Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

Abstract: A module includes a substrate, a plurality of components on an upper surface of the substrate, a component on a lower surface of the substrate, solder balls on the lower surface, sealing resin layers stacked on the upper surface and the lower surface of the substrate, and a shield film covering a side surface and an upper surface of the module. Part of each solder ball is exposed from a surface of the sealing resin layer, and the exposed parts are shaped to protrude from the sealing resin layer. The module can be connected to a mother substrate by connecting the protruding parts of the solder balls. There are gaps between the solder balls and the sealing resin layer, and the occurrence of cracks in the solder balls can be suppressed by reducing stress arising from a difference in thermal expansion coefficient between the solder and the resin.

Abstract: A module includes a substrate, a first component on a first main surface of the substrate and from which heat is to be dissipated, a sealing resin layer that encloses the first component, and a heat-dissipating member that includes a first and a second heat-dissipating portions. The first heat-dissipating portion is disposed in the sealing resin layer, spaced apart from an upper surfaces of the first component, and includes a first overlap portion that overlaps an upper surfaces of the first component when viewed in plan in a direction perpendicular to the first main surface. The second heat-dissipating portion extends from an undersurface of the first overlap portion to the upper surface of the first component. An area of the second heat-dissipating portion on a surface of the first overlap portion including the undersurface is smaller than an area of the first overlap portion.

Abstract: An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

Abstract: A module includes a substrate, a plurality of components on an upper surface of the substrate, a component on a lower surface of the substrate, solder balls on the lower surface, sealing resin layers stacked on the upper surface and the lower surface of the substrate, and a shield film covering a side surface and an upper surface of the module. Part of each solder ball is exposed from a surface of the sealing resin layer, and the exposed parts are shaped to protrude from the sealing resin layer. The module can be connected to a mother substrate by connecting the protruding parts of the solder balls. There are gaps between the solder balls and the sealing resin layer, and the occurrence of cracks in the solder balls can be suppressed by reducing stress arising from a difference in thermal expansion coefficient between the solder and the resin.

Abstract: A module includes a substrate, a first component on a first main surface of the substrate and from which heat is to be dissipated, a sealing resin layer that encloses the first component, and a heat-dissipating member that includes a first and a second heat-dissipating portions. The first heat-dissipating portion is disposed in the sealing resin layer, spaced apart from an upper surfaces of the first component, and includes a first overlap portion that overlaps an upper surfaces of the first component when viewed in plan in a direction perpendicular to the first main surface. The second heat-dissipating portion extends from an undersurface of the first overlap portion to the upper surface of the first component. An area of the second heat-dissipating portion on a surface of the first overlap portion including the undersurface is smaller than an area of the first overlap portion.