Patents by Inventor Yoshio Oshima

Yoshio Oshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5226132
    Abstract: Instead of translation from a space address to a segment table origin address (STO) by an ordinary instruction, translation to the STO is done by a space base register modify instruction which uses an instruction to modify the content of the space register, and the result thereof is used for the operand address calculation of the instruction to the operand data fetching. The present system eliminates the need for additionally providing for hardware of an operand fetch unit hardware for the translation from the space address to the STO, memory for storing translation pairs of the space addresses and the STO's and the table look-up of the translation pairs. Thus, degradation of performance is minimized with less hardware.
    Type: Grant
    Filed: September 27, 1989
    Date of Patent: July 6, 1993
    Assignees: Hitachi, Ltd., Hitachi Computer Engineering Co., Ltd.
    Inventors: Michitaka Yamamoto, Toshinori Kuwabara, Yoshio Oshima, Yasutaka Yamada
  • Patent number: 5210844
    Abstract: An information processing apparatus having at least one processor and a main storage, accessed by the processor, and capable of providing a plurality of logical information processing apparatus by logically partitioning the information processing apparatus. The information processing apparatus includes a main storage partitioned into a plurality of memory areas, each of the memory areas corresponding to one of the plurality of logical information processing apparatus. The information processing apparatus further includes a first storage unit for storing identification information for each of the memory areas identifying the logical information processing apparatus allocated to each memory and a read unit for reading the identification information from the first storage unit when the main storage is to be accessed by one of the plurality of logical information processing apparatus. Each of the plurality of logical information processing apparatus possesses a unique identification information.
    Type: Grant
    Filed: September 26, 1989
    Date of Patent: May 11, 1993
    Assignees: Hitachi, Ltd., Hitachi Computer Engineering Co., Ltd.
    Inventors: Nobuyuki Shimura, Kazuo Hibi, Yoshio Oshima
  • Patent number: 5176310
    Abstract: The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: January 5, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Yukiharu Akiyama, Yoshio Oshima
  • Patent number: 5110032
    Abstract: The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
    Type: Grant
    Filed: April 29, 1991
    Date of Patent: May 5, 1992
    Assignee: Hitachi, Ltd.,
    Inventors: Yukiharu Akiyama, Yoshio Oshima
  • Patent number: 5060841
    Abstract: A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.
    Type: Grant
    Filed: October 2, 1990
    Date of Patent: October 29, 1991
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.
    Inventors: Yoshio Oshima, Yasushi Ishii, Hideki Hidaka, Kunihiro Tsuchiya
  • Patent number: 5037023
    Abstract: The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: August 6, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Yukiharu Akiyama, Yoshio Oshima
  • Patent number: 4677583
    Abstract: An apparatus for decimal multiplication divides a multiplier of binary coded decimal (BCD) into plural groups, generates plural partial products of which are multiplied a multiplicand of BCD and the plural groups of multiplier over successive cycles and adds them to an intermediate product which is a summation of the previously generated partial products. The addition of the partial product and the intermediate product is made by a carry save adder. At a first cycle, the intermediate product is set to zero, and the addition of 6 is made to each digit of either one of the intermediate product sum and the partial product, and the addition of the partial product and the intermediate product is made by a carry save adder loop over successive cycles.
    Type: Grant
    Filed: June 27, 1984
    Date of Patent: June 30, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Toru Ohtsuki, Yoshio Oshima, Sako Ishikawa, Hideaki Yabe, Masaharu Fukuta
  • Patent number: 4635220
    Abstract: A binary coded decimal number division apparatus in which a quotient represented in a binary coded decimal notation is determined on digit-by-digit basis by using a quotient prediction table and a group of multiple value registers and in which a predicted quotient read out from the quotient prediction table is used intact when the predicted quotient is correct while otherwise the predicted quotient is decremented by one, wherein the values stored in the quotient prediction table together with redundant bit are previously modified to (0110).sub.2 to (1111).sub.2 in the binary coded decimal representation. The multiple value register is selected by using three of the four bits of the modified predicted quotient, while upon determination of the quotient, the value used for modification is subtracted from the output value of the quotient prediction table to thereby derive the predicted quotient of one digit.
    Type: Grant
    Filed: November 8, 1983
    Date of Patent: January 6, 1987
    Assignee: Hitachi, Ltd.
    Inventors: Hideaki Yabe, Yoshio Oshima, Sako Ishikawa, Toru Ohtsuki, Masaharu Fukuta
  • Patent number: 4603397
    Abstract: In preparation of addresses of a quotient prediction table used in a binary coded decimal number division scheme with predetermined bits of a dividend and a divisor in binary coded decimal representation, the addresses are modified with the redundant bits. The absolute bit number for the addresses is thus decreased, whereby data quantity and hence capacity of RAM required for implementing the quotient prediction table can be significantly reduced, while satisfactory function of the quotient prediction table being assured. The apparatus for the binary coded decimal number division is implemented inexpensively in a small size.
    Type: Grant
    Filed: January 31, 1983
    Date of Patent: July 29, 1986
    Assignee: Hitachi, Ltd.
    Inventors: Toru Ohtsuki, Yoshio Oshima, Sako Ishikawa, Masaharu Fukuta
  • Patent number: 4543641
    Abstract: A multiplier device comprising hold means for holding the result of addition, block product means for producing k block products each having 2n bits, where n is an integer equal to or greater than 2, the k block products being formed by multiplying each block by n bits, k blocks being obtained by dividing a multiplicand at intervals of n bits from the least significant bit of the multiplicand, and adder means for adding two groups of block products to the output of the hold means, the two groups of block products consisting of alternate block products out of the k block products from the block product means.
    Type: Grant
    Filed: January 26, 1983
    Date of Patent: September 24, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Masaharu Fukuta, Yoshio Oshima, Sako Ishikawa, Toru Ohtsuki