Patents by Inventor Yoshitaka Taniguchi
Yoshitaka Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973002Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.Type: GrantFiled: November 12, 2020Date of Patent: April 30, 2024Assignee: Denka Company LimitedInventors: Atsushi Sakai, Masaya Yumiba, Kentaro Nakayama, Yoshitaka Taniguchi
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Patent number: 11732173Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 ?m or more and 100 ?m or less.Type: GrantFiled: January 31, 2022Date of Patent: August 22, 2023Assignee: DENKA COMPANY LIMITEDInventors: Go Takeda, Yoshitaka Taniguchi
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Publication number: 20230220263Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 ?m or more, the diameter at the second is ? or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.Type: ApplicationFiled: June 11, 2021Publication date: July 13, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
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Publication number: 20230220262Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 ?m or more; the particle size at the second maximum point is ? or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 ?m and a thickness of 0.2 mm or less.Type: ApplicationFiled: June 11, 2021Publication date: July 13, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Kiyotaka FUJI, Yoshitaka TANIGUCHI
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Publication number: 20230052370Abstract: A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.Type: ApplicationFiled: March 18, 2021Publication date: February 16, 2023Applicant: DENKA COMPANY LIMITEDInventors: Kosuke WADA, Yoshitaka TANIGUCHI
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Patent number: 11570901Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.Type: GrantFiled: February 22, 2018Date of Patent: January 31, 2023Assignees: NATIONAL INSTITUTE FOR MATERIALS SCIENCE, DENKA COMPANY LIMITEDInventors: Seiji Kuroda, Hiroshi Araki, Akira Hasegawa, Makoto Watanabe, Atsushi Sakai, Yoshitaka Taniguchi, Suzuya Yamada
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Publication number: 20220406678Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.Type: ApplicationFiled: November 12, 2020Publication date: December 22, 2022Applicant: Denka Company LimitedInventors: Atsushi SAKAI, Masaya YUMIBA, Kentaro NAKAYAMA, Yoshitaka TANIGUCHI
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Publication number: 20220154060Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 ?m or more and 100 ?m or less.Type: ApplicationFiled: January 31, 2022Publication date: May 19, 2022Inventors: Go TAKEDA, Yoshitaka TANIGUCHI
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Patent number: 11268004Abstract: A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 ?m or more and 3.5 ?m or less and a standard deviation of 1.2 ?m or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 ?m or more and 100 ?m or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.Type: GrantFiled: August 31, 2017Date of Patent: March 8, 2022Assignee: DENKA COMPANY LIMITEDInventors: Go Takeda, Yoshitaka Taniguchi
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Patent number: 11160172Abstract: A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.Type: GrantFiled: January 16, 2018Date of Patent: October 26, 2021Assignee: DENKA COMPANY LIMITEDInventors: Atsushi Sakai, Yoshitaka Taniguchi, Suzuya Yamada
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Publication number: 20210261413Abstract: An aspect of the present disclosure provides aggregate boron nitride particles in which primary hexagonal boron nitride particles are aggregated, wherein an average value of an area proportion of the primary particles in a cross section is 45% or more, a standard deviation of the area proportion of the primary particles in a cross section is less than 25, and a crushing strength is 8.0 MPa or more.Type: ApplicationFiled: June 27, 2019Publication date: August 26, 2021Applicant: DENKA COMPANY LIMITEDInventors: Go TAKEDA, Yoshitaka TANIGUCHI
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Patent number: 11096278Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value ?1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10?6 to 9×10?6/K, a ratio ?1/?2 of the ?1 to a theoretical value ?2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.Type: GrantFiled: July 30, 2018Date of Patent: August 17, 2021Assignee: DENKA COMPANY LIMITEDInventors: Atsushi Sakai, Hideki Hirotsuru, Kohki Ichikawa, Yoshitaka Taniguchi
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Patent number: 11094648Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient ?1 (×10?6/K) of the base plate and a linear thermal expansion coefficient ?2 (×10?6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).Type: GrantFiled: July 30, 2018Date of Patent: August 17, 2021Assignee: DENKA COMPANY LIMITEDInventors: Hideki Hirotsuru, Yoshitaka Taniguchi, Kohki Ichikawa, Atsushi Sakai
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Publication number: 20210163288Abstract: A hexagonal boron powder having a purity of 98% by mass or more and a specific surface area of less than 2.0 m2/g.Type: ApplicationFiled: August 6, 2019Publication date: June 3, 2021Applicant: DENKA COMPANY LIMITEDInventors: Go TAKEDA, Masao TSUICHIHARA, Yoshitaka TANIGUCHI
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Publication number: 20200373251Abstract: A power module includes a base plate, a ceramic insulating substrate bonded on the base plate, and a semiconductor element bonded on the ceramic insulating substrate, wherein a surface of the base plate on a side opposite to the ceramic insulating substrate has a warp with a convex shape, and a linear thermal expansion coefficient ?1 (×10?6/K) of the base plate and a linear thermal expansion coefficient ?2 (×10?6/K) of the ceramic insulating substrate when a temperature decreases in the range of 25° C. to 150° C. satisfy the following Expression (1).Type: ApplicationFiled: July 30, 2018Publication date: November 26, 2020Applicant: DENKA COMPANY LIMITEDInventors: Hideki HIROTSURU, Yoshitaka TANIGUCHI, Kohki ICHIKAWA, Atsushi SAKAI
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Publication number: 20200375029Abstract: A ceramic circuit board includes a ceramic substrate and metal layers provided to both surfaces of the ceramic substrate and containing Al and/or Cu, wherein a measurement value ?1 of a linear thermal expansion coefficient at 25° C. to 150° C. is 5×10?6 to 9×10?6/K, a ratio ?1/?2 of the ?1 to a theoretical value ?2 of the linear thermal expansion coefficient at 25° C. to 150° C. is 0.7 to 0.95, and at least one of the metal layers forms a metal circuit.Type: ApplicationFiled: July 30, 2018Publication date: November 26, 2020Applicant: DENKA COMPANY LIMITEDInventors: Atsushi SAKAI, Hideki HIROTSURU, Kohki ICHIKAWA, Yoshitaka TANIGUCHI
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Patent number: 10752503Abstract: The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C): (A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (B) the spherical boron nitride fine powder has an average particle diameter of 0.05 ?m or more and 1 ?m or less; and (C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.Type: GrantFiled: August 31, 2017Date of Patent: August 25, 2020Assignee: DENKA COMPANY LIMITEDInventors: Go Takeda, Yoshitaka Taniguchi, Takemi Oguma
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Publication number: 20200247672Abstract: To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C): (A) a particle strength of the bulky particles at a cumulative breakdown rate of 63.2% is 5.0 MPa or more; (B) an average particle size of the boron nitride powder is 2 ?m or more and 20 ?m or less; and (C) an orientation index of the boron nitride powder as determined from X-ray diffraction is 20 or less.Type: ApplicationFiled: August 17, 2018Publication date: August 6, 2020Applicant: DENKA COMPANY LIMITEDInventors: Go TAKEDA, Michiharu NAKASHIMA, Yoshitaka TANIGUCHI
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Publication number: 20200128677Abstract: A method for producing a ceramic circuit board including a ceramic substrate and a metal circuit formed on the ceramic substrate. The disclosed method includes a step of forming the first metal layer in contact with the ceramic substrate by spraying a first metal powder containing at least either of aluminum particles or aluminum alloy particles together with an inert gas onto a surface of a ceramic substrate from a nozzle, in which the first metal powder is heated to from 10° C. to 270° C. and then ejected from the nozzle 10 and a gauge pressure of the inert gas at an inlet of the nozzle 10 is from 1.5 to 5.0 MPa, a step of subjecting the first metal layer to a heat treatment in an inert gas atmosphere, and the like.Type: ApplicationFiled: January 16, 2018Publication date: April 23, 2020Applicant: DENKA COMPANY LIMITEDInventors: Atsushi SAKAI, Yoshitaka TANIGUCHI, Suzuya YAMADA
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Publication number: 20200120809Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.Type: ApplicationFiled: February 22, 2018Publication date: April 16, 2020Applicants: NATIONAL INSTITUTE FOR MATERIALS SCIENCE, DENKA COMPANY LIMITEDInventors: Seiji KURODA, Hiroshi ARAKI, Akira HASEGAWA, Makoto WATANABE, Atsushi SAKAI, Yoshitaka TANIGUCHI, Suzuya YAMADA