Patents by Inventor Yoshitaka Matsuda
Yoshitaka Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12146619Abstract: A light bulb shaped lamp (1) according to the present invention includes: a base board (120); an LED chip (110) mounted on the base board (120); a base (190) for receiving power from outside; at least two power-supply leads (140) for supplying power to the LED chip (110); and a globe (170) for housing the base board (120), the LED chip (110), and the power-supply leads (140), the globe being partially attached to the base (190), the base board (120) is translucent, each of the two power-supply leads (140) is extended from a side of the base toward inside of the globe and is connected to the base board (120), and the LED chip (110) is provided between (i) a portion at which one of the two power-supply leads (140) and the base board (120) are connected and (ii) a portion at which the other of the two power-supply leads (140) and the base board (120) are connected.Type: GrantFiled: July 28, 2021Date of Patent: November 19, 2024Assignee: SATCO PRODUCTS, INC.Inventors: Nobuyoshi Takeuchi, Tsugihiro Matsuda, Hideo Nagai, Masahiro Miki, Yoshitaka Kurimoto
-
Publication number: 20240351133Abstract: Provided is a friction stir spot welded joint having high joint strength even in the case where a high strength steel sheet, particularly a steel sheet with a tensile strength (TS) of 980 MPa or more, is used as a material to be welded. An annular groove is formed on an upper surface of an upper sheet out of overlapping steel sheets, and a shape, microstructure, and hardness of a welded portion are appropriately controlled simultaneously.Type: ApplicationFiled: July 21, 2022Publication date: October 24, 2024Applicants: JFE STEEL CORPORATION, KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Daiki YAMAGISHI, Katsutoshi TAKASHIMA, Hiroshi MATSUDA, Ryoji OHASHI, Yoshitaka MURAMATSU, Takuya FUKUDA
-
Publication number: 20230197475Abstract: A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided at a back side of the substrate while being spaced apart from the back surface so as to prevent the light from being supplied to a front surface of the substrate; and a holding position changing mechanism configured to change a holding position by the substrate holder on the back surface of the substrate so as to irradiate the entire back surface of the substrate with the light.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: Teruhiko KODAMA, Yuzo OHISHI, Yoshitaka MATSUDA
-
Patent number: 11667811Abstract: The present invention is a coating composition containing (A) a fluorine-containing copolymer and (B) a polycarbonate diol.Type: GrantFiled: September 1, 2020Date of Patent: June 6, 2023Assignee: KANTO DENKA KOGYO CO., LTD.Inventors: Yoshimasa Hikobe, Yoshitaka Matsuda
-
Publication number: 20230109353Abstract: An object is to provide a fluorine-containing copolymer composition that exhibits long-term stability as well as a fluororesin paint or varnish prepared using the composition. Provided are: a composition comprising a fluorine-containing copolymer synthesized through copolymerization of 0.001 to 50 mol % of particular ethylenically unsaturated organosilicon compound polymerization units relative to 5 to 85 mol % of fluoroolefin polymerization units by a solution polymerization method, a solvent, and an amine compound; a fluororesin paint or varnish prepared using the composition; and a method of producing the fluorine-containing copolymer composition.Type: ApplicationFiled: February 24, 2021Publication date: April 6, 2023Inventors: Yoshitaka MATSUDA, Katsuya FUKAE
-
Publication number: 20220282117Abstract: The present invention is a coating composition containing (A) a fluorine-containing copolymer and (B) a polycarbonate diol.Type: ApplicationFiled: September 1, 2020Publication date: September 8, 2022Inventors: Yoshimasa HIKOBE, Yoshitaka MATSUDA
-
Publication number: 20200157372Abstract: The present invention is a fluorine-containing copolymer including (A) a fluoroolefin in an amount of 15 to 85 mol % of all constituent monomers; (B) a specific organosilicon compound in an amount of 0.001 to 10 mol % of all the constituent monomers; (C) one or more monomers selected from vinyl ethers, vinyl esters, methacrylic esters and acrylic esters, the one or more monomers not having a curing reactive group and having an aliphatic saturated hydrocarbon group with 1 to 20 carbons, a glass transition temperature of a homopolymer of the monomer being lower than 0° C., in an amount of 5 to 40 mol % of all the constituent monomers; and (D) one or more monomers selected from vinyl ethers, vinyl esters, allyl ethers, methacrylic esters and acrylic esters, and having a curing reactive group, in an amount of 1 to 25 mol % of all the constituent monomers, wherein the fluorine-containing copolymer has a glass transition temperature of ?30° C. to 20° C., a number average molecular weight of 2.0×104 to 7.Type: ApplicationFiled: April 11, 2018Publication date: May 21, 2020Inventors: Takumi FUKADA, Yoshitaka MATSUDA, Yoshimasa HIKOBE
-
Publication number: 20200157373Abstract: The present invention is a paint composition containing (A) a fluorine-containing copolymer, (B) a solvent and (C) a resin particle satisfying the following conditions 1 to 5: condition 1: an average particle size of the resin particle is 0.1 to 50 ?m; condition 2: a refractive index of the resin particle at 20° C. is 0.8 to 1.2 times that of a film composed of the fluorine-containing copolymer (A) at 20° C.; condition 3: a 10% compression strength of the resin particle is 40 MPa or less; condition 4: a compressibility of the resin particle is 20% or more; and condition 5: the resin particle does not suffer from brittle fracture under a load force of 0.1 mN.Type: ApplicationFiled: March 26, 2018Publication date: May 21, 2020Applicant: Kanto Denka Kogyo Co., Ltd.Inventors: Takumi FUKADA, Yoshitaka MATSUDA, Yoshimasa HIKOBE
-
Patent number: 7673805Abstract: A mini card adapter for removably holding and fixing a mini card in a secure manner is provided. The mini card adapter holds a mini card having the same thickness as the standard card and outline dimensions smaller than those of the standard card. The mini card comprises a reference wall having the same thickness as the standard card and a bulging section formed on the top surface of the reference wall. In the reference wall, a card pocket for is formed for loading therein the mini card. The land section is formed in a region corresponding to the emboss section of the standard card, and a part of the land section bulges over the card pocket. As a result, an eaves wall for supporting one side of the mini card is formed. The eaves wall has a boss which fits in a hole formed in the mini card. A receiving nail for receiving the periphery of the mini card in corporation with the eaves wall is provided on the peripheral lower surface of the card pocket.Type: GrantFiled: March 10, 2005Date of Patent: March 9, 2010Assignees: JCB Co., Ltd, Maxell Seiki, Ltd.Inventors: Masayoshi Onishi, Yasuaki Wakizaka, Yoshitaka Matsuda, Koichi Ozaki
-
Publication number: 20070278317Abstract: A mini card adapter for removably holding and fixing a mini card in a secure manner is provided. The mini card adapter holds a mini card having the same thickness as the standard card and outline dimensions smaller than those of the standard card. The mini card comprises a reference wall 8 having the same thickness as the standard card and a bulging section 9 formed on the top surface of the reference wall 8. In the reference wall 8, a card pocket 10 for is formed for loading therein the mini card 1. The land section 9 is formed in a region Z corresponding to the emboss section of the standard card, and a part of the land section 9 bulges over the card pocket 10. As a result, an eaves wall 15 for supporting one side of the mini card 1 is formed. The eaves wall 15 has a boss 16 which fits in a hole 3 formed in the mini card 1. A receiving nail 17 for receiving the periphery of the mini card 1 in corporation with the eaves wall 15 is provided on the peripheral lower surface of the card pocket 10.Type: ApplicationFiled: March 10, 2005Publication date: December 6, 2007Applicants: JCB CO., LTD., MAXELL SEIKI, LTD.Inventors: Masayoshi Onishi, Yasuaki Wakizaka, Yoshitaka Matsuda, Koichi Ozaki
-
Publication number: 20020187423Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: ApplicationFiled: August 7, 2002Publication date: December 12, 2002Inventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
-
Patent number: 6451515Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: GrantFiled: August 4, 1999Date of Patent: September 17, 2002Assignee: Tokyo Electron LimitedInventors: Hideyuki Takamori, Kiyohisa Tateyama, Kengo Mizosaki, Noriyuki Anai, Yoshitaka Matsuda
-
Patent number: 6398879Abstract: An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.Type: GrantFiled: October 12, 2000Date of Patent: June 4, 2002Assignee: Tokyo Electron LimitedInventors: Fumio Satou, Mitsuhiro Sakai, Takeshi Tsukamoto, Yoichi Honda, Kiyomitsu Yamaguchi, Kimio Motoda, Yoshitaka Matsuda
-
Publication number: 20010049070Abstract: A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.Type: ApplicationFiled: August 4, 1999Publication date: December 6, 2001Inventors: HIDEYUKI TAKAMORI, KIYOHISA TATEYAMA, KENGO MIZOSAKI, NORIYUKI ANAI, YOSHITAKA MATSUDA
-
Patent number: 6261378Abstract: A cleaning unit for cleaning a substrate is disclosed, that comprises a holding mechanism for rotatably and horizontally holding the substrate, a first traveling means for holding both sides of a cleaning mechanism having at least one cleaning member and for moving the cleaning mechanism in such a manner that the first traveling means is kept in parallel with the substrate held by the holding mechanism, and a second traveling means for holding both sides of a processing solution supplying mechanism having supplying mechanisms for supplying different types of processing solution and for moving the cleaning mechanism in such a manner that the second traveling means is kept in parallel with the substrate held by the holding mechanism. Thus, the strength of the cleaning unit according to the present invention is higher than the strength of a conventional cleaning unit that holds an arm on one side thereof.Type: GrantFiled: March 19, 1999Date of Patent: July 17, 2001Assignee: Tokyo Electron LimitedInventors: Hiroshi Hashimoto, Yoshitaka Matsuda, Norio Uchihira, Masaaki Yoshida, Fumio Satou
-
Patent number: 6159288Abstract: An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.Type: GrantFiled: September 23, 1997Date of Patent: December 12, 2000Assignee: Tokyo Electron LimitedInventors: Fumio Satou, Mitsuhiro Sakai, Takeshi Tsukamoto, Yoichi Honda, Kiyomitsu Yamaguchi, Kimio Motoda, Yoshitaka Matsuda, Tetsuya Sada, Kiyohisa Tateyama
-
Patent number: 5945161Abstract: Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.Type: GrantFiled: December 18, 1997Date of Patent: August 31, 1999Assignee: Tokyo Electron LimitedInventors: Hiroshi Hashimoto, Kiyohisa Tateyama, Kiyomitsu Yamaguchi, Yoshitaka Matsuda, Norio Uchihira, Mitsuhiro Sakai, Fumio Satou
-
Patent number: 5906860Abstract: The invention provides an apparatus for treating a substrate with resist, comprising a spin chuck for horizontally holding a substrate, a first motor for variably rotating the spin chuck, a nozzle for applying resist solution onto the upper surface of the substrate held on the spin chuck, a cup having an upper opening through which the substrate is put in or taken out of the cup and a lower opening through which extends the driving shaft of the spin chuck, the cup positioned to surround the substrate held on the spin chuck to receive liquid centrifugally separated from the substrate which is rotated about its axis, a lid to close the upper opening of the cup to define a space around the substrate, a second motor for variably rotating the cup independently of the spin chuck rotation, a liftable cylinder for relatively moving at least one of the spin chuck and cup, which are positioned apart from each other, toward each other to achieve mutual contact, and an O-ring for hermetically sealing the mutual contact pType: GrantFiled: April 4, 1997Date of Patent: May 25, 1999Assignee: Tokyo Electron LimitedInventors: Kimio Motoda, Kiyomitsu Yamaguchi, Yoshitaka Matsuda, Tetsu Kawasaki
-
Patent number: 5395003Abstract: A covered airtight container capable of preventing a soup from leaking therefrom. The covered airtight container comprises a body made of hard plastics and a cover made of soft plastics wherein the cover has a reverse channel-shaped edge portion piece formed by bending the upper end edge thereof upward and reversing it downward so as to cover the upper end portion of the body. The body has an annular stepped portion to which the cover is retained at the inner peripheral surface of the upper end portion of the peripheral wall. The cover has an annularly projected fin for elastically contacting the edge of said annular stepped portion. The covered airtight container may be formed square shaped with circumferential surfaces of the body and cover being slightly curved shape close to a circle. Particularly, the leaking prevention effect can be conspicuous since the sealing effect or state is assured at the inner and outer surfaces of the peripheral wall of the body.Type: GrantFiled: January 4, 1994Date of Patent: March 7, 1995Assignee: Kabushiki Kaisha Maruwa SeisakushoInventor: Yoshitaka Matsuda
-
Patent number: 5338143Abstract: This invention relates to a car storage apparatus in a car carrier having a plurality of stages of car storage decks. The car storage apparatus comprises a car loading port installed at the ship side on one of the decks, a loading/unloading berth extending from the loading port into the ship, elevator shafts extending vertically through the car storage decks, a lifter which is disposed in each elevator shaft and moves up and down with a car being mounted thereon, and conveyors which are installed on the loading/unloading berth, lifters, and car storage decks for transferring a car between them.Type: GrantFiled: July 17, 1992Date of Patent: August 16, 1994Assignees: Mitsubishi Jukogyo Kabushiki Kaisha, Seiryo Engineering Co., Ltd.Inventors: Yoshitaka Matsuda, Koichi Kondo, Shuhei Kuribayashi, Akiko Noda, Takuya Nakashima, Ryutaro Saito, Kae Tsuji, Hideo Mori, Yoshinori Mori