Abstract: The resistance of an air-fuel-ratio sensor element is determined from current detected before changing an applied voltage to the sensor and current detected when a predetermined period elapses after changing the applied voltage to the sensor. A resistence detector includes operational amplifiers, resistors and transistors. The applied voltage is changed by switching the transistors to more accurately detect a resistance value.

Abstract: An indium layer and a copper layer, and whenever necessary, a gallium layer or a gallium-alloy layer, are laminated on an electrode film formed on one of the surfaces of a substrate to form a metallic film. The metallic film is then subjected to sulfurization treatment or selenization treatment to form a p-type semiconductor layer made of “CuInS2 or CuInSe2” or “Cu(In, Ga)S2 or Cu(In, Ga)Se2”. This p-type semiconductor layer is subjected to KCN treatment, for removing impurities such as copper sulfide, copper selenide, etc., by a KCN solution, and an n-type semiconductor layer is formed on this p-type semiconductor layer to form a solar cell. In this instance, the indium layer is formed under heating, or is heat-treated by heat-treatment while the surface of the indium layer is exposed.

Abstract: A resistance component of a sensor element for an air-fuel-ratio sensor is determined from a sensor current detected before changing an applied voltage to the sensor and a sensor current detected when a predetermined period elapses after changing the applied voltage to the sensor. A resistance component detecting apparatus includes operational amplifiers, resistors and transistors. The applied voltage is changed by switching the transistors. Accordingly, the resistance component of the sensor element is detected accurately.

Abstract: A method of fabricating a superconducting quantum interference device (DC-SQUID) constructed from short weak links with untrafine wires. The method comprises the following steps: successive forming a niobium nitride film and a silicon nitride film on a substrate; oblique etching of the niobium nitride film and said silicon nitride film with respect to the substrate by a reactive ion etching process using a mixture of oxygen and CF.sub.4 gases to form an olique edge; and successive forming a barrier thin film and a counterelectrode of niobium on the said edge. The short weak links wire fabricated by field evaporation technique. The counterelectrode material were field-evaporated and formed the conductive paths in the pinholes in the insulating thin film.

Abstract: A method of fabricating a superconducting quantum interference device (DC-SQUID) constructed from short weak links with untrafine wires. The method comprises the following steps: successive forming a niobium nitride film and a silicon nitride film on a substrate; oblique etching of the niobium nitride film and said silicon nitride film with respect to the substrate by a reactive ion etching process using a mixture of oxygen and CF.sub.4 gases to form an olique edge; and successive forming a barrier thin film and a counterelectrode of niobium on the said edge. The short weak links wire fabricated by field evaporation technique. The counterelectrode material were field-evaporated and formed the conductive paths in the pinholes in the insulating thin film.