Abstract: A cell picking device includes a stage, a sucker, a driver, a work content receiver, a registrar and a device controller. A sample container is placed on the stage. The driver is provided to execute sample scraping work and sample sucking work using a pipette tip attached to the sucker. In a case in which selection of work contents of the driver is received by the work content receiver, a work procedure including the received work contents of the driver is registered by the registrar. The work of the driver is controlled by the device controller in accordance with the registered work procedure.

Abstract: A cell collecting device include a pipette tip that sucks substances in a cell culture container, a first valve connected to the pipette tip through a first flow path, a first pump connected to the first valve through a second flow path, and a second pump connected to the first valve through a third flow path. In a remove mode, the first valve is switched to connect the first flow path and the second flow path to each other and disconnect the third flow path, and the first pump is driven to discharge waste in the cell culture container, that has been sucked from the pipette tip, from a drain of the first pump through the first flow path and the second flow path, and in a picking mode, the first valve is switched to connect the first flow path and the third flow path to each other and disconnect the second flow path, and the second pump is driven to suck cells in the cell culture container using the pipette tip.

Abstract: A cell picking device includes a sucker having a pipette tip attached to a tip portion of the sucker and is used to suck the cell from a tip of the pipette tip, a driver configured to cause the sucker to perform a suction operation and move the sucker in a horizontal-plane direction and an axial direction of the pipette tip with the sucker inclined with respect to a vertical direction. A controller moves the sucker such that the tip of the pipette tip moves in a horizontal direction while being in contact with a bottom surface of the container installed on the sample mounting stage in a predetermined position on the sample mounting stage to desorb a cell arranged in the predetermined position from the bottom surface of the container, and suck the cell desorbed from the bottom surface of the container from the tip of the pipette tip.

Abstract: A semiconductor device production method includes performing trench etching to form a trench in a thickness direction of a semiconductor layer so that both of a first pattern portion and a second pattern portion whose side walls face each other across the trench are formed. In the trench etching, the semiconductor layer is etched and removed while a protective film is formed on a surface of the semiconductor layer, and the trench etching is performed so that the first pattern portion and the second pattern portion are configured to have a same potential or a same temperature during the trench etching.

Abstract: A semiconductor device production method includes performing trench etching to form a trench in a thickness direction of a semiconductor layer so that both of a first pattern portion and a second pattern portion whose side walls face each other across the trench are formed. In the trench etching, the semiconductor layer is etched and removed while a protective film is formed on a surface of the semiconductor layer, and the trench etching is performed so that the first pattern portion and the second pattern portion are configured to have a same potential or a same temperature during the trench etching.

Abstract: There is provided a pedal apparatus in which connection bracket is prevented from falling off from a pedal arm even if there is a welding defect. A pedal apparatus includes a pedal arm provided with an inclined portion, an upper retaining hole, and a lower retaining hole passing therethrough. A connection bracket, having a connecting face, an upper attachment face, a lower attachment face, an upper retaining projection and a lower retaining projection, is coupled with the pedal arm, with the upper retaining projection and the lower retaining projection respectively passing through the upper retaining hole and the lower retaining hole. Each edge of the upper attachment face and the lower attachment face is welded to the inclined portion of the pedal arm.

Abstract: A trench is etched in a semiconductor wafer by turning a first introduced gas introduced into a reaction chamber into plasma. A protection film is formed on a wall surface of the trench by turning a second introduced gas introduced into the reaction chamber into plasma. The protection film formed on a bottom surface of the trench is removed by turning a third introduced gas introduced into the reaction chamber into plasma. The reaction chamber is evacuated after the protection film formed on the bottom surface of the trench is removed.

Abstract: A trench is etched in a semiconductor wafer by turning a first introduced gas introduced into a reaction chamber into plasma. A protection film is formed on a wall surface of the trench by turning a second introduced gas introduced into the reaction chamber into plasma. The protection film formed on a bottom surface of the trench is removed by turning a third introduced gas introduced into the reaction chamber into plasma. The reaction chamber is evacuated after the protection film formed on the bottom surface of the trench is removed.

Abstract: In a manufacturing method of a semiconductor device, a depression is formed in a semiconductor substrate made of silicon or silicon compound semiconductor, and foreign substances including a protection layer in the depression is removed with a cleaning solution. The cleaning solution includes a mixed solution of hydrogen peroxide water to which a chelator is added, a basic solution, and water.

Abstract: A vial feed device is equipped with a feed arm, which is positioned between a vial tray and an oven and below either of them and having a feeding housing unit and a cooling housing unit, and a vial up-and-down moving mechanism for placing and removing vials in and from vial tray and oven. Feed arm is rotationally driven by a drive motor to move a feeding housing unit, a cooling housing unit and up-and-down moving mechanism toward vial tray or oven. High-temperature vials in oven are housed in cooling housing unit until cooling time T elapses. After cooling time T elapses, cooling housing unit is moved to a lower part of vial tray by feed arm, to be returned to vial tray by up-and-down moving mechanism.

Abstract: A chassis frame (1) including connection members (13) each configured by a pipe that is connected to a vehicle body frame. Each connection member (13) is provided with an attachment part (2) at an end of the pipe. The attachment part (2) includes a flat attachment face (21) formed by flatly crashing an end of the pipe to form the overlapped portion where a plate of the pipe is overlapped. The flat attachment face (21) is provided on a center in left and right direction of the overlapped portion. A shape of the end of the pipe is a substantially gate shape in its cross section. The attachment part (2) further includes longitudinal ribs (22) bending from the flat attachment face (21) to both left and right sides of the overlapped portion.

Abstract: A chassis frame (1) including connection members (13) each configured by a pipe that is connected to a vehicle body frame. Each connection member (13) is provided with an attachment part (2) at an end of the pipe. The attachment part (2) includes a flat attachment face (21) formed by flatly crashing an end of the pipe to form the overlapped portion where a plate of the pipe is overlapped. The flat attachment face (21) is provided on a center in left and right direction of the overlapped portion. A shape of the end of the pipe is a substantially gate shape in its cross section. The attachment part (2) further includes longitudinal ribs (22) bending from the flat attachment face (21) to both left and right sides of the overlapped portion.

Abstract: A vial feed device is equipped with a feed arm, which is positioned between a vial tray and an oven and below either of them and having a feeding housing unit and a cooling housing unit, and a vial up-and-down moving mechanism for placing and removing vials in and from vial tray and oven. Feed arm is rotationally driven by a drive motor to move a feeding housing unit, a cooling housing unit and up-and-down moving mechanism toward vial tray or oven. High-temperature vials in oven are housed in cooling housing unit until cooling time T elapses. After cooling time T elapses, cooling housing unit is moved to a lower part of vial tray by feed arm, to be returned to vial tray by up-and-down moving mechanism.

Abstract: In a manufacturing method of a semiconductor device, a depression is formed in a semiconductor substrate made of silicon or silicon compound semiconductor, and foreign substances including a protection layer in the depression is removed with a cleaning solution. The cleaning solution includes a mixed solution of hydrogen peroxide water to which a chelator is added, a basic solution, and water.

Abstract: A pedal device for a vehicle in which a support member for rotatably supporting a pedal arm is mounted on a dash panel positioned forward of a deck cross member. The pedal arm is pivotally attached to the support member by a pedal-rotating shaft inserted through a pedal shaft hole formed in the support member, and this support member has a pivotal impact lever which is provided above the pedal arm and forward of the deck cross member and brought down toward the pedal-rotating shaft.

Abstract: An optical device includes a semiconductor substrate and an optical part having a plurality of columnar members disposed on the substrate. Each columnar member is disposed in a standing manner and adhered each other so that the optical part is provided. The optical part is integrated with the substrate. This optical part has high design freedom.

Abstract: In a manufacturing method of a semiconductor device, a trench is formed in a semiconductor substrate by an anisotropic dry etching so as to have an aspect ratio greater than or equal to 10, and a damaged layer that is generated in a wall and a bottom of the trench due to the anisotropic dry etching is removed by an isotropic dry etching. The isotropic dry etching is performed with a first gas including carbon and fluorine and a second gas including oxygen. A temperature of the semiconductor substrate is controlled so that the damaged layer is removed from a whole surface of the wall and the bottom in the isotropic dry etching.

Abstract: An optical device includes a semiconductor substrate and an optical part having a plurality of columnar members disposed on the substrate. Each columnar member is disposed in a standing manner and adhered each other so that the optical part is provided. The optical part is integrated with the substrate. This optical part has high design freedom.

Abstract: An optical device includes a semiconductor substrate and an optical part having a plurality of columnar members disposed on the substrate. Each columnar member is disposed in a standing manner and adhered each other so that the optical part is provided. The optical part is integrated with the substrate. This optical part has high design freedom.

Abstract: A collapsible telescopic steering apparatus includes a steering column having an outer tube and an inner tube. The tubes can be switched between a press-fit state and a loose-fit state. The position of a steering wheel is adjusted by way of relative sliding movement of the loose-fitted tubes along an axial direction thereof. A shock absorbing projection is provided on at least one of an inner periphery of the outer tube and an outer periphery of the inner tube, as confronting to the counterpart tube. The shock absorbing projection is normally spaced away from the counterpart tube but is deformed as pressed against the counterpart tube in association with relative sliding movement of the press-fitted tubes upon collision, thereby absorbing the shock of the collision.