Patents by Inventor Yoshiro Hakamada

Yoshiro Hakamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7700882
    Abstract: The cable device includes a signal line portion electrically connecting an electronic circuit board having an electronic circuit operating at a clock signal having a high frequency with the other electronic circuit board. The cable device further includes a shield portion shielding the signal line portion having a plurality of through-holes located at intervals in the length direction of the signal line portion such that the shield portion includes a plurality of length portions differing in length from the signal line portion.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: April 20, 2010
    Assignee: Sony Corporation
    Inventor: Yoshiro Hakamada
  • Publication number: 20080029299
    Abstract: Disclosed is a cable device including a signal line portion electrically connecting an electronic circuit board having an electronic circuit operating at a clock signal having a high frequency with the other electronic circuit board. The cable device further includes a shield portion shielding the signal line portion having a plurality of through-holes located at intervals in the length direction of the signal line portion such that the shield portion includes a plurality of length portions differing in length from the signal line portion.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 7, 2008
    Applicant: Sony Corporation
    Inventor: Yoshiro Hakamada
  • Patent number: 5521626
    Abstract: A fusion-type thermal transfer printing system using an ink ribbon having a thin film and a heat fusible ink applied on the thin film at an ink application rate of 2.5 g/m.sup.2 or less and a porous-surface recording medium having a substrate and a porous-surface layer formed on the substrate, diameters of pores in the porous-surface layer being from 1 to 10 .mu.m. The printing system has a thermal head provided with a plurality of heating resistors formed in a line at regular intervals of 8 dot/mm or less, temperature gradient of each of the heated heating resistors being such that temperature is the highest at a middle portion thereof and changes decreasingly toward ends thereof and a gradation control circuit for controlling ink fusion areas heated by the heating resistors by controlling intensity of current passed through the thermal head.
    Type: Grant
    Filed: October 12, 1993
    Date of Patent: May 28, 1996
    Assignee: Victor Company of Japan, Ltd.
    Inventors: Hideshi Tanaka, Yoshiro Hakamada