Patents by Inventor Yoshiro Okada

Yoshiro Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated device having solid-state image sensor packaged within and production method for same
    Patent number: 7361525
    Abstract: A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: April 22, 2008
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Yoshiro Okada, Takahiko Ogo, Kaoru Sasaki