Abstract: A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Abstract: A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

Abstract: A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.

Abstract: A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.

Abstract: A composition suitable for the treatment of surfaces of copper and copper alloys is disclosed. It comprises, (a) a cupric complex of an azole compound, (b) an organic acid having a boiling point or a decomposition point of 230.degree. C or lower, (c) a difficultly volatile complexing agent, (d) a complexing agent having a complexing power which is weaker than that of the azole compound, and (e) water. The treatment of copper or copper alloys with the composition produces abraded surface with moderate irregularities, thereby ensuring better adhesion of various resists thereto and increased solderability. The composition is particularly useful for the manufacture of printed-wiring boards.

Abstract: A novel benzimidazole derivative is disclosed. The benzimidazole derivative is represented by the following formula (I), ##STR1## wherein R.sup.1 is a hydrogen atom, a lower alkyl group, or a halogen atom; R.sup.2 is a hydrogen atom or a lower alkyl group; R.sup.3 is an alkylene group with 1 to 18 carbon atoms; and n and m are integers from 0 to 3. The compound has an excellent rust preventing effect and can be used as a component of a composition for the treatment of surfaces of copper and copper alloys comprising the benzimidazole derivative which is particularly useful in preventing rust in printed-wiring boards.