Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10?6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10?6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10−6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: A golf club head comprises a face part defining a face for striking a golf ball, and at least a part of the face part made of an alloy satisfying the following three conditions: (1) the alloy is composed of at least three different metallic elements whose group numbers in the periodic system are at least two consecutive numbers; (2) a difference in the atomic radius between at least two of said at least three different metallic elements is not less than 10%; and (3) the heat of mixing of the element that is the major component of the alloy and at least one of the remaining components or the remaining component is not less than −10 kcal/mol.

Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10−6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10−6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: Abstract of the Disclosure. A golf club head comprises a face part defining a face for striking a golf ball, and at least a part of the face part made of an alloy satisfying the following three conditions: (1) the alloy is composed of at least three different metallic elements whose group numbers in the periodic system are at least two consecutive numbers; (2) a difference in the atomic radius between at least two of said at least three different metallic elements is not less than 10%; and (3) the heat of mixing of the element that is the major component of the alloy and at least one of the remaining components or the remaining component is not less than −10 kcal/mol.

Abstract: A tough and heat resisting aluminum alloy comprising aluminum, a transition metal element and a rare earth element, and having a modulated structure which comprises an aluminum matrix and an intermetallic compound precipitated to form a network in the aluminum matrix. Also disclosed in a process for producing the aluminum alloy which comprises the steps of: rapid quenching and solidifying a liquid aluminum alloy at a quenching rate of 102 to 105 K/sec to obtain an aluminum-based supersaturated solid solution; and heat treating the quenched aluminum-based supersaturated solid solution at a heat treating temperature of 473 K or higher, the temperature increasing rate to the heat treating temperature being 1.5 K/sec or higher.

Abstract: To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m×K or higher and a thermal expansion coefficient of 20×10−6/° C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al—SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al—SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600° C. in a non-oxidizing atmosphere.

Abstract: An AlN dispersed powder aluminum alloy with a particular composition and structure has excellent wear resistance, seizure resistance, heat resistance, toughness and machinability. In the structure of the alloy, AlN layers are discontinuously dispersed along some of the grain boundaries of former aluminum alloy particles in the matrix of an aluminum alloy sintered body. Diffusion and sintering progresses between non-nitrided grains at areas of grain boundaries not having AlN layers, to attain strong bonding between the grains. A nitriding accelerative element such as Mg, Ca or Li is provided in some of the grains to promote the discontinuous formation of the AlN layers. Additionally, layers of a nitriding suppressive element such as Sn, Pb, Sb, Bi or S may be discontinuously dispersed at regions along some of the grain boundaries, and bonding between grains is achieved at these regions as well.

Abstract: An aluminum alloy is industrially producible and has higher strength and toughness than the prior art alloys. The high-strength high-toughness aluminum alloy includes a first phase of .alpha.-aluminum consisting of crystal grains whose mean crystal grain size is within the range of 60 to 1000 nm and a second phase of at least two different of intermetallic compounds consisting of crystal grains whose mean crystal grain sizes are within the range of 20 to 2000 nm. The crystal grains of the intermetallic compounds are dispersed so that they are only intermittently, and not continuously, linked throughout the alloy material.

Abstract: A copper series sintered friction material is provided including a foundation constituted by copper alloy powder and containing hard phases and solid lubricant components dispersed uniformly, and exhibits a friction coefficient of 0.3 or more stably without seizure when the sintered friction material frictionally slides against titanium or a titanium alloy in the atmosphere, the foundation containing at least one additive element selected from Zn, Ni, Al, Fe, and Mo.

Abstract: An AlN dispersed powder aluminum alloy with a particular composition and structure has excellent wear resistance, seizure resistance, heat resistance, toughness and machinability. In the structure of the alloy, AlN layers are discontinuously dispersed along some of the grain boundaries of former aluminum alloy particles in the matrix of an aluminum alloy sintered body. Diffusion and sintering progresses between non-nitrided grains at areas of grain boundaries not having AlN layers, to attain strong bonding between the grains. A nitriding accelerative element such as Mg, Ca or Li is provided in some of the grains to promote the discontinuous formation of the AlN layers. Additionally, layers of a nitriding suppressive element such as Sn, Pb, Sb, Bi or S may be discontinuously dispersed at regions along some of the grain boundaries, and bonding between grains is achieved at these regions as well.

Abstract: A roller brake or drum brake for a two-wheeler includes a guide case rotating with a wheel, a ring of a sintered copper alloy that is fixedly fitted into the guide case, and a brake shoe of an iron material that is pressed against the inner peripheral surface of the ring thereby exhibiting a braking effect. The sintered copper alloy forming the ring contains hard particles dispersed in the interior of respective grains of copper alloy powder forming the matrix.

Abstract: A slide member of a sintered aluminum alloy includes a matrix (1) formed of an aluminum alloy powder, and aluminum nitride films (2) dispersed along old, i.e. former original, powder grain boundaries of this matrix. When a state in which the aluminum nitride films (2) completely continuously enclose the peripheries of the old powder grain boundaries is defined as a dispersion ratio of 100%, the present aluminum nitride films (2) are discontinuously dispersed at a dispersion ratio of not more than 80%. A powder compact consisting of rapidly solidified aluminum alloy powder is heated and held in a nitrogen gas atmosphere, thereby facilitating reaction between aluminum and nitrogen through an exothermic phenomenon following deposition of elements solidly dissolved in the aluminum alloy, for forming aluminum nitride films dispersed on the aluminum alloy powder grain surfaces.

Abstract: A sintered friction material includes a copper alloy base and hard particles. The copper alloy base includes copper and at least one of, and preferably both, Zn and Ni within a total range of 5 to 40 wt % of the copper alloy base. The hard particles are uniformly dispersed in a matrix formed by the original composite copper alloy powder constituting the base, in a content amount j within a range of 10 to 30 wt % of the friction material.

Abstract: A sintered friction material having excellent high-temperature strength, heat-resistance, abrasion-resistance and .mu. characteristic, and capable of maintaining high friction coefficient stably is provided. The sintered friction material contains a foundation of titanium and/or titanium alloy powder, a solid lubricant and a fiber of hard material. The sintered friction material having the foundation of titanium and/or titanium alloy powder as the base is lined and joined onto a holder plate to form a friction pad suitable for use with a brake rotor made of titanium or titanium alloy.

Abstract: A material for a semiconductor substrate comprising an aluminum-silicon alloy containing from 50% to 80% by weight of silicon and having a thermal conductivity of 0.28 cal/cm.sec..degree. C. or higher, a coefficient of thermal expansion of 12.times.10.sup.-6 /.degree. C. or smaller and a density of 2.5 g/cm.sup.3 or lower. This material is produced by molding an Al--Si alloy powder, which has been obtained through rapid solidification by atomization, to form a compact and then consolidating the compact by means of forging, sintering, etc. The substrate material may have an Al or Al alloy covering layer at least one surface thereof and, further, as necessary, an insulating or plating layer on the covering layer. The thus obtained substrate material is lightweight and has a suitable coefficient of thermal expansion for a substrate as well as a high thermal conductivity. Therefore, a semiconductor device with high performance and reliability can be obtained using such substrate material.

Abstract: A sintered friction material includes a copper alloy base and hard particles. The copper alloy base includes copper and at least one of, and preferably both, Zn and Ni within a total range of 5 to 40 wt % of the copper alloy base. The hard particles are uniformly dispersed in a matrix formed by the original composite copper alloy powder constituting the base, in a content amount within a range of 10 to 30 wt % of the friction material.

Abstract: A friction material includes a composite hard grain disperse metal powder dispersed and held in a thermosetting resin matrix. The metal powder consists of a metal base comprising copper, aluminum, copper alloy or aluminum alloy and hard grains which are substantially homogeneously dispersed therein. The content of the hard grain disperse metal powder in the friction material is at least 20 percent and not more than 90 percent on a volume basis. The obtained friction material exhibits a stable coefficient of friction of at least 0.3 under dry sliding conditions while preventing the so-called semicontact phenomenon of locally coming into contact with a counter material even if a pressing load during frictional sliding is small.