Patents by Inventor Yoshiro Moriguchi

Yoshiro Moriguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210353905
    Abstract: A packaging body includes first and second sheet members superimposed on each other, and a sticking region formed on an outer periphery of the first and second sheet members. The sticking region has an opening portion in at least one part of the sticking region. The opening portion has an angled, convex shape and includes (i) a non-sticking portion in which the first and second sheet members are not stuck together and (ii) a plurality of first sticking portions that sandwich the non-sticking portion and in which the first and second sheet members are stuck together.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Applicant: ASAHI INTECC CO., LTD.
    Inventors: Naiyawut KETSUNEE, Muangmoon WUTTHIPONG, Yoshiro MORIGUCHI
  • Publication number: 20060064325
    Abstract: So that health management advice is effective, the present invention effectively processes data that was obtained using a measuring device, and presents useful information for health management. For this purpose, a measuring device 10 measures movement of a subject using an acceleration sensor 104, stores activity data in a storage part 114, stores identification information specifying the subject in an identification information storage part 118, and transmits the stored activity data and the identification information to a data processing device 20. A medical examination result database 30 is connected with the data processing device 20, and medical examination result data history is correlated with the identification information of the subject and is stored.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 23, 2006
    Applicant: Suzuken Co., Ltd
    Inventors: Masayo Matsumoto, Koji Ota, Yukihiko Ogihara, Kikuto Tanaka, Masateru Yoshida, Yoshiro Moriguchi
  • Patent number: 4088516
    Abstract: A method of manufacturing a semiconductor device, comprises the steps of masking desired parts of a semiconductor substrate with a material which is impervious to an etchant for the substrate, exposing the substrate to the etchant to thereby etch substrate parts which lie directly beneath end parts of the etchant-impervious material and substrate parts which are not masked, applying a solution preferentially into the parts directly beneath the end parts of the etchant-impervious material among the etched substrate parts, the solution being capable of being converted into a semiconduct or oxide by a predetermined heat treatment, and heat-treating the substrate in order to oxidize the etched substrate surface parts.
    Type: Grant
    Filed: October 29, 1976
    Date of Patent: May 9, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Kondo, Takahisa Nitta, Yoshiro Moriguchi