Patents by Inventor Yoshitaka MINAKATA

Yoshitaka MINAKATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912011
    Abstract: One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 ?m or less.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: February 27, 2024
    Assignee: Denka Company Limited
    Inventors: Yoshitaka Minakata, Tomoya Yamaguchi, Saori Inoue
  • Publication number: 20230366829
    Abstract: One aspect of the present disclosure is a method for evaluating adhesiveness performance and heat radiation performance of a composite including a porous sintered ceramic component and a semi-cured product of a resin filled into pores of the sintered ceramic component, including a step of emitting ultraviolet rays to the surface of the semi-cured product of the composite; a step of measuring an emission intensity of fluorescence generated from the semi-cured product; and a step of evaluating adhesiveness performance and heat radiation performance of the composite using the value of the emission intensity.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 16, 2023
    Applicant: Denka Company Limited
    Inventors: Yusuke WAKUDA, Yoshitaka MINAKATA, Shinya SAKAGUCHI, Tomoya YAMAGUCHI, Koki IKARASHI, Koji NISHIMURA
  • Publication number: 20230365471
    Abstract: One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the curing rate of the resin is 10 to 70%.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 16, 2023
    Applicant: Denka Company Limited
    Inventors: Yusuke WAKUDA, Yoshitaka MINAKATA, Shinya SAKAGUCHI, Tomoya YAMAGUCHI, Koki IKARASHI, Koji NISHIMURA
  • Publication number: 20230357090
    Abstract: One aspect of the present disclosure provides a composite sheet including a porous sintered ceramic component having a thickness of less than 2 mm and a resin filled into pores of the sintered ceramic component, wherein the resin is a semi-cured product of a resin composition including a compound having a cyanate group and the content of triazine rings in the resin is 0.6 to 4.0 mass %.
    Type: Application
    Filed: September 28, 2021
    Publication date: November 9, 2023
    Applicant: Denka Company Limited
    Inventors: Yusuke WAKUDA, Yoshitaka MINAKATA, Shinya SAKAGUCHI, Tomoya YAMAGUCHI, Koki IKARASHI, Koji NISHIMURA
  • Publication number: 20230357089
    Abstract: Provided is a composite sheet including a porous nitride sintered body having a thickness of less than 2 mm and a resin filled in pores of the nitride sintered body, wherein a filling rate of the resin is 85% by volume or more. Provided is a method for manufacturing a composite sheet including an impregnation step of impregnating pores of a porous nitride sintered body having a thickness of less than 2 mm with a resin composition having a viscosity of 10 to 500 mPa·s to obtain a resin-impregnated body, and a curing step of heating the resin-impregnated body to semi-cure the resin composition filled in the pores.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 9, 2023
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Yusuke WAKUDA, Masahide KANEKO, Shinya SAKAGUCHI, Tomoya YAMAGUCHI
  • Publication number: 20230348335
    Abstract: A composite sheet includes porous a nitride sintered body having a thickness of less than 2 mm and resins filled in pores of the nitride sintered body, and has a main surface having a maximum height roughness Rz of less than 20 ?m. A method for manufacturing the composite sheet includes an impregnating step of impregnating pores of a porous the nitride sintered body having a thickness of less than 2 mm with a resin composition, a smoothing step of smoothing the resin composition attached to a main surface of the nitride sintered body to obtain a resin-impregnated body in which a part of the main surface is exposed, and a curing step of heating the resin-impregnated body to cure or semi-cure the resin composition impregnated in the pores to obtain the composite sheet.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 2, 2023
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Yusuke WAKUDA, Masahide KANEKO, Shinya SAKAGUCHI, Tomoya YAMAGUCHI
  • Publication number: 20230141729
    Abstract: Provided is a method for manufacturing a composite body, the method including: a nitriding step of firing a boron carbide powder in a nitrogen atmosphere to obtain a fired product containing boron carbonitride; a sintering step of molding and heating a blend containing the fired product and a sintering aid to obtain a boron nitride sintered body including boron nitride particles and pores; and an impregnating step of impregnating the boron nitride sintered body with a resin composition, the composite body having the boron nitride sintered body and a resin filled in at least some of the pores of the boron nitride sintered body.
    Type: Application
    Filed: March 30, 2021
    Publication date: May 11, 2023
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Yusuke WAKUDA, Shinya SAKAGUCHI, Tomoya YAMAGUCHI, Koji NISHIMURA
  • Publication number: 20220410530
    Abstract: One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 ?m or less.
    Type: Application
    Filed: October 21, 2020
    Publication date: December 29, 2022
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Tomoya YAMAGUCHI, Saori INOUE
  • Patent number: 11492299
    Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: November 8, 2022
    Assignee: DENKA COMPANY LIMITED
    Inventors: Yoshitaka Minakata, Eri Sasaki, Toshitaka Yamagata, Saori Inoue, Ryo Yoshimatu, Ryuji Koga
  • Publication number: 20220250994
    Abstract: One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.
    Type: Application
    Filed: March 26, 2020
    Publication date: August 11, 2022
    Applicant: Denka Company Limited
    Inventors: Saori INOUE, Shoji IWAKIRI, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA, Tomoya YAMAGUCHI
  • Publication number: 20220194870
    Abstract: The present disclosure provides a composite including a nitride sintered body having a porous structure and a semi-cured product of a heat-curable composition impregnated into the nitride sintered body, wherein a dielectric breakdown voltage obtainable after disposing the composite between adherends, heating and pressurizing the composite for 5 minutes under the conditions of 200° C. and 10 MPa, and further heating the composite for 2 hours under the conditions of 200° C. and atmospheric pressure, is greater than 5 kV.
    Type: Application
    Filed: March 25, 2020
    Publication date: June 23, 2022
    Applicant: Denka Company Limited
    Inventors: Yoshitaka MINAKATA, Eri SASAKI, Saori INOUE, Mana OKI
  • Publication number: 20220177375
    Abstract: One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 ?m or less.
    Type: Application
    Filed: March 26, 2020
    Publication date: June 9, 2022
    Applicant: Denka Company Limited
    Inventors: Saori INOUE, Shoji IWAKIRI, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA, Tomoya YAMAGUCHI
  • Patent number: 11034623
    Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 15, 2021
    Assignee: DENKA COMPANY LIMITED
    Inventors: Saori Inoue, Toshitaka Yamagata, Yoshitaka Minakata, Ryo Yoshimatsu, Ryuji Koga
  • Publication number: 20210032171
    Abstract: A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.
    Type: Application
    Filed: December 5, 2018
    Publication date: February 4, 2021
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yoshitaka MINAKATA, Eri SASAKI, Toshitaka YAMAGATA, Saori INOUE, Ryo YOSHIMATU, Ryuji KOGA
  • Publication number: 20200406586
    Abstract: A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.
    Type: Application
    Filed: March 6, 2019
    Publication date: December 31, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Yoshitaka MINAKATA, Toshitaka YAMAGATA, Saori INOUE, Ryo YOSHIMATU, Ryuji KOGA
  • Publication number: 20200031723
    Abstract: A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.
    Type: Application
    Filed: March 28, 2018
    Publication date: January 30, 2020
    Applicant: DENKA COMPANY LIMITED
    Inventors: Saori INOUE, Toshitaka YAMAGATA, Yoshitaka MINAKATA, Ryo YOSHIMATSU, Ryuji KOGA