Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.

Abstract: A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

Abstract: A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.

Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract: A light emitting device has a light emitting element, a metal member, a covering member and a translucent member. The metal member has a first face and a second face on an opposite side from the first face. The first face has an element placement portion and a flat portion disposed around the element placement portion with the light emitting element being mounted on the element placement portion. The covering member is disposed on the second face of the metal member at the flat portion outside an illumination range of light emitted from the light emitting element. The translucent member seals part of the metal member and the light emitting element. The translucent member has a convex portion and a flange disposed around the convex portion, the flange being disposed outside the illumination range of light emitted from the light emitting element.

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract: A light emitting device, has: a light emitting element; a metal member having an element mounting portion on which the light emitting element is mounted, and a flat portion disposed around the periphery of the element mounting portion; and a translucent sealing member that seals the light emitting element and a part of the metal member, the sealing member has a main body portion that seals the light emitting element and the metal member, a convex portion disposed on the main body portion, and a flange portion disposed around the periphery of the main body portion, the flange portion is disposed outside the range illuminated by light emitted from the light emitting element, and the flat portion of the metal member is bent toward the bottom face side of the light emitting device at least within the flange portion.

Abstract: A light emitting device has a light emitting element, a metal member, a covering member and a translucent member. The metal member has a first face and a second face on an opposite side from the first face. The first face has an element placement portion and a flat portion disposed around the element placement portion with the light emitting element being mounted on the element placement portion. The covering member is disposed on the second face of the metal member at the flat portion outside an illumination range of light emitted from the light emitting element. The translucent member seals part of the metal member and the light emitting element. The translucent member has a convex portion and a flange disposed around the convex portion, the flange being disposed outside the illumination range of light emitted from the light emitting element.

Abstract: A light emitting device has: a light emitting element; a metal member having a first face on which the light emitting element is mounted, and a second face that is on the opposite side from the first face; and a translucent member that seals part of the metal member and the light emitting element, the metal member has an element placement portion on which the light emitting element is placed, and a flat portion disposed around the element placement portion, a covering member is disposed on the second face side of the flat portion, and the top and side faces of the covering member are covered by the translucent member.

Abstract: A light emitting device has: a light emitting element; a metal member having a first face on which the light emitting element is mounted, and a second face that is on the opposite side from the first face; and a translucent member that seals part of the metal member and the light emitting element, the metal member has an element placement portion on which the light emitting element is placed, and a flat portion disposed around the element placement portion, a covering member is disposed on the second face side of the flat portion, and the top and side faces of the covering member are covered by the translucent member.

Abstract: A light emitting device includes a first lead and a second lead. The first lead has a top surface which a light emitting element is mounted thereon and a bottom surface opposed to the top surface. The second lead has a lead peripheral region where a wire connected to an electrode of the light emitting element is bonded therewith. The first lead includes a lead middle region where the semiconductor light emitting element is mounted thereon to thermally conduct therewith. A bottom surface of the lead middle region is exposed from a package. The second lead has an outer lead region that is projected outwardly from the both side surfaces of the package. The bottom surface of the first lead middle region is substantially coplanar with a bottom surface of the outer lead region.

Abstract: A light emitting device, has: a light emitting element; a metal member having an element mounting portion on which the light emitting element is mounted, and a flat portion disposed around the periphery of the element mounting portion; and a translucent sealing member that seals the light emitting element and a part of the metal member, the sealing member has a main body portion that seals the light emitting element and the metal member, a convex portion disposed on the main body portion, and a flange portion disposed around the periphery of the main body portion, the flange portion is disposed outside the range illuminated by light emitted from the light emitting element, and the flat portion of the metal member is bent toward the bottom face side of the light emitting device at least within the flange portion.

Abstract: A light emitting device includes a first lead and a second lead. The first lead has a top surface which a light emitting element is mounted thereon and a bottom surface opposed to the top surface. The second lead has a lead peripheral region where a wire connected to an electrode of the light emitting element is bonded therewith. The first lead includes a lead middle region where the semiconductor light emitting element is mounted thereon to thermally conduct therewith. A bottom surface of the lead middle region is exposed from a package. The second lead has an outer lead region that is projected outwardly from the both side surfaces of the package. The bottom surface of the first lead middle region is substantially coplanar with a bottom surface of the outer lead region.

Abstract: Both ends of the lead arrangement project outward from side surfaces of a package to form outer lead regions. Each of the outer lead regions includes a pair of outer lead projections and lead terminal smaller projections that are located between the outer lead projections. The outer lead projections and lead terminal smaller projections project outward. Adjustment is made to the projection amount of end surfaces of the lead smaller projections lying in a plane perpendicular to a longitudinal direction of the lead arrangement, whereby the end surfaces projecting less than end surfaces of the outer lead projections. Thus, cut surfaces of lead connection portions with edged corners are not exposed. This arrangement prevents that the cut surfaces damage other devices.

Abstract: A light emitting device includes a package having a recess defined by an inner wall and a bottom surface and a lead terminal exposed at the bottom surface of the recess and protruded outward from the package. The lead terminal exposed at the bottom surface of the recess portion including a semiconductor light emitting element mounting region and a wire connecting region for connecting a conductive wire from the semiconductor light emitting element thereto. At least one of regions between the semiconductor light emitting element mounting region and the wire connecting region has a groove portion disposed in a position spaced apart from a peripheral edge portion of the lead terminal that is exposed at the bottom surface of the recess.