Patents by Inventor Yoshiro Ishii

Yoshiro Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10059932
    Abstract: An object is to provide a mutant of a cellulase-producing microorganism which produces a cellulase capable of preferentially producing a cello-oligosaccharide during the selective production of the cello-oligosaccharide through enzymolysis of a cellulosic material in the presence of the cellulase, a method for producing the cellulase and a method for producing a cello-oligosaccharide using the cellulase. The present invention relates to a mutant of a cellulase-producing microorganism, in which cellobiohydrolase and ?-glucosidase genes are disrupted.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: August 28, 2018
    Assignees: NAGAOKA UNIVERSITY OF TECHNOLOGY, INPEX CORPORATION
    Inventors: Wataru Ogasawara, Takashi Yamaguchi, Yosuke Shida, Yoshiro Ishii, Tatsuki Wakayama, Yoshiro Konda
  • Publication number: 20160046918
    Abstract: An object is to provide a mutant of a cellulase-producing microorganism which produces a cellulase capable of preferentially producing a cello-oligosaccharide during the selective production of the cello-oligosaccharide through enzymolysis of a cellulosic material in the presence of the cellulase, a method for producing the cellulase and a method for producing a cello-oligosaccharide using the cellulase. The present invention relates to a mutant of a cellulase-producing microorganism, in which cellobiohydrolase and ?-glucosidase genes are disrupted.
    Type: Application
    Filed: March 14, 2014
    Publication date: February 18, 2016
    Inventors: Wataru OGASAWARA, Takashi YAMAGUCHI, Yosuke SHIDA, Yoshiro ISHII, Tatsuki WAKAYAMA, Yoshiro KONDA
  • Patent number: 6875519
    Abstract: A two-layer copper polyimide substrate includes a modified layer on the surface of a polyimide film having a thickness of not more than 200 ?, and preferably not less than 50 ?, as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM). A metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, providing a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: April 5, 2005
    Assignee: Sumitomo Metal Mining Co., Ltd.
    Inventors: Noriyuki Saeki, Takefumi Sakou, Hiroto Watanabe, Yoshiro Ishii
  • Publication number: 20030224187
    Abstract: To provide a two-layer copper polyimide substrate that is excellent all in initial adhesion, heat resistant adhesion and PCT adhesion. According to the invention, by employing a structure such that a modified layer on the surface of a polyimide film has a thickness of not more than 200 Å, and, preferably not less than 50 Å as evaluated by a method by dyeing a section thereof with a silver nitrate aqueous solution and observing it by a transmission electron microscope (TEM) and that a metal seed layer is formed on the polyimide film surface, followed by forming a copper layer thereon by copper electroplating or copper electroless plating or a combination of the both, there is provided a two-layer copper polyimide substrate in which any of an initial adhesion, a heat resistant adhesion after standing in air at 150° C. for 168 hours, and a PCT adhesion after PCT test at 121° C. and at a humidity of 95% under 2 atmospheres for 100 hours are 400 N/m or more.
    Type: Application
    Filed: May 22, 2003
    Publication date: December 4, 2003
    Inventors: Noriyuki Saeki, Takefumi Sakou, Hiroto Watanabe, Yoshiro Ishii
  • Patent number: 6220797
    Abstract: An inexpensive steel cutting tool with excellent cutting characteristics and cutting life is provided to have a cutting part having a chamfered cutting edge and a surface hardening layer formed therein, wherein surface treatment is performed by forming a sufficiently thick surface hardening layer on the surface of steel base material, or by forming a hard coating film on the surface hardening layer.
    Type: Grant
    Filed: June 16, 1999
    Date of Patent: April 24, 2001
    Assignee: Sumitomo Metal Minning Co.
    Inventors: Yoshiro Ishii, Naoto Kanbara
  • Patent number: 6117280
    Abstract: Duplex coated steel composite products comprising a first layer of a nitrd layer formed by applying glow discharge at a current density from 0.001 to 2.0 mA/cm.sup.2 to the surface of metal parts by using gaseous ammonia and gaseous hydrogen while maintaining the temperature of the metal parts at 300 to 650.degree. C., thereby applying plasma nitriding and a second layer comprising a hard film comprising a nitride, carbide and/or carbonitride of one or more of elements selected from Ti, Zr, Hf, V, Nb, Ta and Cr coated on the first layer by the PVD method of a laminate film or a gradient laminate film of such hard film. The treated products are excellent in adhesion with the substrate and durability and have both oxidation resistance and wear resistance.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: September 12, 2000
    Assignees: Sumitomo Metal Mining Co., Ltd., Research Institute for Metal Surface of High Performance, Ltd.
    Inventors: Yoshikazu Yaginuma, Yoshiro Ishii, Shinichi Okabe
  • Patent number: 6110571
    Abstract: Duplex coated steel composite products comprising a first layer of a nitrided layer formed by applying glow discharge at a current density from 0.001 to 2.0 mA/cm.sup.2 to the surface of metal parts by using gaseous ammonia and gaseous hydrogen while maintaining the temperature of the metal parts at 300 to 650.degree. C., thereby applying plasma nitriding and a second layer comprising a hard film comprising a nitride, carbide and/or carbonitride of one or more of elements selected from Ti, Zr, Hf, V, Nb, Ta and Cr coated on the first layer by the PVD method of a laminate film or a gradient laminate film of such hard film. The treated products are excellent in adhesion with the substrate and durability and have both oxidation resistance and wear resistance.
    Type: Grant
    Filed: June 24, 1997
    Date of Patent: August 29, 2000
    Assignees: Sumitomo Metal Mining Co., Ltd., Research Institute for Metal Surface of High Performance, Ltd.
    Inventors: Yoshikazu Yaginuma, Yoshiro Ishii, Shinichi Okabe