Patents by Inventor Yoshitami Yamamura

Yoshitami Yamamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymerizable, curable molding composition and a molding or coating process using this molding composition
    Patent number: 5589230
    Abstract: A polymerizable curable molding composition comprising (A) 100 parts by weight of an unsaturated epoxyester resin with an acid value below 3.0, (B) 10 to 40 parts by weight of a polymerizable monomer selected from the group consisting of phenoxyethyl acrylate, 2-acroyloxyethyl-2-hydroxypropyl phthalate and mixtures thereof and (C) 1 to 5 parts by weight of a mixture of hydroxyketone oligomer and 2-hydroxy-2-methyl-1-phenylpropan-1-one. The molding composition also preferably comprises 0.5 to 5 parts by weight of polystyrene microbeads. Also provided are a molding process using the polymerizable curable molding composition and a coating process using the polymerizable curing molding composition, each process being characterized by combined exposure of the composition to UV radiation and heating.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: December 31, 1996
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Yoshitami Yamamura, Nobuhiko Morimoto, Nobuyuki Tanaka