pipe through which semiconductor wafers are transferred to be heat-treated. A gas distribution pipe is fixed to the inside wall of the reaction pipe for guiding the transfer of the wafers and supplying heat-treating gas in the reaction pipe. The distribution pipe is provided with a plurality of blow-off holes, the diameter thereof being made wider as the pipe extends longitudinally, to thereby control the gaseous atmosphere condition in the reaction pipe to be uniform.
    Type: Grant
    Filed: September 29, 1976
    Date of Patent: June 27, 1978
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masao Yamawaki, Katsuo Aoki, Yoshio Oka, Takao Suzuki, Osamu Ina, Kunihiko Hara
  • Patent number: 4075972
    Abstract: The invention discloses an apparatus for thermal diffusion of semiconductor devices, wherein a plurality of wafer boats each made of a refractory material and adapted to carry a predetermined number of wafers to be processed are sequentially fed into a furnace tube containing a high temperature, diffusion gas atmosphere and continuously transported at a predetermined speed through the furnace tube so that each wafer may have substantially the same thermal treatment and high productivity may be attained.
    Type: Grant
    Filed: August 16, 1976
    Date of Patent: February 28, 1978
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masao Yamawaki, Katsuo Aoki, Osamu Ina, Takao Suzuki, Yoshio Oka, Kunihiko Hara
  • Patent number: 4069009
    Abstract: An apparatus for automatically transferring semiconductor wafers is disclosed. Semiconductor wafers are loaded on a boat which is placed on a pair of first supporting bars. A pair of second supporting bars are driven by a motor to repeat circular motion between the first supporting bars. The second supporting bars, circularly moving in parallel with the first supporting bars, forwardly transfer the boat. The boat is kept uplifted over the first supporting bars during the forward transfer thereof. Repetition of the circular motion of the second supporting bars makes the automatic transfer of the semiconductor wafers to be heat-treated in a semiconductor manufacturing system.
    Type: Grant
    Filed: October 8, 1976
    Date of Patent: January 17, 1978
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masao Yamawaki, Katsuo Aoki, Yoshio Oka, Takao Suzuki, Osamu Ina, Kinihiko Hara
  • Patent number: D285644
    Type: Grant
    Filed: October 27, 1983
    Date of Patent: September 16, 1986
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Jyoji Kitakaze, Yoshio Oka