Abstract: Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.