Patents by Inventor Yoshio UEYAMA

Yoshio UEYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for heat press molding, wooden board, and manufacturing methods thereof
    Patent number: 11572491
    Abstract: An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: February 7, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shigeki Naito, Yoshio Ueyama
  • ADHESIVE FOR HEAT PRESS MOLDING, WOODEN BOARD, AND MANUFACTURING METHODS THEREOF
    Publication number: 20200190366
    Abstract: An adhesive for heat press molding contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.
    Type: Application
    Filed: February 15, 2018
    Publication date: June 18, 2020
    Inventors: Shigeki NAITO, Yoshio UEYAMA