Patents by Inventor Yoshitaka Otsuka

Yoshitaka Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10985132
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Patent number: 10946419
    Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: March 16, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Osamu Hirakawa, Yoshitaka Otsuka
  • Publication number: 20210050243
    Abstract: A bonding system includes a first holder and a second holder arranged to be spaced apart from each other in a vertical direction; a position adjuster configured to move the first holder and the second holder relatively to perform a position adjustment in a horizontal direction between a first substrate held by the first holder and a second substrate held by the second holder; a pressing unit configured to press the first substrate and the second substrate against each other; a measuring unit configured to measure a position deviation between an alignment mark on the first substrate and an alignment mark on the second substrate, the first substrate and the second substrate being bonded by the pressing unit; and a position adjustment controller configured to control the position adjustment in the horizontal direction in a currently-performed bonding processing based on the position deviation generated in a previously-performed bonding processing.
    Type: Application
    Filed: January 11, 2019
    Publication date: February 18, 2021
    Inventor: Yoshitaka Otsuka
  • Patent number: 10882234
    Abstract: A mold includes: a fixed mold including a first mold plate; a movable mold including a second mold plate; and a molding cavity by combining the fixed mold and the movable mold with each other. At least one of the first and the second mold plates includes: a nest in a stepped pillar shape, the nest including a large diameter portion engaged in the insertion hole, and a small diameter portion in which a transfer surface to form an optical function surface of a molded product is formed; and an outer-diameter forming member in a stepped cylindrical shape, the outer-diameter forming member including a cylindrical portion arranged around the small diameter portion of the nest, and engaged in the insertion hole, and a flange portion in which a transfer surface to form an outer diameter portion of the molded product is formed.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: January 5, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Yoshitaka Otsuka, Hiroshi Yonekubo
  • Patent number: 10833045
    Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 10, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Munehisa Kodama, Takashi Terada
  • Publication number: 20200343216
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10756046
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 25, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20200114557
    Abstract: A mold includes: a fixed mold including a first mold plate; a movable mold including a second mold plate; and a molding cavity by combining the fixed mold and the movable mold with each other. At least one of the first and the second mold plates includes: a nest in a stepped pillar shape, the nest including a large diameter portion engaged in the insertion hole, and a small diameter portion in which a transfer surface to form an optical function surface of a molded product is formed; and an outer-diameter forming member in a stepped cylindrical shape, the outer-diameter forming member including a cylindrical portion arranged around the small diameter portion of the nest, and engaged in the insertion hole, and a flange portion in which a transfer surface to form an outer diameter portion of the molded product is formed.
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Yoshitaka OTSUKA, Hiroshi YONEKUBO
  • Publication number: 20200020553
    Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.
    Type: Application
    Filed: July 11, 2019
    Publication date: January 16, 2020
    Inventors: Yoshitaka Otsuka, Munehisa Kodama, Yutaka Yamasaki
  • Publication number: 20190385973
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10438920
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190105691
    Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.
    Type: Application
    Filed: December 5, 2018
    Publication date: April 11, 2019
    Inventors: Osamu HIRAKAWA, Yoshitaka OTSUKA
  • Patent number: 10160015
    Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: December 25, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Osamu Hirakawa, Yoshitaka Otsuka
  • Publication number: 20180342479
    Abstract: A substrate processing apparatus 30 includes a first holding unit 200 configured to hold a processing target substrate W; a second holding unit 300 disposed to face the first holding unit 200 and configured to hold a support substrate S; and an ultraviolet irradiation unit 400 configured to irradiate an ultraviolet ray to an adhesive G provided between the processing target substrate W and the support substrate S. Each of the support substrate S and the second holding unit 300 is made of an ultraviolet transmissive material. An electrode 320 configured to electrostatically attract the support substrate S is provided within the second holding unit 300. A diffusion layer 330 configured to diffuse a transmission direction of the ultraviolet ray is provided at a position closer to the support substrate S between the support substrate S and the electrode 320 within the second holding unit 300.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Inventors: Yoshitaka Otsuka, Munehisa Kodama, Takashi Terada
  • Patent number: 10022926
    Abstract: An injection molding method includes a supply step of simultaneously supplying molten resins to a cavity portion from two gate portions and an associating step of associating the molten resins supplied from the two gate portions in a central part of the cavity portion. The supply step supplies the molten resins to the cavity portion from the two gate portions which substantially face each other around the cavity portion. The associating step includes at least one of a first step in the supply step of simultaneously starting the supply of the molten resins to the cavity portion from the two gate portions, and a second step in the supply step of simultaneously starting the injection of the molten resins into the cavity portion from the two gate portions at the same injection rate.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: July 17, 2018
    Assignee: OLYMPUS CORPORATION
    Inventors: Masaki Otsuka, Koki Iwasawa, Shigeya Sugata, Yoshitaka Otsuka
  • Publication number: 20180158796
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: November 27, 2017
    Publication date: June 7, 2018
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 9925705
    Abstract: Fixed side molding dies are removed from fixed side molding dies insertion hole portions in accordance with the disconnection in the connection/disconnection while maintaining a contact state that a second transfer portion is in contact with a portion other than a fixed side optical functional surface of each molded article at the time of mold opening of a fixed die and a movable die. Thereby a first transfer portion is released from the fixed side optical functional surface.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 27, 2018
    Assignee: Olympus Corporation
    Inventor: Yoshitaka Otsuka
  • Publication number: 20160296982
    Abstract: An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.
    Type: Application
    Filed: April 4, 2016
    Publication date: October 13, 2016
    Inventors: Osamu HIRAKAWA, Yoshitaka OTSUKA
  • Publication number: 20160129649
    Abstract: An injection molding method includes a supply step of simultaneously supplying molten resins to a cavity portion from two gate portions and an associating step of associating the molten resins supplied from the two gate portions in a central part of the cavity portion. The supply step supplies the molten resins to the cavity portion from the two gate portions which substantially face each other around the cavity portion. The associating step includes at least one of a first step in the supply step of simultaneously starting the supply of the molten resins to the cavity portion from the two gate portions, and a second step in the supply step of simultaneously starting the injection of the molten resins into the cavity portion from the two gate portions at the same injection rate.
    Type: Application
    Filed: January 14, 2016
    Publication date: May 12, 2016
    Applicant: OLYMPUS CORPORATION
    Inventors: Masaki OTSUKA, Koki IWASAWA, Shigeya SUGATA, Yoshitaka OTSUKA
  • Patent number: 9221222
    Abstract: In a molding die for multicolored molding, a second fixed die includes a hollow shape portion which is arranged at a portion associated with an optical functional surface. The second fixed die further includes an abutting portion which abuts on the optical element excluding the optical functional surface.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: December 29, 2015
    Assignee: Olympus Corporation
    Inventors: Yoshitaka Otsuka, Kazuhiro Kikumori, Akihiro Hatori