Patents by Inventor Yoshishiro Tomita

Yoshishiro Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetically shielded electronic devices and related systems and methods
    Patent number: 10224290
    Abstract: Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 5, 2019
    Assignee: Intel Corporation
    Inventors: Rajendra Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua Heppner, Eric Li
  • Electromagnetically shielded electronic devices and related systems and methods
    Publication number: 20170186697
    Abstract: Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.
    Type: Application
    Filed: December 24, 2015
    Publication date: June 29, 2017
    Applicant: Intel Corporation
    Inventors: Rajendra Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Joshua Heppner, Eric Li