Abstract: An object of the present invention is to provide a resin composition including a thermoplastic resin and an inorganic filler, which can easily undergo molding processing and has flexibility and a sense of massiveness, and a molded article thereof. A resin composition, including 15 to 50 parts by mass of a specific 4-methyl-1-pentene/?-olefin copolymer (A), 10 to 50 parts by mass of an inorganic filler (B), and 5 to 49 parts by mass of a thermoplastic elastomer (C) (a total amount of 4-methyl-1-pentene/?-olefin copolymer (A), inorganic filler (B), and thermoplastic elastomer (C) is 100 parts by mass), wherein the thermoplastic elastomer (C) is at least one selected from the group consisting of an olefinic thermoplastic elastomer (C1) and a styrenic thermoplastic elastomer (C2); and a molded article including the resin composition.

Abstract: A resin composition containing a 4-methyl-1-pentene/?-olefin copolymer (A-1) satisfying (a) to (b), a 4-methyl-1-pentene/?-olefin copolymer (A-2) satisfying (c) to (d), and a thermoplastic resin (B) other than these, wherein a total content of (A-1) and (A-2) is 2 to 50% by mass, and a content of (B) is 50 to 98% by mass, based on 100% by mass of a total of (A-1), (A-2), and (B): (a) 65 to 80 mol % of a structural unit (i) derived from 4-methyl-1-pentene and 20 to 35 mol % of a structural unit (ii) derived from ?-olefin; (b) a melting point observed by DSC is lower than 110° C. or not observed; (c) 80 to 90 mol % of the structural unit (i) and 10 to 20 mol % of the structural unit (ii) are contained; and (d) a melting point observed by DSC is 110 to 160° C.

Abstract: An object of the present invention is to obtain an ethylene-based polymer composition useful as a material for shaped articles having a low surface resistivity and a low volume resistivity and exhibiting excellent slidability. The present invention pertains to an ethylene-based polymer composition containing an ethylene-based polymer (A) and a carbon-based filler (C), the ethylene-based polymer composition having a melt flow rate (MFR) in the range of 0.1 to 20 g/10 min as measured in accordance with JIS K7210-1: 2014 at a measurement temperature of 230° C. under a load of 10 kgf.

Abstract: An object of the present invention is to provide a resin composition and a molded article each having suppressed surface stickiness while having high stress-relaxing ability and vibration-absorbing ability at room temperature. A resin composition (X) containing 10 to 50 parts by mass of a thermoplastic resin (A) and 50 to 90 parts by mass of an inorganic substance (B), wherein a tan ? peak temperature and tan ? peak value, obtained by performing dynamic viscoelastic measurement at a frequency of 10 rad/s (1.6 Hz) in the temperature range of ?40 to 150° C., are 0° C. or higher and 60° C. or lower, and 0.8 or more and 5.0 or less, respectively.

Abstract: An adhesive resin composition including a propylene polymer (A), an ethylene polymer (B), and a thermoplastic resin (C) including a copolymer containing not less than 60 mol % and not more than 99 mol % of structural units derived from 4-methyl-1-pentene, and not less than 1 mol % and not more than 40 mol % of structural units derived from a C2-C20 ?-olefin other than 4-methyl-1-pentene, these structural units representing total 100 mol % of the copolymer, the thermoplastic resin (C) showing a melting point Tm of not more than 199° C. or showing substantially no melting point as analyzed with a differential scanning calorimeter (DSC). The total of the components (A), (B) and (C) includes 45 to 75 parts by mass of the component (A), 5 to 20 parts by mass of the component (B), and 15 to 45 parts by mass of the component (C).