Patents by Inventor Yoshiro Kuromitsu

Yoshiro Kuromitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate used for fabrication of thick film circuit
    Patent number: 5134029
    Abstract: For improvement in heat radiation capability without sacrifice of affinity for a paste, a substrate used for fabrication of a thick film circuit has a multi-level structure having a foundation of an aluminum nitride and a surface film provided on the foundation, and the surface film is formed of an oxygen compound containing silicon atoms.
    Type: Grant
    Filed: July 25, 1991
    Date of Patent: July 28, 1992
    Assignee: Mitsubishi Material Corporation
    Inventors: Yoshiro Kuromitsu, Hideaki Yoshida, Chuji Tanaka, Hiroto Uchida, Kenji Morinaga