Patents by Inventor Yoshitaka Matsushita
Yoshitaka Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220326114Abstract: Provided is a reusability determination method for a gear that makes it possible to determine reusability of a gear during or after use to increase the reuse ratio. The reusability determination method for a gear of the present invention includes a step of measuring a content of retained ? phases in the gear, a step of calculating a change rate of the content of the retained ? phases, a step of measuring residual stress applied to the gear, a residual stress ratio calculation step of calculating a residual stress ratio to residual stress in an initial state of the gear, and a reusability determination step of determining whether or not the gear is reusable on the basis of results of the calculation in the retained ? phase change rate calculation step and the residual stress ratio calculation step.Type: ApplicationFiled: December 17, 2020Publication date: October 13, 2022Inventors: Tomohisa KANAZAWA, Mitsuhiro YOSHIMOTO, Norihito HATA, Masao HAYAKAWA, Susumu MEGURO, Takanobu HIROTO, Yoshitaka MATSUSHITA
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Patent number: 8939452Abstract: Provided is a metal gasket for a cylinder head that is capable of improving engaging force between a substrate and a step adjustment plate.Type: GrantFiled: February 21, 2011Date of Patent: January 27, 2015Assignee: Nippon Leakless Industry Co., Ltd.Inventors: Yoshitaka Matsushita, Yuji Takahashi, Yoshimi Arakawa
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Patent number: 8410375Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.Type: GrantFiled: October 3, 2008Date of Patent: April 2, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yoshitaka Matsushita, Kazuhiro Oshima, Akio Horiuchi
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Patent number: 8379402Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.Type: GrantFiled: December 8, 2009Date of Patent: February 19, 2013Assignee: Shinko Electric Industries Co., Ltd.Inventors: Kazuhiro Oshima, Yoshikazu Hirabayashi, Shigeo Nakajima, Yoshitaka Matsushita
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Publication number: 20120319361Abstract: Provided is a metal gasket for a cylinder head that is capable of improving engaging force between a substrate and a step adjustment plate.Type: ApplicationFiled: February 21, 2011Publication date: December 20, 2012Inventors: Yoshitaka Matsushita, Yuji Takahashi, Yoshimi Arakawa
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Publication number: 20110176286Abstract: A lead pin includes a shaft portion, and a connection head portion which is provided on a top end side of the shaft portion and has a diameter larger than a diameter of the shaft portion, and whose whole outer surface is formed of a spherical surface. The connection head portion is formed of a ball shape, an oval spherical shape, or a teardrop-like shape, and also the connection head portion of the lead pin is connected to a wiring substrate by the reflow soldering.Type: ApplicationFiled: January 10, 2011Publication date: July 21, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Shigeo NAKAJIMA, Yoshitaka Matsushita
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Publication number: 20100139970Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.Type: ApplicationFiled: December 8, 2009Publication date: June 10, 2010Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kazuhiro Oshima, Yoshikazu Hirabayashi, Shigeo Nakajima, Yoshitaka Matsushita
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Patent number: 7703775Abstract: A metal gasket for a cylinder head has a lamination of plates. The gasket includes two base metal plates each of which includes cylinder holes, circumferential beads formed around the peripheries of individual cylinder holes, cooling water holes formed outside the peripheries of the circumferential beads, and an outer bead formed so as to entirely enclose the circumferential beads and the cooling water holes. The circumferential beads of the two base plates are aligned in a direction of thickness of the gasket. Claw shaped protrusions are provided for one of an outer step adjustment metal plate and an inner step adjustment metal plate and extend from a cooling water jacket to the outer edges of the base plates into engagement holes in the other of the inner step adjustment plate and the outer step adjustment plate.Type: GrantFiled: October 27, 2005Date of Patent: April 27, 2010Assignees: Nippon Leakless Industry Co., Ltd, Honda Motor Co., Ltd.Inventors: Yoshitaka Matsushita, Shigeru Kobayashi, Shinichi Hirayama, Tsunehiko Abe, Naoki Takeda
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Publication number: 20090211798Abstract: A PGA type wiring board includes a wiring board to which a head portion of a pin is joined to a pad portion with solder interposed therebetween, and a pin fixing plate having a through hole formed therein through which a shank portion of the pin is inserted, and having an adhesive layer formed on one surface thereof. The pin fixing plate is bonded to the wiring board with the adhesive layer interposed therebetween while the shank portion of the pin is inserted through the through hole. The through hole is shaped in a stepped form with a two-step configuration when viewed in cross section.Type: ApplicationFiled: February 18, 2009Publication date: August 27, 2009Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Akio Horiuchi, Yoshikazu Hirabayashi, Yoshitaka Matsushita, Kazuhiro Oshima
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Publication number: 20090095518Abstract: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.Type: ApplicationFiled: October 3, 2008Publication date: April 16, 2009Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoshitaka Matsushita, Kazuhiro Oshima, Akio Horiuchi
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Publication number: 20070290452Abstract: A metal gasket for cylinder head 1 of plate lamination type, comprises two base metal plates each of which includes cylinder holes, circumferential beads formed around the peripheries of individual cylinder holes, cooling water holes formed outside the peripheries of the circumferential beads, and an outer bead formed and positioned so as to entirely enclose the circumferential beads and the cooling water holes, wherein the circumferential beads of the two base plates are aligned in the direction of thickness of the metal gasket. Claw-like protrusions are provided for one of an outer step adjustment metal plate and extending from the cooling water jacket to the outer edges of the base plates, and a thicker inner step adjustment metal plate 4 extending from inside the circumferential beads to the cooling water jacket, into engagement holes in the other of the inner step adjustment plate and the outer step adjustment plate.Type: ApplicationFiled: October 27, 2005Publication date: December 20, 2007Applicants: NIPPON LEAKLESS INDUSTRY CO., LTD, HONDA MOTOR CO., LTD.Inventors: Yoshitaka Matsushita, Shigeru Kobayashi, Shinichi Hirayama, Tsunehiko Abe, Naoki Takeda
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Patent number: 6935635Abstract: A multi-layer metal gasket includes at least on active layer and at least one shim layer having aligned combustion holes. The shim layer has annular portions surrounding the combustion holes and tab portions projecting radially outwardly from the annular portions surrounding the combustion holes. The annular portions underlie associated sealing beads of the active layer. The tab portions each have a radially extending neck region and a set of lateral bend tabs supported at the end of the neck region and projecting laterally outwardly thereof. The bend tabs project through an associated set of laterally spaced mounting windows formed in the active layer and are bent back toward one another to secure the shim layer to the active layer.Type: GrantFiled: December 11, 2003Date of Patent: August 30, 2005Assignee: McCord Leakless Sealing Co.Inventor: Yoshitaka Matsushita
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Publication number: 20040262850Abstract: A multi-layer metal gasket includes at least on active layer and at least one shim layer having aligned combustion holes. The shim layer has annular portions surrounding the combustion holes and tab portions projecting radially outwardly from the annular portions surrounding the combustion holes and tab portions projecting radially outwardly from the annular portions. The annular portions underlie associated sealing beads of the active layer. The tab portions each have a radially extending neck region and a set of lateral bend tabs supported at the end of the neck region and projecting radially outwardly thereof. The bend tabs project through an associated set of laterally spaced mounting windows formed in the active layer and are bent back toward one another to secure the shim layer to the active layer.Type: ApplicationFiled: December 11, 2003Publication date: December 30, 2004Inventor: Yoshitaka Matsushita
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Patent number: 6501440Abstract: An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.Type: GrantFiled: September 5, 2001Date of Patent: December 31, 2002Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yoshitaka Matsushita, Tsutomu Higuchi
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Publication number: 20020057221Abstract: An IC card includes an antenna formed as a flat coil wound several times having an inner vacant area, said antenna being made by punching or etching a thin metal strip and having an outermost loop partially connected to and supported by an outer frame of said thin metal strip, and said antenna having respective innermost and outermost terminals. A semiconductor element is electrically connected to said innermost and outermost terminals, respectively. One of said innermost and outermost terminals having an accommodation hole in which said semiconductor element is accommodated. The semiconductor element and the antenna are supported to maintain their form by a supporting material made of biodegradable resin.Type: ApplicationFiled: September 5, 2001Publication date: May 16, 2002Inventors: Yoshitaka Matsushita, Tsutomu Higuchi
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Patent number: 6378876Abstract: A metal gasket assembly comprises a metal main plate, a metal auxiliary plate lapped with the main plate, the main plate including cylinder openings formed at positions corresponding to cylinder bores in a cylinder block of an internal combustion engine, annular beads formed around the cylinder openings and having a cross-sectional shape of ‘V’, a plurality of coolant holes formed in the peripheral parts of the annular beads, an outer peripheral bead formed at a position where it entirely surrounds the annular beads and the plurality of coolant holes, and having a slope cross-sectional shape, while the auxiliary plate including cylinder openings formed corresponding to the cylinder openings in the main plate, fold-over parts formed around the auxiliary plate cylinder openings and fold-over in a direction reverse to the direction toward the main plate, and having a width with which they are vertically lapped at least with the entire ‘V’ shape of the annular beads on the main plate, annuType: GrantFiled: October 18, 2000Date of Patent: April 30, 2002Assignee: Nippon Leakless Industry Co., Ltd.Inventor: Yoshitaka Matsushita
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Patent number: 5161809Abstract: A metal gasket includes plural functional layers formed with embossments along peripheral edges of cylinder openings thereof and a backup plate not formed with any embossment and sandwiched between the functional layers. At least one edge plate is provided which is spaced radially within and is coplanar with peripheral edges of cylinder openings of the backup plate. The edge plate is different in thickness from, generally thinner than, the backup plate. Grommets are provided to fasten together the edge plate and portions of the functional layers overlapping the edge plate. With this arrangement, by selecting thicknesses of the edge plate and the backup plate so as to be different between them by a requisite value, surface pressure at peripheral edges of cylinder openings of the metal gasket can be set a desired value. Therefore, this metal gasket is superior in sealing performance and uniformity.Type: GrantFiled: June 25, 1991Date of Patent: November 10, 1992Assignee: Nippon Leakless Industry Co., Ltd.Inventors: Yoshitaka Matsushita, Yuji Takahashi, Hideaki Harada