Abstract: An electrode assembly is accommodated in a case and has an electrode tab. A current collector is joined to the electrode tab. The electrode tab has a stacking structure of a metal foil. A burring-processed portion is formed at least in the current collector of the electrode tab and the current collector, a width of the burring-processed portion in a direction orthogonal to a stacking direction of the metal foil being narrower from the current collector toward the electrode tab along the stacking direction. A laser-welded portion at which the electrode tab and the current collector are joined to each other is formed on the electrode tab side with the electrode tab and the current collector being arranged side by side in the stacking direction.

Abstract: Disclosed is a highly practical composition for under layers which enables to form a good undercut profile without causing a intermixing layer between an upper layer resist and an under layer film in a bi-layer photoresist process. Also disclosed is a method for forming a resist pattern. Specifically disclosed is a composition for under layer organic films for forming a resist pattern having an undercut profile on a substrate by exposing and developing a bi-layer film through a mask which bi-layer film is formed on the substrate and composed of an under layer organic film and an upper layer positive resist film. Such a composition for under layer organic films comprises an alkali-soluble resin (A) obtained by condensing a phenol component (A1) which is a mixture of 3-methylphenol and 4-methylphenol and an aldehyde component (A2) comprising an aromatic aldehyde and formaldehyde, and a solvent (B).

Abstract: Disclosed is a composition for removing a photoresist which contains a reaction product of a primary or secondary organic amine having a hydroxyl group with an ethylene carbonate, propylene carbonate, ?-butylolactone, 1,3-dihydroxy-2-propanone, or a monovalent or divalent carboxylic acid, if necessary an organic amine, and a water-soluble organic solvent and/or water. This composition is capable of removing a photoresist with high performance and preventing corrosion of a metal wiring material. By using such a composition, there occurs no problem such that impurities precipitate and adhere to the substrate or the like during water rinsing after removal.

Abstract: A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing solution prepared from the material powder on-site is supplied to the processing apparatus. To reduce an increase in the microorganism concentration in the ultrapure water, this ultrapure water is circulated substantially constantly. This suppresses deterioration and concentration fluctuations of a processing solution for use in processing of a semiconductor substrate, when this processing solution is supplied to the use side. This also reduces particles and improves the economical efficiency.

Abstract: A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing solution prepared from the material powder on-site is supplied to the processing apparatus. To reduce an increase in the microorganism concentration in the ultrapure water, this ultrapure water is circulated substantially constantly. This suppresses deterioration and concentration fluctuations of a processing solution for use in processing of a semiconductor substrate, when this processing solution is supplied to the use side. This also reduces particles and improves the economical efficiency.

Abstract: In a semiconductor manufacturing process or a liquid crystal board manufacturing process, a resist stripping solution blending an organic alkali and an organic solvent is used for stripping the resist completely from the board. An apparatus for controlling this resist stripping solution comprises a resist stripping solution discharge device for discharging the resist stripping solution by detecting the dissolved resist concentration in the resist stripping solution by using an absorption photometer, a source solution and water replenishing device for replenishing the resist stripping source solution and pure water by detecting the liquid level of the resist stripping solution by a liquid level gauge, and a source solution and/or water replenishing device for replenishing at least one of the resist stripping source solution pure water by detecting the water concentration of the resist stripping solution by using an another absorption photometer.