Patents by Inventor Yoshio Zenshi

Yoshio Zenshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting an electronic part onto a printed circuit board
    Patent number: 5180097
    Abstract: In a method of mounting an electronic component onto a printed circuit board by reflow mounting, the electronic component having a plurality of connection leads protruding from the component, a plurality of strips of solder are applied on a group of pads arranged in a line on the printed circuit board. The pads are disposed on the circuit in correspondence to the connection leads, and the connection leads of the electronic component are bonded to the corresponding pads by reflow soldering. By applying solder in strips, their widths need not be excessive, thereby avoiding solder bridging.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: January 19, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshio Zenshi