Abstract: A display element and electronic element module according to the present invention is described, in which a lens is formed as part of a translucent support substrate having a display disposed thereon, the lens being formed on a part other than where the display is disposed, where an electronic element is disposed for the lens.

Abstract: Provided is an encryption device with enhanced function to prevent an encryption key from being decrypted by consumption current analysis, by complicating alignment of consumption current waveforms. The encryption device comprises a clock control circuit adapted to receive a clock signal and a pseudo-random number, and perform a suspend process and a resume process to the clock signal based on the pseudo-random number to generate an encryption processor clock signal; an encryption processor adapted to perform an encryption process to encryption target data in synchronization with the encryption processor clock signal; and a current control circuit adapted to obtain an arithmetic state showing an operational state of the encryption processor to adjust a consumption current amount based on the arithmetic state.

Abstract: A display element and electronic element module according to the present invention is described, in which a lens is formed as part of a translucent support substrate having a display disposed thereon, the lens being formed on a part other than where the display is disposed, where an electronic element is disposed for the lens.

Abstract: Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.

Abstract: Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.