Patents by Inventor Yoshitaka Otsuka
Yoshitaka Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240047257Abstract: A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.Type: ApplicationFiled: October 4, 2023Publication date: February 8, 2024Inventor: Yoshitaka Otsuka
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Patent number: 11817338Abstract: A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.Type: GrantFiled: January 11, 2019Date of Patent: November 14, 2023Assignee: TOKYO ELECTRON LIMITEDInventor: Yoshitaka Otsuka
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Publication number: 20230086738Abstract: A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a moving unit configured to move the first holder and the second holder relative to each other; and a total thickness measurement controller configured to control a thickness detector, which is configured to measure a total thickness of the combined substrate, to measure the total thickness at multiple points.Type: ApplicationFiled: January 21, 2021Publication date: March 23, 2023Inventors: Tokutarou HAYASHI, Yoshitaka OTSUKA, Yasutaka MIZOMOTO, Kazuya IKEUE, Munehisa KODAMA
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Publication number: 20220415673Abstract: A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.Type: ApplicationFiled: September 28, 2020Publication date: December 29, 2022Inventors: Yoshitaka Otsuka, Shigeto Tsuruta, Yuji Mimura, Hiroshi Maeda, Eiji Manabe, Hisanori Hizume, Shinichi Shinozuka, Hironori Tanoue
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Patent number: 11417543Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.Type: GrantFiled: July 11, 2019Date of Patent: August 16, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshitaka Otsuka, Munehisa Kodama, Yutaka Yamasaki
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Patent number: 10985132Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.Type: GrantFiled: July 14, 2020Date of Patent: April 20, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
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Patent number: 10946419Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.Type: GrantFiled: December 5, 2018Date of Patent: March 16, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Yoshitaka Otsuka
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Publication number: 20210050243Abstract: A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.Type: ApplicationFiled: January 11, 2019Publication date: February 18, 2021Inventor: Yoshitaka Otsuka
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Patent number: 10882234Abstract: A mold includes: a fixed mold including a first mold plate; a movable mold including a second mold plate; and a molding cavity by combining the fixed mold and the movable mold with each other. At least one of the first and the second mold plates includes: a nest in a stepped pillar shape, the nest including a large diameter portion engaged in the insertion hole, and a small diameter portion in which a transfer surface to form an optical function surface of a molded product is formed; and an outer-diameter forming member in a stepped cylindrical shape, the outer-diameter forming member including a cylindrical portion arranged around the small diameter portion of the nest, and engaged in the insertion hole, and a flange portion in which a transfer surface to form an outer diameter portion of the molded product is formed.Type: GrantFiled: December 12, 2019Date of Patent: January 5, 2021Assignee: OLYMPUS CORPORATIONInventors: Yoshitaka Otsuka, Hiroshi Yonekubo
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Patent number: 10833045Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.Type: GrantFiled: May 25, 2018Date of Patent: November 10, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshitaka Otsuka, Munehisa Kodama, Takashi Terada
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Publication number: 20200343216Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.Type: ApplicationFiled: July 14, 2020Publication date: October 29, 2020Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
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Patent number: 10756046Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.Type: GrantFiled: August 28, 2019Date of Patent: August 25, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
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Publication number: 20200114557Abstract: A mold includes: a fixed mold including a first mold plate; a movable mold including a second mold plate; and a molding cavity by combining the fixed mold and the movable mold with each other. At least one of the first and the second mold plates includes: a nest in a stepped pillar shape, the nest including a large diameter portion engaged in the insertion hole, and a small diameter portion in which a transfer surface to form an optical function surface of a molded product is formed; and an outer-diameter forming member in a stepped cylindrical shape, the outer-diameter forming member including a cylindrical portion arranged around the small diameter portion of the nest, and engaged in the insertion hole, and a flange portion in which a transfer surface to form an outer diameter portion of the molded product is formed.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Applicant: OLYMPUS CORPORATIONInventors: Yoshitaka OTSUKA, Hiroshi YONEKUBO
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Publication number: 20200020553Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.Type: ApplicationFiled: July 11, 2019Publication date: January 16, 2020Inventors: Yoshitaka Otsuka, Munehisa Kodama, Yutaka Yamasaki
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Publication number: 20190385973Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.Type: ApplicationFiled: August 28, 2019Publication date: December 19, 2019Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
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Patent number: 10438920Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.Type: GrantFiled: November 27, 2017Date of Patent: October 8, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
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Publication number: 20190105691Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Inventors: Osamu HIRAKAWA, Yoshitaka OTSUKA
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Patent number: 10160015Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.Type: GrantFiled: April 4, 2016Date of Patent: December 25, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Osamu Hirakawa, Yoshitaka Otsuka
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Publication number: 20180342479Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.Type: ApplicationFiled: May 25, 2018Publication date: November 29, 2018Inventors: Yoshitaka Otsuka, Munehisa Kodama, Takashi Terada
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Patent number: 10022926Abstract: An injection molding method includes a supply step of simultaneously supplying molten resins to a cavity portion from two gate portions and an associating step of associating the molten resins supplied from the two gate portions in a central part of the cavity portion. The supply step supplies the molten resins to the cavity portion from the two gate portions which substantially face each other around the cavity portion. The associating step includes at least one of a first step in the supply step of simultaneously starting the supply of the molten resins to the cavity portion from the two gate portions, and a second step in the supply step of simultaneously starting the injection of the molten resins into the cavity portion from the two gate portions at the same injection rate.Type: GrantFiled: January 14, 2016Date of Patent: July 17, 2018Assignee: OLYMPUS CORPORATIONInventors: Masaki Otsuka, Koki Iwasawa, Shigeya Sugata, Yoshitaka Otsuka