Abstract: The present invention provides a semi-conductive polyimide film having: a common logarithm of a surface resistivity at 25° C. and 60% RH of 9 to 15 log ?/square; a common logarithm of a volume resistivity of 8 to 15 log ?·cm; a fatigue stress in accordance with a fatigue test complying with JIS K7118, upon a number of repetition being 107, of 160 MPa or more; and a number of durable bending in accordance with an MIT test complying with JIS P8115 of 2,000 times or more, and an intermediate transfer belt and an transfer transportation belt using the semi-conductive polyimide film.

Abstract: The present invention provides a semi-conductive polyimide film having: a common logarithm of a surface resistivity at 25° C. and 60% RH of 9 to 15 log ?/square; a common logarithm of a volume resistivity of 8 to 15 log ?·cm; a fatigue stress in accordance with a fatigue test complying with JIS K7118, upon a number of repetition being 107, of 160 MPa or more; and a number of durable bending in accordance with an MIT test complying with JIS P8115 of 2,000 times or more, and an intermediate transfer belt and an transfer transportation belt using the semi-conductive polyimide film.

Abstract: The present invention provides a release sheet and a pressure-sensitive adhesive sheet superior to a release sheet using a conventional ethylene polymer in peeling property. Specifically, in an ethylene polymer to be used for a release sheet for a pressure-sensitive adhesive sheet, (i) the spin-spin relaxation time (T2) of proton of the amorphous region and the ratio of the amorphous region calculated from the relaxation time (T2) are adjusted to certain ranges, or (ii) the bearing ratios obtained by measuring the surface of a release sheet containing the ethylene polymer with an atomic force microscope is adjusted to a certain range.