Abstract: A micro-hotplate comprises a Si substrate having a cavity and a support layer over the cavity; at least an electrode; and a heater, both provided on the support layer. The electrode surrounds the heater and the heater is disposed inside the electrode. The power efficiency of the micro-hotplate is improved.

Abstract: A detection device includes a strainer that is provided within a flow channel through which lubricating oil flow, that includes a filter member which lets through at least some of the lubricating oil and filters out foreign matter in the lubricating oil, and that is moved in the lubricating oil flowing direction along with the accumulation of foreign matter in the filter member, a stroke sensor that senses movement of the strainer in the flowing direction, and a detection unit that detects the mixing of foreign matter in the lubricating oil on the basis of the strainer movement sensed by the stroke sensor.

Abstract: A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film.

Abstract: In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added.

Abstract: A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film.

Abstract: A cavity is provided in a substrate so as to penetrate from a front surface to a back surface of the substrate. A thin-film diaphragm for sensing acoustic vibrations above the substrate is provided over the cavity. At least one wall surface of the cavity is configured of a first inclined surface between the front surface of the substrate and a middle portion in the thickness direction, the first inclined surface gradually widening toward the outside of the substrate as the first inclined surface goes from the front surface of the substrate toward the middle portion, and a second inclined surface between the middle portion and the back surface of the substrate, the second inclined surface gradually narrowing toward the inside of the substrate as the second inclined surface goes from the middle portion toward the back surface of the substrate.

Abstract: A light guide includes a core made of material having translucency and an optical path conversion mirror for reflecting the signal light from the optical element and converting the optical path of the signal light formed on at least the core. The signal light is transmitted through the core by the reflection at the optical path conversion mirror. The optical path conversion mirror surface has an inclination angle ? formed with a bottom surface of the core changing in the X-direction in a cross-sectional shape in which the core is cut at a YZ plane, the Y-direction being an optical axis direction of the optical element, the Z-direction being an advancing direction of the signal light of the light guide, and the X-direction being a direction perpendicular to both the Y-direction and the Z-direction.

Abstract: In an acoustic sensor, a conductive vibrating membrane and a fixed electrode plate are disposed above a silicon substrate with an air gap provided therebetween, and the substrate has an impurity added to a surface thereof. A microphone includes an acoustic transducer; and an acquiring section that acquires a change in pressure as detected by the acoustic transducer. A method for manufacturing an acoustic transducer including a semiconductor substrate, a vibrating membrane, which is conductive, and a fixed electrode plate and detecting a pressure according to a change in capacitance between the vibrating membrane and the fixed electrode plate, the method includes an impurity adding step of adding an impurity to a surface of the semiconductor substrate; and a forming step of forming the vibrating membrane and the fixed electrode plate above the semiconductor substrate to which the impurity has been added.

Abstract: An optical wiring mounted on an electronic device has a light transmission path for transmitting an optical signal. A function layer that reduces friction generated when coming in contact with a structural body in the electronic device to lower than when the light transmission path comes in contact with the structural body, and that bends according to deformation of the light transmission path, is arranged.

Abstract: A light guide includes a core made of material having translucency and an optical path conversion mirror for reflecting the signal light from the optical element and converting the optical path of the signal light formed on at least the core. The signal light is transmitted through the core by the reflection at the optical path conversion mirror. The optical path conversion mirror surface has an inclination angle ? formed with a bottom surface of the core changing in the X-direction in a cross-sectional shape in which the core is cut at a YZ plane, the Y-direction being an optical axis direction of the optical element, the Z-direction being an advancing direction of the signal light of the light guide, and the X-direction being a direction perpendicular to both the Y-direction and the Z-direction.

Abstract: An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.

Abstract: An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.