Patents by Inventor Yoshitaka IWAKI

Yoshitaka IWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220207710
    Abstract: A semiconductor apparatus examination method includes a step of detecting light from a plurality of positions in a semiconductor apparatus (D) and acquiring a waveform corresponding to each of the plurality of positions, a step of extracting a waveform corresponding to a specific timing from the waveform corresponding to each of the plurality of positions and generating an image corresponding to the specific timing based on the extracted waveform, and a step of extracting a feature point based on a brightness distribution correlation value in the image corresponding to the specific timing and identifying a position of a drive element in the semiconductor apparatus based on the feature point.
    Type: Application
    Filed: May 19, 2020
    Publication date: June 30, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Hirotoshi TERADA, Yoshitaka IWAKI
  • Publication number: 20220050137
    Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.
    Type: Application
    Filed: October 29, 2021
    Publication date: February 17, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Yoshitaka IWAKI
  • Patent number: 11209476
    Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: December 28, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori Nakamura, Yoshitaka Iwaki
  • Publication number: 20210325435
    Abstract: An inspection device includes a reference signal output section, a noise removal section, and an electrical characteristic measurement section. The reference signal output section is connected to an external power supply device in electrical parallel with a semiconductor sample, and outputs a reference signal according to the output of the external power supply device. The noise removal section outputs a noise removal signal obtained by removing a noise component of the output of the external power supply device from the current signal output from the semiconductor sample based on the reference signal. The electrical characteristic measurement section measures the electrical characteristic of the semiconductor sample based on the noise removal signal. The inspection device measures the electrical characteristic of the semiconductor sample to which a voltage is being applied by the external power supply device and which is being irradiated and scanned with light.
    Type: Application
    Filed: June 5, 2019
    Publication date: October 21, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yoshitaka IWAKI, Yuji NAKAJIMA, Toshiki YAMADA
  • Patent number: 10983162
    Abstract: An inspection method for inspecting a semiconductor device which is an object to be inspected includes a step of inputting an input signal to the semiconductor device, a step of irradiating the semiconductor device with light, a step of outputting a result signal indicating a change in a state of the semiconductor device based on an output signal which is output from the semiconductor device to which the input signal is input while the semiconductor device is irradiated with the light, and a step of deriving time information relating to a time from the input of the input signal to the semiconductor device to the output of the result signal.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: April 20, 2021
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventor: Yoshitaka Iwaki
  • Publication number: 20200110129
    Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.
    Type: Application
    Filed: March 7, 2018
    Publication date: April 9, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Yoshitaka IWAKI
  • Publication number: 20190265297
    Abstract: An inspection method for inspecting a semiconductor device which is an object to be inspected includes a step of inputting an input signal to the semiconductor device, a step of irradiating the semiconductor device with light, a step of outputting a result signal indicating a change in a state of the semiconductor device based on an output signal which is output from the semiconductor device to which the input signal is input while the semiconductor device is irradiated with the light, and a step of deriving time information relating to a time from the input of the input signal to the semiconductor device to the output of the result signal.
    Type: Application
    Filed: August 1, 2017
    Publication date: August 29, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventor: Yoshitaka IWAKI