Abstract: A substrate processing apparatus and method provide for exhausting air from a first peripheral region ? around a substrate undergoing processing, and for exhausting air from a second peripheral region ? between the first peripheral region and the substrate. The method reduces the effects of air flow on a developing solution on the substrate, and enables the developing solution to act effectively on the exposed resist on the substrate.

Abstract: A substrate processing apparatus of the invention has a self-propelled carrying mechanism 15 configured to enable a processing target substrate W to be carried to/from each of liquid processing apparatuses HB, COT and DEV where at least two liquid processing apparatuses W are linearly disposed and to be movable in parallel with an arrangement direction of the liquid processing apparatuses HB, COT and DEV, substrate delivering/receiving mechanism 20 and 21 configured to enable the processing target substrate W to be delivered and received to/from the self-propelled carrying mechanism 15, and a non-self-propelled carrying mechanism 10 configured to enable the processing target substrate to be delivered and received to/from the substrate delivering/receiving mechanisms 20 and 21.

Abstract: A substrate processing apparatus has at least one of a developing processing apparatus that supplies a developing solution as a processing solution to a non-processed substrate to process and a resist coating processing apparatus that supplies a resist solution as a processing solution to the non-processed substrate. A transfer mechanism enables the non-processed substrate to be transferred to the developing processing apparatus and/or the resist coating processing apparatus. In a substrate processing method processes, an exposed resist is developed on a processing surface of the non-processed substrate inside a cup mechanism of the developing processing apparatus, and a resist solution is supplied to the processing surface of the non-processed substrate inside a cup mechanism of a resist coating processing apparatus. the non-processed substrate is transferred to the developing processing apparatus or the resist coating processing apparatus.

Abstract: A substrate processing method for performing development on an exposed resist on a processing target substrate, and an apparatus thereof. A developing solution is supplied to the processing target substrate to fill the solution on the processing target substrate to cause development of the exposed resist on the processing target substrate. The rinse solution is supplied onto a processing surface of the processing target substrate while rotating the processing target substrate, and the rinse solution is supplied onto the backside of the processing target substrate while rotating the processing target substrate.

Abstract: A substrate processing apparatus has at least one of a developing processing apparatus that supplies a developing solution as a processing solution to a non-processed substrate to process and a resist coating processing apparatus that supplies a resist solution as a processing solution to the non-processed substrate. A transfer mechanism enables the non-processed substrate to be transferred to the developing processing apparatus and/or the resist coating processing apparatus. In a substrate processing method processes, an exposed resist is developed on a processing surface of the non-processed substrate inside a cup mechanism of the developing processing apparatus, and a resist solution is supplied to the processing surface of the non-processed substrate inside a cup mechanism of a resist coating processing apparatus. the non-processed substrate is transferred to the developing processing apparatus or the resist coating processing apparatus.

Abstract: Since it is possible to exhaust air from a first peripheral region ? around a substrate undergoing processing and further exhaust air from a second peripheral region ? between the first peripheral region and the substrate, it is possible to reduce the effects of air flow on a developing solution on a substrate, and to enable the developing solution used in development processing to act effectively on the exposed resist on the substrate.

Abstract: A substrate processing apparatus and method provide for exhausting air from a first peripheral region ? around a substrate undergoing processing, and for exhausting air from a second peripheral region ? between the first peripheral region and the substrate. The method reduces the effects of air flow on a developing solution on the substrate, and enables the developing solution to act effectively on the exposed resist on the substrate.

Abstract: Since it is possible to exhaust air from a first peripheral region &agr; around a substrate undergoing processing and further exhaust air from a second peripheral region &bgr; between the first peripheral region and substrate, it is possible to reduce effects of the current of air on a developing solution on a substrate and to cause the developing solution used in development processing to act on the exposed resist on the substrate properly.