Patents by Inventor Yoshiteru Fukuda

Yoshiteru Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240024773
    Abstract: A non-transitory storage medium encoded with a computer readable program executed by a computer of a game device, at least one computer being configured to perform operations comprising obtaining data for determining a message to be shown while a game is running and performing conveyance processing for generating and providing a first image including a plurality of messages indicating game information of the game based on the obtained data such that the plurality of messages are sequentially shown. When the conveyance processing is terminated and the game processing is started, the second image further including a plurality of messages indicating the game information of the game based on the obtained data is generated and provided such that the plurality of messages are automatically sequentially shown.
    Type: Application
    Filed: June 26, 2023
    Publication date: January 25, 2024
    Inventors: Yoshiteru FUKUDA, Seita INOUE, Yosuke MORIMOTO
  • Publication number: 20210229135
    Abstract: A substrate processing apparatus includes an air supply configured to supply air into a place where a substrate is located; and a rectifying member, having multiple through holes, configured to rectify the air supplied from the air supply. The rectifying member includes a base; and a charge diffusion layer formed on a surface of the base. Electric charges attached to a surface of the rectifying member are diffused along the charge diffusion layer.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 29, 2021
    Inventors: Tadashi Iino, Yoshiteru Fukuda
  • Patent number: 10867814
    Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: December 15, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
  • Patent number: 10664131
    Abstract: An exemplary information-processing device includes: a first display control unit that controls a display unit to display plural items of application information; a first selecting unit that selects one item of application information from among the plurality of items of application information; a second display control unit that controls the display unit to display related information corresponding to the selected item of application information; a second selecting unit that selects a retail version application program or a trial version application program corresponding to the selected item of application information, based on an input by a user; a downloading unit that downloads the selected application program; a third display control unit that controls the display unit to display information for prompting a user to select whether the retail version application program is downloaded after the trial version application program is executed.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: May 26, 2020
    Assignee: Nintendo Co., Ltd.
    Inventors: Kazuto Nakaya, Yukari Marumo, Yasumasa Nakai, Yosuke Fujino, Yoshiteru Fukuda
  • Patent number: 10589174
    Abstract: In an example system according to the present embodiment, on a display, a map image is displayed and superimposed on a game image of a game space as viewed from a virtual camera provided behind a player character. When a user changes the orientation of a controller, the line-of-sight direction of the virtual camera is changed, and at the same time, the position of a cursor on the map image is changed. When the user presses down a predetermined button, a bullet is fired toward the center of a screen. When the user presses down another button, the player character moves to a location indicated by the cursor.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: March 17, 2020
    Assignee: Nintendo Co., Ltd.
    Inventor: Yoshiteru Fukuda
  • Publication number: 20180104591
    Abstract: In an example system according to the present embodiment, on a display, a map image is displayed and superimposed on a game image of a game space as viewed from a virtual camera provided behind a player character. When a user changes the orientation of a controller, the line-of-sight direction of the virtual camera is changed, and at the same time, the position of a cursor on the map image is changed. When the user presses down a predetermined button, a bullet is fired toward the center of a screen. When the user presses down another button, the player character moves to a location indicated by the cursor.
    Type: Application
    Filed: September 26, 2017
    Publication date: April 19, 2018
    Inventor: Yoshiteru FUKUDA
  • Publication number: 20170236729
    Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 17, 2017
    Inventors: Yosuke Kawabuchi, Kouzou Tachibana, Mitsunori Nakamori, Kotaro Ooishi, Keisuke Egashira, Koji Tanaka, Hiroaki Inadomi, Masami Yamashita, Yoshiteru Fukuda, Koji Yamashita, Yu Tsurifune, Takuro Masuzumi
  • Patent number: 9687743
    Abstract: A first information processing apparatus executes an application, and generates control data in accordance with a state of an execution of the application. The control data is transmitted to a second information processing apparatus. Video data is stored in advance in the second information processing apparatus. The second information processing apparatus receives the control data transmitted from the first information processing apparatus, determines a video to be reproduced based on the control data, and reproduces the video based on the video data.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: June 27, 2017
    Assignee: NINTENDO CO., LTD.
    Inventors: Toru Osawa, Satoshi Kira, Shinya Saito, Kenta Tanaka, Jumpei Horita, Kozo Makino, Yoshiteru Fukuda, Masayuki Kuwajima, Takashi Yoshimi
  • Patent number: 9555323
    Abstract: An exemplary information-processing device includes: a first receiving unit configured to receive plural categories for each of which a search condition is set, from a configuration device via a network; a first display control unit configured to control a display unit to display the received plural categories; a selecting unit configured to select one category from among the received plural categories; a transmitting unit configured to transmit to a search device a search condition that is set for the selected category; a second receiving unit configured to receive from the search device via the network a search result obtained using the transmitted search condition; and a second display control unit configured to control the display unit to display a content corresponding to the selected category, based on the received search result.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: January 31, 2017
    Assignee: NINTENDO CO., LTD.
    Inventors: Kunihiko Mizuno, Yasumasa Nakai, Yoko Ota, Yoshiteru Fukuda
  • Patent number: 9093222
    Abstract: Provided is a dye adsorption unit including a processing tank of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates. The dye adsorption unit further includes, as a moving system around the processing tank, a boat capable of going in and out of the processing tank from the upper opening, a boat transport unit that serves for the boat to go in and out of the processing tank, and a top cover for detachably closing the upper opening. Further, the dye adsorption unit includes a dye solution supply unit for supplying the dye solution into the processing tank, and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: July 28, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Goro Furutani, Takashi Terada, Yoshiteru Fukuda, Norio Wada
  • Patent number: 8697187
    Abstract: Resist coating treatments for application of a resist solution to removal of a resist film on a wafer edge portion. A laser irradiation unit applies a laser light in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. The application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion and supplies solvent to the resist film on the edge portion. The solvent dissolves and removes the resist film on the edge portion.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: April 15, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Yoshiteru Fukuda, Tomohiro Iseki, Takayuki Ishii
  • Publication number: 20130323934
    Abstract: [Problem] To significantly reduce processing time of a step of adsorbing dye in a porous semiconductor layer on a substrate surface. [Solution] A flow of a dye solution is formed in a gap between solution guide surface (92L, 92R) of a nozzle (20) and a substrate (G) during the treatment, and a porous semiconductor layer of a treated surface of the substrate is subject to dye adsorption treatment in this flow of the dye solution. Furthermore, impact pressure from slit-like discharge openings (88L, 88R) and pressure of turbulent flow in groove-like uneven sections (92L, 92R) act in the vertical direction in addition to the flow of the dye solution. Thus, aggregation and association of the dye are hardly caused on a surface part of the porous semiconductor layer of the treated surface of the substrate, the dye efficiently penetrates deeply into the porous semiconductor layer, and the dye adsorption into the porous semiconductor layer proceeds at high speed.
    Type: Application
    Filed: October 12, 2011
    Publication date: December 5, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Norio Wada, Takashi Terada, Yoshiteru Fukuda, Goro Furutani
  • Publication number: 20130316485
    Abstract: [Problem] To significantly reduce the processing time of a step in which a coloring matter is adsorbed onto a porous semiconductor layer formed on the surface to be treated of a substrate. [Solution] A dye adsorption unit (20) includes a processing tank (30) of which the upper surface is opened, in order to perform a batch dye adsorption process for a predetermined number of substrates (G). The dye adsorption unit (20) further includes, as a moving system around the processing tank (30), a boat (32) capable of going in and out of the processing tank (30) from the upper opening, a boat transport unit (34) that serves for the boat (32) to go in and out of the processing tank (30), and a top cover (36) for detachably closing the upper opening. Further, the dye adsorption unit (20) includes a dye solution supply unit for supplying the dye solution into the processing tank (30), and a flow control unit for controlling the flow of the dye solution in the processing tank during the dye adsorption processing.
    Type: Application
    Filed: September 27, 2011
    Publication date: November 28, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Goro Furutani, Takashi Terada, Yoshiteru Fukuda, Norio Wada
  • Patent number: 8138456
    Abstract: In the present invention, a plurality of suction ports are provided in a heating plate of a heat processing apparatus. The suction ports are provided at a central portion, an intermediate portion, and a peripheral portion of a substrate mounting surface of the heating plate, respectively. The warped state of the substrate before heat-processed is measured, so that when the substrate warps protruding downward, the suction start timing via a suction port corresponding to the outer peripheral portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports, and when the substrate warps protruding upward, the suction start timing via the suction port corresponding to the central portion of the substrate is set to be relatively early as compared to the suction start timings via the other suction ports.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: March 20, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Yoshiteru Fukuda, Kenichi Shigetomi, Shouken Moro
  • Patent number: 7976896
    Abstract: A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: July 12, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Yoshiteru Fukuda, Nobuhiro Ogata, Takayuki Ishii, Keiji Tanouchi
  • Publication number: 20110033626
    Abstract: Resist coating treatments for application of a resist solution to removal of a resist film on a wafer edge portion. A laser irradiation unit applies a laser light in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. The application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion and supplies solvent to the resist film on the edge portion. The solvent dissolves and removes the resist film on the edge portion.
    Type: Application
    Filed: October 19, 2010
    Publication date: February 10, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yoshiteru FUKUDA, Tomohiro Iseki, Takayuki Ishii
  • Publication number: 20110013879
    Abstract: A first information processing apparatus executes an application, and generates control data in accordance with a state of an execution of the application. The control data is transmitted to a second information processing apparatus. Video data is stored in advance in the second information processing apparatus. The second information processing apparatus receives the control data transmitted from the first information processing apparatus, determines a video to be reproduced based on the control data, and reproduces the video based on the video data.
    Type: Application
    Filed: October 29, 2009
    Publication date: January 20, 2011
    Applicant: NINTENDO CO., LTD.
    Inventors: Toru OSAWA, Satoshi Kira, Shinya Saito, Kenta Tanaka, Jumpei Horita, Kozo Makino, Yoshiteru Fukuda, Masayuki Kuwajima, Takashi Yoshimi
  • Patent number: 7832352
    Abstract: To perform a series of resist coating treatments from application of a resist solution to removal of a resist film on a wafer edge portion in a shorter time. A laser irradiation unit for applying a laser light is provided in a resist coating unit. At the time of resist coating treatment, the resist solution is discharged onto a central portion of the rotated wafer from a resist solution supply nozzle to form a resist film on the wafer. Thereafter, the laser irradiation unit moves to an outer peripheral portion of the wafer and applies the laser light onto the resist film on the outer peripheral portion to dry the resist film on the outer peripheral portion. After the resist film on the outer peripheral portion dries, the application of laser light is continued, and the solvent supply nozzle moves to a position above the edge portion of the wafer and supplies the solvent to the resist film on the edge portion of the wafer.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: November 16, 2010
    Assignee: Tokyo Electron Limited
    Inventors: Yoshiteru Fukuda, Tomohiro Iseki, Takayuki Ishii
  • Patent number: 7485188
    Abstract: A coating process method in which a coating liquid is discharged onto the surface of a target substrate to be processed while rotating the target substrate so as to expand the coating liquid radially outward on the target substrate and, thus, to form a coated film comprises the step of detecting that the actual discharging of a coating liquid from a coating liquid discharging nozzle is started, and the step of controlling based on a signal of the detection at least one of the driving timing of a pump for allowing the coating liquid to be discharged from the coating liquid discharging nozzle, the operation timing of a valve mounted to a pipe for supplying the coating liquid into the coating liquid discharging nozzle, and the rotation starting or stopping timing of the target substrate.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: February 3, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Takekuma, Yasuyuki Kometani, Yoshiteru Fukuda, Junya Minamida
  • Patent number: 7479190
    Abstract: In the present invention, a plurality of solvent supply nozzles for solvents having different solubility parameters are provided in a coating treatment apparatus. For a solvent supply nozzle for use at the time of edge rinse, a solvent supply nozzle is selected that discharges a removal solvent having a solubility parameter different by a set value or more from that of a coating solvent contained in a coating solution. During coating treatment, the coating solution is discharged from a coating solution supply nozzle onto the central portion of a rotated substrate to form a solution film having a predetermined film thickness. Immediately after the formation, edge rinse is started with the coating solution on the substrate not dry yet, in which the removal solvent is supplied to the peripheral portion of the substrate from the selected solvent supply nozzle.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: January 20, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Yoshiteru Fukuda, Tomohiro Iseki, Takayuki Ishii