Abstract: A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.

Abstract: A light bulb shaped lamp (1) according to the present invention includes: a base board (120); an LED chip (110) mounted on the base board (120); a base (190) for receiving power from outside; at least two power-supply leads (140) for supplying power to the LED chip (110); and a globe (170) for housing the base board (120), the LED chip (110), and the power-supply leads (140), the globe being partially attached to the base (190), the base board (120) is translucent, each of the two power-supply leads (140) is extended from a side of the base toward inside of the globe and is connected to the base board (120), and the LED chip (110) is provided between (i) a portion at which one of the two power-supply leads (140) and the base board (120) are connected and (ii) a portion at which the other of the two power-supply leads (140) and the base board (120) are connected.

Abstract: A light emitting module includes a base board having a first surface and a second surface opposing the first surface. A plurality of light-emitting diodes is provided on the first surface of the base board. A seal covers the plurality of light-emitting diodes, includes a wavelength conversion material, and covers the second surface of the base board.

Abstract: An LED light bulb includes a base board having a first surface and a second surface opposing the first surface. A globe houses the base board. A plurality of light-emitting diodes is arranged on the first surface of the base board. A seal covers the plurality of light-emitting diodes and includes a wavelength conversion material. A first power supply lead and a second power supply lead support the base board. A base is disposed outside of the globe for receiving power.

Abstract: A light bulb includes an elongated base board having a first end and a second end at opposed ends of a longitudinal axis of the base board, and an upper surface. A single line of light-emitting diodes is arranged parallel to the longitudinal axis of the base board and between the first end and the second end. A base is provided for receiving power. A translucent seal that includes a wavelength conversion material is provided, in which the seal covers the light-emitting diodes and covers the upper surface of the base board. A first power supply lead and a second power supply lead are provided for supplying power to the light-emitting diodes. A housing that houses the base board, the light-emitting diodes, and the power-supply leads, is provided in which the housing is attached to the base.

Abstract: A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Abstract: An LED light bulb includes a base board having a first surface and a second surface opposing the first surface. A globe houses the base board. A plurality of light-emitting diodes is arranged on the first surface of the base board. A seal covers the plurality of light-emitting diodes and includes a wavelength conversion material. A first power supply lead and a second power supply lead support the base board. A base is disposed outside of the globe for receiving power.

Abstract: A light emitting module includes a base board having a first surface and a second surface opposing the first surface. A plurality of light-emitting diodes is provided on the first surface of the base board.

Abstract: A light bulb shaped lamp according to the present invention includes a translucent base board, an LED chip mounted on the base board, a base for receiving power from outside, at least two power-supply leads for supplying power to the LED chip, and a globe partially attached to the base for housing the base board, the LED chip, and the power-supply leads. Each of the two power-supply leads extends from a side of the base toward inside of the globe and connected to the base board, and the LED chip is provided between a portion at which one of the two power-supply leads and the base board are connected and a portion at which the other of the two power-supply leads and the base board are connected.

Abstract: A light bulb includes an elongated base board having a first end and a second end at opposed ends of a longitudinal axis of the base board, and an upper surface. A single line of light-emitting diodes is arranged parallel to the longitudinal axis of the base board and between the first end and the second end. A base is provided for receiving power. A translucent seal that includes a wavelength conversion material is provided, in which the seal covers the light-emitting diodes and covers the upper surface of the base board. A first power supply lead and a second power supply lead are provided for supplying power to the light-emitting diodes. A housing that houses the base board, the light-emitting diodes, and the power-supply leads, is provided in which the housing is attached to the base.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base having a mounting surface on which the light emitting module is mounted, and a cover portion configured to cover an edge portion of the module substrate without pressing the edge portion. The module substrate includes a surface which is bonded to the mounting surface of the base through an adhesive layer. The base includes a protrusion provided to protrude upward from the mounting surface without being covered by the module substrate. The cover portion is provided on the protrusion.

Abstract: An illumination device includes a light emitting module having a module substrate and a semiconductor light emitting element mounted to the module substrate, a base including a mounting surface on which the light emitting module is mounted, a circuit unit provided at a side of a rear surface of the base opposite to the mounting surface and configured to drive the light emitting unit; and a circuit case which accommodates and holds the circuit unit in an internal space thereof. The circuit case includes a tubular portion having an opening arranged to face the rear surface of the base and an insulation portion interposed between the rear surface of the base and the circuit unit to cover the opening of the tubular portion. The insulation portion includes a window through which the internal space of the circuit case leads to the rear surface of the base.

Abstract: A light bulb shaped lamp according to the present invention includes a translucent base board, an LED chip mounted on the base board, a base for receiving power from outside, at least two power-supply leads for supplying power to the LED chip, and a globe partially attached to the base for housing the base board, the LED chip, and the power-supply leads. Each of the two power-supply leads extends from a side of the base toward inside of the globe and connected to the base board, and the LED chip is provided between a portion at which one of the two power-supply leads and the base board are connected and a portion at which the other of the two power-supply leads and the base board are connected.

Abstract: A manufacturing method of a high-pressure mercury lamp includes an electric field application step in which an electric field is applied to at least a light emission part (4) with the high-pressure mercury lamp being kept at a high temperature. This can reduce impurities such as hydrogen and alkali metals in a discharge space (8) and glass forming the light emission part (4). As a consequence, blackening and devitrification of the high-pressure mercury lamp while the lamp is lit can be reduced.

Abstract: A method for manufacturing a high pressure mercury lamp having a high pressure resistance strength includes an electric field application step of applying an electric field to at least a light emitting part while keeping the high pressure mercury lamp at a high temperature. As a result of the electric field application step, impurities such as hydrogen and an alkali metal existing in a discharge space and in glass used for forming the light emitting part (1) and sealing parts (2) can be reduced, with it being possible to suppress blackening and devitrification during lighting.

Abstract: A discharge lamp 50 comprises a luminous bulb 10 in which a luminous material 18 is encapsulated and a pair of electrodes 12 are arranged to be opposed to each other, and sealing parts (11a, 11b) that are formed at both ends of the luminous bulb 10 and in which metal foil structures 13 electrically connected to the pair of electrodes 12, respectively, are sealed. At least one of the metal foil structures 13 is composed of a first metal foil 13a, a second metal foil 13b and a metal bar 21 coupling both of them. At least one sealing part 11b of the sealing parts includes a cavity 20 around the position where in the sealing part the metal bar 21 is located, and at least a rare gas is encapsulated in the cavity 20.

Abstract: A manufacturing method of a high-pressure mercury lamp includes an electric field application step in which an electric field is applied to at least a light emission part (4) with the high-pressure mercury lamp being kept at a high temperature. This can reduce impurities such as hydrogen and alkali metals in a discharge space (8) and glass forming the light emission part (4). As a consequence, blackening and devitrification of the high-pressure mercury lamp while the lamp is lit can be reduced.

Abstract: A high-pressure mercury lamp is provided that includes a transparent envelope made of quartz glass, in which mercury, halogen, and a rare gas are sealed and a pair of electrodes provided in the transparent envelope. The amount of the halogen sealed in the transparent envelope is in the range from 1.0×10?6 ?mol/mm3 to 1.0×10?2 ?mol/mm3, and 2.5 mol % to 25 mol % of oxygen with respect to the amount of the halogen is present in the transparent envelope. The high-pressure mercury lamp can prevent blackening of an inner wall of the transparent envelope from occurring over a long period of lighting without deteriorating the startability or lamp characteristics, thus achieving a long life.