Patents by Inventor Yoshitaka Oshima

Yoshitaka Oshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7792495
    Abstract: A radio apparatus, a transmission control method and a transmission control program are provided in which both of adaptive array processing and adaptive modulation are supported and a transmission directivity control scheme can be selected according to a modulation scheme.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: September 7, 2010
    Assignee: Kyocera Corporation
    Inventors: Yoshitaka Oshima, Toshinori Iinuma
  • Publication number: 20070298826
    Abstract: A radio apparatus, a transmission control method and a transmission control program are provided in which both of adaptive array processing and adaptive modulation are supported and a transmission directivity control scheme can be selected according to a modulation scheme.
    Type: Application
    Filed: November 8, 2005
    Publication date: December 27, 2007
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Yoshitaka Oshima, Toshinori Iinuma
  • Publication number: 20060224080
    Abstract: In a body fat measuring apparatus, a constant electric-current is flowed between hand electric-current electrodes and leg electric-current electrodes. From two detected voltages generated between an annular-shaped voltage electrode placed on an abdominal portion and two voltage electrodes placed at the both sides of a lumbar portion, two abdominal impedances are determined. Two electric-current electrodes and two voltage electrodes are placed such that they are spaced apart by a small interval from one another at an umbilicus portion. A constant electric current is flowed between the two electric-current electrodes and the impedance in the vicinity of the subcutaneous of the abdominal portion is determined from the detected voltage generated between the two voltage electrodes. From the two abdominal impedances, the impedance in the vicinity of the subcutaneous of the abdominal portion, and the input physique information, a viscera impedance is calculated.
    Type: Application
    Filed: March 28, 2006
    Publication date: October 5, 2006
    Applicant: OMRON HEALTHCARE Co. Ltd.
    Inventors: Shojiro Oku, Toshikazu Shiga, Yoshitaka Oshima
  • Patent number: 6918808
    Abstract: A discharge lamp arc tube in which a pair of electrode assemblies each having an electrode rod, a sheet of molybdenum foil and a lead wire integrally series-connected to one another have respective molybdenum foil containing regions pinch-sealed with glass, and electrodes are disposed opposite to each other in a closed glass bulb containing a light emitting substance or the like enclosed therein. The surface of the sheet of molybdenum foil sealed at each of the pinch seal portions has a micro-asperity surface roughened by an etching treatment including oxidation and reduction, so that silica glass is closely packed in the micro-asperity of the surface of the sheet of molybdenum foil. As a result, the adhesion (mechanical bonding strength) in the interface between silica glass and molybdenum foil is improved so that foil rising is suppressed and, accordingly, the lifetime of the arc tube is extended.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: July 19, 2005
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Takeshi Fukuyo, Yoshitaka Oshima, Shinichi Irisawa
  • Patent number: 6555836
    Abstract: A method of inspecting bumps provided on a surface of an object to be inspected includes the steps of: (a) irradiating a first irradiation beam on said object in an oblique direction and (b) imaging a first reflected beam from said object so as to obtain a first reflection image including a first reflection region and a height data of said bump corresponding to said first regular reflection region produced by a part of the first reflected beam reflected near an apex of the bump. The method further includes the steps of (c) shifting a position of said first regular reflection region in said first reflection image in accordance with a value derived from said height data and said predetermined angle, (d) extracting said first regular reflection region within a predetermined region from said first reflection image after said step c), and (e) detecting a height of said bump based on said height data corresponding to the extracted first regular reflection region.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: April 29, 2003
    Assignee: Fujitsu Limited
    Inventors: Fumiyuki Takahashi, Hiroyuki Tsukahara, Yoshitaka Oshima, Youji Nishiyama, Takashi Fuse
  • Publication number: 20030048078
    Abstract: A discharge lamp arc tube in which a pair of electrode assemblies each having an electrode rod, a sheet of molybdenum foil and a lead wire integrally series-connected to one another have respective molybdenum foil containing regions pinch-sealed with glass, and electrodes are disposed opposite to each other in a closed glass bulb containing a light emitting substance or the like enclosed therein. The surface of the sheet of molybdenum foil sealed at each of the pinch seal portions has a micro-asperity surface roughened by an etching treatment including oxidation and reduction, so that silica glass is closely packed in the micro-asperity of the surface of the sheet of molybdenum foil. As a result, the adhesion (mechanical bonding strength) in the interface between silica glass and molybdenum foil is improved so that foil rising is suppressed and, accordingly, the lifetime of the arc tube is extended.
    Type: Application
    Filed: September 5, 2002
    Publication date: March 13, 2003
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Takeshi Fukuyo, Yoshitaka Oshima, Shinichi Irisawa
  • Patent number: 6104493
    Abstract: The bump height is measure din a sample area on a wafer, the bump height distribution on the wafer is estimated on the bases of the measured value, the portion where the estimated height distribution is out of a predetermined range is determined as an inspection area, and the bump height is measured in the inspection area, and a chip area having a bump height out of a predetermined range is judged to be defective. Data of the inspection areas and inspection results are accumulated, and the inspection density is renewed on the basis of the accumulated data. In another method, the inspection area is divided into rectangular blocks so that each block has a width of approximately equal to a light beam scanning length and a distance between any adjacent bumps in the feeding direction is less than a predetermined value, feeding path being perpendicular to the scanning direction.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: August 15, 2000
    Assignee: Fujitsu Limited
    Inventors: Takashi Fuse, Youji Nishiyama, Yoshitaka Oshima, Fumiyuki Takahashi, Hiroyuki Tsukahara
  • Patent number: 6052189
    Abstract: The object of the present invention is to provide a height measurement device that can accurately measure the height of an object to be measured, and that can easily and precisely adjust the focal point of an optical system.
    Type: Grant
    Filed: August 11, 1997
    Date of Patent: April 18, 2000
    Assignee: Fujitsu Limited
    Inventors: Takashi Fuse, Hiroyuki Tsukahara, Yoshitaka Oshima, Youji Nishiyama, Fumiyuki Takahashi
  • Patent number: 5999266
    Abstract: The present invention is a method for inspecting height, scanning the surface of a subject item having zones of different reflectance with incident light of a prescribed intensity, causing the reflected light from the surface to be imaged with means for detecting light spot positions, and detecting the height of said surface from the light spot position which was imaged, said method comprising: a step of scanning, in a second zone with low reflectance surrounding a first zone with high reflectance with a first intensity of incident light, which is low to the degree that said means for detecting light spot positions is not saturated even with said high reflectance; and a step of scanning, if it is detected that the quantity of light of the imaged light of said reflected light exceeds a prescribed threshold value, with an appropriate second intensity of incident light found from said intensity of incident light and said detected quantity of light at the time of the preceding scan.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: December 7, 1999
    Assignee: Fujitsu Limited
    Inventors: Fumiyuki Takahashi, Hiroyuki Tsukahara, Yoshitaka Oshima, Youji Nishiyama, Takashi Fuse
  • Patent number: 5298989
    Abstract: An optical system of inspecting bonding wires on a semiconductor by using a camera, focal length and depth adjusting unit, and an illumination device for irradiating brilliantly a desired portion of an inspection object with an illumination light. The focal length and depth adjusting means comprises a plurality of glass plates each having a different focal length and depth, and each bonding wire is inspected at a plurality of levels at a height position of the wire and at a plurality of portions thereof in its longitudinal direction to make a comparison between focal point evaluation quantities or feature quantities at each detected position so that wiring defects can be detected.
    Type: Grant
    Filed: March 8, 1991
    Date of Patent: March 29, 1994
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Tsukahara, Yoshitaka Oshima, Masato Nakashima
  • Patent number: 5243406
    Abstract: A method of measuring a wire-shaped object comprises a scanning step of scanning a light beam on the surface of the wire-shaped object, a detection step of detecting a reflected light reflected from the surface of the wire-shaped object by a plurality of optical sensor cells, the optical sensor cells being mounted on an inner wall of a reflected light detection unit located over the wire-shaped object; and a measurement step of measuring a three-dimensional configuration of the wire-shaped object in accordance with output signals from the plurality of optical sensor cells, whereby, the three-dimensional configuration of the wire-shaped object is automatically measured in a short time.
    Type: Grant
    Filed: July 3, 1991
    Date of Patent: September 7, 1993
    Assignee: Fujitsu Limited
    Inventors: Moritoshi Ando, Hiroyuki Tsukahara, Yoshitaka Oshima
  • Patent number: 5004929
    Abstract: An optical system for detecting the shape of a three-dimensional object comprising a collimating lens for converting a laser beam to a parallel beam of light, a scanning optical system which moves the parallel beam incident on the object in a direction normal to the object thereby to scan the object with a scanning beam, a mirror which is located in the vicinity of the scanning beam at a predetermined inclination angle with respect to the object, to reflect the beam reflected by the object in a predetermined direction as a reflection beam, an image forming lens which converges the reflection beam to a point and thereby producing an image of the object, and a first optical detector located at the point at which the reflection beam is converged to detect the converged beam spot.
    Type: Grant
    Filed: June 2, 1989
    Date of Patent: April 2, 1991
    Assignee: Fujitsu Limited
    Inventors: Yoshikazu Kakinoki, Masato Nakashima, Tetsuo Koezuka, Noriyuki Hiraoka, Hiroyuki Tsukahara, Yoshinori Suto, Yoshitaka Oshima, Shinji Hashinami