Patents by Inventor Yoshio Toyoda

Yoshio Toyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin tablet for sealing semiconductor
    Patent number: 5698152
    Abstract: A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: December 16, 1997
    Assignee: Nitto Denko Corporation
    Inventors: Tomohiro Taruno, Yoshio Toyoda, Hirofumi Ohno, Shoichi Kimura, Hiroyuki Asao, Shinichi Kanai
  • Process for producing semiconductor devices using resin tablets
    Patent number: 5645787
    Abstract: A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 8, 1997
    Assignee: Nitto Denko Corporation
    Inventors: Tomohiro Taruno, Shinichi Kanai, Hiroyuki Asao, Syoichi Kimura, Yoshio Toyoda