Abstract: A semiconductor element includes: a substrate having a first surface, a second surface, and at least one lateral surface; and a semiconductor layer formed on the second surface. The at least one lateral surface includes: at least one flat region, a first region that extends along a first direction parallel to the first surface at a position apart from the first surface and the second surface, wherein a surface roughness of the first region is larger than a surface roughness of the flat region, and a second region that extends along the first direction parallel to the first surface at a position between the first region and the first surface and apart from the first surface, wherein a surface roughness of the second region is larger than the surface roughness of the flat region. The substrate includes, in an interior of the substrate, a plurality of modified portions.

Abstract: A method of manufacturing a semiconductor element includes a first irradiation step in which a laser beam is irradiated to form, in the interior of the substrate, a plurality of first modified portions aligned along a first direction; a second irradiation step in which a laser beam is irradiated to form a plurality of second modified portions aligned along the first direction at a position adjacent to the plurality of first modified portions in the second direction; and a third irradiation step which a laser beam is irradiated to form a plurality of third modified portions aligned along the first direction at a position closer to the first surface than the first modified portions and overlapping the plurality of first modified portions in a thickness direction of the substrate.

Abstract: A method of manufacturing a semiconductor element includes a first irradiation step in which a laser beam is irradiated to form, in the interior of the substrate, a plurality of first modified portions aligned along a first direction; a second irradiation step in which a laser beam is irradiated to form a plurality of second modified portions aligned along the first direction at a position adjacent to the plurality of first modified portions in the second direction; and a third irradiation step which a laser beam is irradiated to form a plurality of third modified portions aligned along the first direction at a position closer to the first surface than the first modified portions and overlapping the plurality of first modified portions in a thickness direction of the substrate.

Abstract: A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.

Abstract: A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.

Abstract: A method of manufacturing a light emitting element includes: providing a wafer that includes a substrate having a first principal face and a second principal face, a dielectric multilayer film disposed on the first principal face, and a semiconductor structure disposed on the second principal face; forming modified regions in the substrate by focusing a laser beam inside the substrate via the dielectric multilayer film, and allowing cracks to form from the modified regions to the dielectric multilayer film; subsequent to forming the modified regions in the substrate, removing regions of the dielectric multilayer film that contain cracks; and cleaving the wafer along regions where cracks were formed in the substrate.

Abstract: A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.

Abstract: A data delivery system capable of reducing processing load of a server is provided. A control server includes a selecting unit selecting a TCU to which update data is to be delivered based on priority levels set in association with TCUs which are delivery targets, a message generating unit generating and transmitting a message inquiring as to whether or not the TCU is ready to accept update data to the TCU selected by the selecting unit, and a delivery control unit receiving a response message transmitted from the TCU in response to the transmitted message, selecting a TCU to which update data is to be delivered based on the received response message and requesting a delivery server to deliver update data to the selected TCU.

Abstract: A method of manufacturing a light-emitting element includes: providing a wafer including: a substrate, and a semiconductor structure; forming a plurality of modified regions inside the substrate of the wafer by irradiating the substrate with a laser beam; and separating the wafer into a plurality of light-emitting elements after said irradiating the substrate with the laser beam. Said forming the plurality of modified regions includes: scanning the laser beam along a plurality of first lines, the plurality of first lines extending in a first direction and being arranged in a second direction, the first direction being parallel to the first surface, the second direction intersecting the first direction and being parallel to the first surface, and scanning the laser beam along a plurality of second lines, the plurality of second lines extending in the second direction and being arranged in the first direction.

Abstract: A TCU is provided to resolve an abnormal state while minimizing loss of convenience for a user. The TCU which communicates with a server terminal providing service for a vehicle via a mobile telephone network for receiving provision of the service, includes a main control unit, and a communication module for communicating with the mobile telephone network. The main control unit resets an operation state of the communication module when communication for receiving the service is not available.

Abstract: A method of manufacturing a light emitting element includes: providing a wafer that comprises: a substrate having a first main surface and a second main surface, a dielectric multilayer film on the first main surface, and a semiconductor structure on the second main surface; focusing laser light onto an inner portion of the substrate from a first main surface side of the substrate, to simultaneously form a modified region in the substrate and remove a portion of the dielectric multilayer film; and cleaving the wafer at a portion where the modified region is formed to obtain a plurality of light emitting elements.

Abstract: A method of manufacturing a light emitting element includes: providing a wafer that includes a substrate having a first principal face and a second principal face, a dielectric multilayer film disposed on the first principal face, and a semiconductor structure disposed on the second principal face; forming modified regions in the substrate by focusing a laser beam inside the substrate via the dielectric multilayer film, and allowing cracks to form from the modified regions to the dielectric multilayer film; subsequent to forming the modified regions in the substrate, removing regions of the dielectric multilayer film that contain cracks; and cleaving the wafer along regions where cracks were formed in the substrate.

Abstract: To provide a data delivery system capable of reducing processing load of a server is provided. A control server 200 includes a selecting unit 215 selecting a TCU 300 to which update data is to be delivered based on priority levels set in association with TCUs 300 which are delivery targets, a message generating unit 216 generating and transmitting a message inquiring as to whether or not the TCU 300 is ready to accept update data to the TCU 300 selected by the selecting unit 215, and a delivery control unit 217 receiving a response message transmitted from the TCU 300 in response to the transmitted message, selecting a TCU 300 to which update data is to be delivered based on the received response message and requesting a delivery server 100 to deliver update data to the selected TCU 300.

Abstract: To resolve an abnormal state while minimizing loss of convenience for a user. A TCU 10 which communicates with a server terminal 7 providing service for a vehicle via a mobile telephone network 3 for receiving provision of the service, includes a main control unit 20, and a communication module 21 for communicating with the mobile telephone network 3, and the main control unit 20 resets an operation state of the communication module 21 when communication for receiving the service is not available.

Abstract: A communication device comprises: a free band calculation means that calculates a free band for Bluetooth™ communication based on a condition of communication with a communicating party's device; a service selection means that selects a service which can be assigned to the free band, from among a service group by a Bluetooth profile for making communication with the communicating party's device wireless, based on predetermined service selection information; a service assigning means that assigns the selected service to the free band; and a service control means that controls communication with the communicating party's device for the service assigned to the free band.

Abstract: When a power supply is cut off on updating programs, improper data remains since the power source to be supplied to the vehicle-mounted device is unstable. The check for the improper data and restoration processing are required for a reactivation processing implemented by an update processing unit so that the update is completed correctly, therefore, the user is waited. In contrast, the update processing also implemented by the update processing unit for a time period during which the power source becomes unstable is interrupted, and implemented for the time period during which the power source voltage is stable. The power source voltage is considered to be unstable based on a function of the vehicle speed, brake pedal actuation, parking brake actuation, and/or power source activation. In consequence, the update processing is carried on steadily without making the user wait.

Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer.

Abstract: The invention provides semiconductor light-emitting devices which have a semiconductor layer on a principal surface of a translucent substrate and a reflective layer on a second principal surface opposite to the principal surface having the semiconductor layer, which enables that the peeling of the reflective layer from the translucent substrate is suppressed. A semiconductor light-emitting device includes a first metal layer disposed in contact with a second principal surface of a translucent substrate, a second metal layer disposed in contact with at least the second principal surface or a side surface of the translucent substrate around the first metal layer, and a third metal layer disposed on the second metal layer. The first metal layer has a reflectance with respect to a peak wavelength of light emitted from an emitting layer higher than the reflectance of the second metal layer.

Abstract: When a power supply is cut off on updating programs, improper data remains since the power source to be supplied to the vehicle-mounted device is unstable. The check for the improper data and restoration processing are required for a reactivation processing implemented by an update processing unit so that the update is completed correctly, therefore, the user is waited. In contrast, the update processing also implemented by the update processing unit for a time period during which the power source becomes unstable is interrupted, and implemented for the time period during which the power source voltage is stable. In consequence, the update processing is carried on steadily without making the user wait.

Abstract: In a communication-type navigation system for downloading map data according to the present invention, a reduction in the amount of map information to be transferred, correction of a position measured by a GPS, and delivery of advertisements are effected. In this system, a terminal 5 stores rough map data in advance. Then, when detailed map data is required, it is downloaded from a map data delivery center to the terminal 5. Further, together with the map data, GPS correction information is delivered to the terminal 5 from the map data delivery center 80. Still further, coupon information associated with an advertisement is displayed and an electronic mail on the coupon information is issued, by the map data delivery center.