Abstract: The first annular sealing material is filled and applied between a first sealing surface provided on an outer peripheral part of the case and a second sealing surface provided on an outer peripheral part of the cover, a second annular sealing material is filled and applied between a first fitting member provided at the opening of the sealed housing and a second fitting member provided at the outer periphery of the body of the connector housing, a terminal part sealing material is applied to a connection surface which is an inner surface of the wall for partitioning inside and outside of the connector housing and is connected to the circuit substrate, the case and the cover are fastened together by a fastening member, the hermetically sealed housing is provided with a sealable ventilation passage that communicates the inside of the hermetically sealed housing with outside air.

Abstract: The first annular sealing material is filled and applied between a first sealing surface provided on an outer peripheral part of the case and a second sealing surface provided on an outer peripheral part of the cover, a second annular sealing material is filled and applied between a first fitting member provided at the opening of the sealed housing and a second fitting member provided at the outer periphery of the body of the connector housing, a terminal part sealing material is applied to a connection surface which is an inner surface of the wall for partitioning inside and outside of the connector housing and is connected to the circuit substrate, the case and the cover are fastened together by a fastening member, the hermetically sealed housing is provided with a sealable ventilation passage that communicates the inside of the hermetically sealed housing with outside air.

Abstract: Even when parts having individual differences among identical parts or differences in deterioration speed between parts, or a part that does not have a non-volatile memory such as an EEPROM in a chip of the part itself, are mixed, there is no deterioration diagnosis device that can appropriately diagnose a state of deterioration due to temporal change or the like, because of which a mechanism (correction methodology) for evaluating and correcting deterioration in the precision or performance of an electronic part that has low precision or considerable temporal deterioration, and does not have a correction function, is incorporated in a deterioration diagnosis device, and a deterioration state is diagnosed using incorporated deterioration determination means when using a product after shipping.

Abstract: Even when parts having individual differences among identical parts or differences in deterioration speed between parts, or a part that does not have a non-volatile memory such as an EEPROM in a chip of the part itself, are mixed, there is no deterioration diagnosis device that can appropriately diagnose a state of deterioration due to temporal change or the like, because of which a mechanism (correction methodology) for evaluating and correcting deterioration in the precision or performance of an electronic part that has low precision or considerable temporal deterioration, and does not have a correction function, is incorporated in a deterioration diagnosis device, and a deterioration state is diagnosed using incorporated deterioration determination means when using a product after shipping.

Abstract: On-vehicle electrical loads (121,122) are connected to an on-vehicle battery (101) via a series circuit including a load switching element (221,222) and a reverse current interrupting element (200a) for a load circuit, and a feeding switching element (120A) that is closed in response to closure of a power supply switch (110). The element (FET) (200a) is closed when the switch (110) is closed and a power supply voltage is applied to a load power supply terminal (Vba) connected to the element (120A), to thereby be energized in an energization direction of an internal parasitic diode thereof. The element (200a) is de-energized when the switch (110) is opened. Thus, malfunction is prevented, which occurs when the element (120A) is opened, a short-to-power flows backward via the element (200a) into the terminal (Vba) so as to feed power to another device connected to the element (200a).

Abstract: On-vehicle electrical loads (121,122) are connected to an on-vehicle battery (101) via a series circuit including a load switching element (221,222) and a reverse current interrupting element (200a) for a load circuit, and a feeding switching element (120A) that is closed in response to closure of a power supply switch (110). The element (FET) (200a) is closed when the switch (110) is closed and a power supply voltage is applied to a load power supply terminal (Vba) connected to the element (120A), to thereby be energized in an energization direction of an internal parasitic diode thereof. The element (200a) is de-energized when the switch (110) is opened. Thus, malfunction is prevented, which occurs when the element (120A) is opened, a short-to-power flows backward via the element (200a) into the terminal (Vba) so as to feed power to another device connected to the element (200a).

Abstract: A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.

Abstract: A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.

Abstract: An electronic substrate device capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipator without intermediation of an electronic substrate. An electronic substrate device according to the present invention, in which a base member includes a central protruding portion which is accommodated in a penetrating portion while facing a die pad through an intermediary first gap, and first separated protruding portions provided around the central protruding portion have a height dimension smaller than that of the central protruding portion, the first separated protruding portions having a top surface which abuts a rear surface portion of the electronic substrate to form a second gap, and in which a first heat transfer bond which is a heat conductive adhesive is applied to the first gap and the second gap communicating with the first gap.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.