Patents by Inventor Yoshitaka Nagayama

Yoshitaka Nagayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device for sensing strain on a substrate
    Patent number: 5483106
    Abstract: In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.
    Type: Grant
    Filed: July 29, 1994
    Date of Patent: January 9, 1996
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masashi Echigo, Yoshitaka Nagayama, Takushi Maeda, Toshitaka Yamada, Masahiko Kitano