Abstract: An image processing method of holding a plurality of texture data for applying a metal representation on an image. The method includes acquiring predetermined information concerning at least one of an observation distance as a distance between a print product on which a target region is printed and an observer observing the print product, a sheet on which the target region is printed, or an environment in which the print product is observed, selecting texture data from the plurality of texture data based on the acquired predetermined information, and applying, to the target region, the texture data selected in the selecting.

Abstract: A lamination molding apparatus including: an irradiator irradiating a material layer with a beam to form a solidified layer; and a temperature adjustment device which abuts against a part or all of the solidified body including an upper surface of the solidified body, and heats and cools the part or all of the solidified body to a set temperature. The temperature adjustment device has a temperature adjustment plate and a revolving portion. The revolving portion sets the temperature adjustment plate to an upright state when the part or all of the solidified body including the upper surface of the solidified body is not heated and cooled by the temperature adjustment device, and sets the temperature adjustment plate to a lying state when the part or all of the solidified body including the upper surface of the solidified body is heated and cooled by the temperature adjustment device.

Abstract: To achieve both guarantee of safety related to vehicle control and improvement of availability in an in-vehicle device that cannot independently perform automatic driving and needs assistance of vehicle control. To achieve the above object, a control system includes an in-vehicle device and a coordination device that are synchronized in time point. The control system includes a travelable time calculation unit that calculates a travelable time for guaranteeing that a vehicle does not collide with an obstacle on a travel trajectory in a target region through which the vehicle equipped with the in-vehicle device passes, a travelability determination unit that determines validity of the travelable time, and a trajectory following unit that permits the in-vehicle device to follow the travel trajectory when it is determined that the travelable time is valid.

Abstract: An information processing apparatus that is connected to a storage device that stores a file includes processing circuitry. The processing circuitry is configured to receive an instruction of an end process during execution of a predetermined process related to the file, determine, after the predetermined process is completed, whether the instruction of the end process was received during the execution of the predetermined process, and execute the end process after it is determined that the instruction of the end process was received.

Abstract: Provide a hydraulic circuit that can prevent damage to the oil cooler while suppressing excessive rise in the temperature of the operating oil.

Abstract: The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

Abstract: A circuit module includes: a first circuit component having electrode pads on a first surface; and a second circuit component having electrode pads on a second surface. A conductive bonding material joins the electrode pads of the first circuit component to the electrode pads of the second circuit component respectively. A first reinforcing bonding material is not in contact with the conductive bonding material and joins the first surface of the first circuit component to the second surface of the second circuit component. A second reinforcing bonding material is located in contact with the first reinforcing bonding material, and joins the first surface of the first circuit component to the second surface of the second circuit component.

Abstract: An additive manufacturing apparatus includes a build table on which a material layer is formed by supply of material powder, and an irradiator that irradiates the material layer with an energy beam and forms a solidified layer. A temperature adjuster includes a heater that heats the build table to a set temperature and a first cooler that cools the build table. A refrigerant circulation device adjusts a temperature of a refrigerant and circulates the refrigerant between itself and a first cooler. A control device is configured to control a supply refrigerant temperature being the temperature of the refrigerant supplied from the refrigerant circulation device based on the set temperature.

Abstract: A semiconductor device includes: an active region having a semiconductor element and a surface electrode provided by a wiring electrode material and connected to the semiconductor element on a side adjacent to a surface of a semiconductor chip; and a pad arrangement region having a pad provided by the wiring electrode material. The pad arrangement region overlaps the active region in a direction normal to the surface of the semiconductor chip. In a part where the pad arrangement region and the active region overlap, the pad is disposed on the surface electrode through an isolation insulating film so that the wiring electrode material is in two layers to provide a double-layer wiring electrode structure. In a part of the active region without overlapping the pad arrangement region, the surface electrode has a single-layer wiring electrode structure composed of a single layer of the wiring electrode material.

Abstract: A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.

Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.

Abstract: The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

Abstract: The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

Abstract: A lamination molding apparatus including: an irradiator irradiating a material layer with a beam to form a solidified layer; and a temperature adjustment device which abuts against a part or all of the solidified body including an upper surface of the solidified body, and heats and cools the part or all of the solidified body to a set temperature. The temperature adjustment device has a temperature adjustment plate and a revolving portion. The revolving portion sets the temperature adjustment plate to an upright state when the part or all of the solidified body including the upper surface of the solidified body is not heated and cooled by the temperature adjustment device, and sets the temperature adjustment plate to a lying state when the part or all of the solidified body including the upper surface of the solidified body is heated and cooled by the temperature adjustment device.

Abstract: A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.

Abstract: A pneumatic tire includes a tread; sidewalls; beads inward of the sidewalls; lug grooves formed in the tread and inclined symmetrically about the equator, an inclination angle ? of the lug grooves with respect to the lateral direction being 15°???45°; and shoulder grooves connecting the lug grooves and inclined in an opposite direction to the lug grooves, a center line of the shoulder grooves at both sides meeting with two of the lug grooves at intersection points. A difference between distances L1, L2 from the equator to the intersection points and a tread width TW satisfy TW×0.03?|L1?L2|?TW×0.2. An average value of the distances and the tread width TW satisfy TW×0.15?(L1+L2)/2?TW×0.35. A groove area ratio of the tread is from 0.4 to 0.7.

Abstract: A pneumatic tire includes a tread; sidewalls; and beads. Lug grooves are formed in the tread inclining symmetrically about an equator, an inclination angle ? of the lug grooves relative to the lateral direction being 15°???45°. A width W1 of the lug grooves at the tread edge and an interval W2 between the lug grooves at the tread edge satisfying 0.7?W1/W2?1.5. Shoulder grooves connecting lug grooves are inclined in an opposite direction to the lug grooves have an inclination angle ? relative to the lug grooves being 80°???100°, a center position of the shoulder grooves being 15% to 35% of tread width TW from the equator. An area A1 of the shoulder grooves and an area A2 of shoulder blocks satisfy 0.2?A1/A2?0.6. A groove area ratio of the tread is 0.4 to 0.7.

Abstract: A sensor structure and a method for operating a vibrating sensor of angular velocity comprising a rotor mass and two linearly moving masses is disclosed. The sensor structure and method comprises a rotor mass, two linearly moving masses, and two T-shaped levers each coupled with the two linearly moving masses and to the rotor mass. The T-shaped levers enable the rotor mass and the two linearly moving masses to be excited into an anti-phase primary mode, where the direction of angular momentum of the rotor mass is opposite to the direction of angular momenta of the linearly moving masses. Angular momenta of the rotor mass and the linearly moving masses cancel each other to a high extent, so that the total sum of angular momentum of the structure is very small. Nominal frequency of the anti-phase primary mode is distinctively low as compared to nominal frequencies of other possible primary modes, such as a parallel phase primary mode.

Abstract: The present invention relates to capacitive micromechanical accelerometers, and in particular to acceleration sensors with movable rotors which may rotate out of a substrate plane when the accelerometer undergoes movement with an acceleration component perpendicular to the substrate plane. The capacitive micromechanical accelerometer includes additional damping springs to reduce unwanted movement of the rotor in the substrate plane, thereby reducing the parasitic capacitance that results from motion of the rotor in the substrate plane. The damping springs are vertically recessed with respect to other components of the accelerometer in order to minimise the effect of the damping springs on movement of the rotor out of the substrate plane.

Abstract: A sensor element, for detecting angular velocity about a detection axis perpendicular to a plane of the sensor element, comprises two primary masses and two Coriolis masses, and two sensing cells. Two coupling levers are each coupled to the two primary masses by first springs and to one of the two Coriolis masses by second springs. The coupling levers enable the primary masses and Coriolis masses to be excited into a combined primary motion in the plane of the planar sensor element. In the primary motion, a direction of angular momenta of linear primary oscillation motions of the primary masses and angular momenta of rotational primary motions of the coupling levers with respect to the geometrical centroid of the sensor element is opposite to the direction of the angular momenta of linear primary oscillation motions of the Coriolis masses with respect to the geometrical centroid of the sensor element.