Abstract: A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.

Abstract: A substrate detecting apparatus includes: a light sensor unit having a light-emission element and a light-receiving element arranged to face each other across the cassette, and a vertical driving device for moving at least one of the light sensor unit and the cassette relative to each other in a vertical direction a substrate position detecter is also provided for detecting a vertical positional range of each substrate held in the cassette, based on a wave form of an output signal generated by the light sensor unit as the at least one of the light sensor unit and the cassette is vertically moving relative to each other. A substrate conveying apparatus includes a clearance measurement device for measuring a vertical clearance between a pair of substrates held in the cassette, and an arm driving device for inserting the conveyance arm between the pair of substrates while lifting up the conveyance arm along a slant locus when the vertical clearance is less than a predetermined critical value.

Abstract: A velocity adjusting plate is provided above a substrate processing part in the interior of a substrate processing apparatus which is isolated from the external air. Thus, a downflow which is formed by conditioned air in the interior of the apparatus is separated into downflows having high and low velocities to be supplied to the substrate processing part and the periphery of the substrate processing part respectively. Consequently, the former downflow has a velocity which is suitable for controlling the temperature-humidity on the substrate surface and preventing the substrate from adhesion of particles and fine grains of a processing solution scattered from the substrate, while the latter downflow is suppressed to the minimum velocity which is necessary for preventing dusts and particles from creeping up by dispersion. Thus, it is possible to reduce consumption of air which is adjusted in temperature-humidity while isolating the interior of the apparatus from the external air.

Abstract: A substrate treating apparatus includes a substrate treating station for performing a predetermined treatment of substrates by supplying a predetermined treating solution to the substrates, and at least one treating solution supply mechanism for supplying the treating solution in a forced feed under gas pressure to the substrate treating station. The solution supply mechanism has a treating solution storage tank, a pressurizing mechanism, a pressure release mechanism and a valve for selectively allowing and stopping supply of the treating solution. The storage tank begins to be pressurized a predetermined time before the treating solution is supplied to a first substrate in a lot including a plurality of substrates to be treated successively with the same solution. Pressure is released from the storage tank based on a time at which the treating solution is stopped being supplied to a last substrate in the lot or at a predetermined slightly later time. Such control is effected lot by lot.

Abstract: A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter.

Abstract: An apparatus including a structure which separates a first transport robot (high temperature robot), which accesses a first processing part group including the thermal processing parts, from a second transport robot (low temperature robot) which accesses the only non-thermal processing parts. During circulating transportation of substrates to be processed, heat created at thermal processing parts is prevented from flowing into non-thermal processing parts. Semiconductor wafers are circulated one by one between the first processing part group which includes a hot plate and a second processing part group which does not include a hot plate and processed one at a time at each processing part. The high temperature robot accesses the first processing part group while the low temperature robot accesses the second processing part group. Transfer of a semiconductor wafer between the two robots is performed at a transfer part which is formed using a cool plate.

Abstract: A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.

Abstract: A deck movable between cassettes arranged on a base for storing a plurality of substrates in multiple stages and a substrate cleaning section for cleaning the substrates, supports a substrate fetching arm for fetching the substrates from the cassettes, and a cleaned substrate depositing arm for depositing treated substrates. The depositing arm is vertically movable between a position in which a substrate supporting surface thereof is situated below a substrate supporting surface of the substrate fetching arm to render the latter operative, and a position in which the supporting surface of the depositing arm is situated above the supporting surface of the fetching arm to render the depositing arm operative.

Abstract: A substrate holding apparatus includes a rotary table rotatable about a vertical center axis for supporting a substrate in a horizontal plane, and substrate travel regulating pins fixed to the rotary table and arranged at positions in contact with the outer edge of the substrate so that the center of gravity of the substrate supported on the rotary table is spaced from the center axis for regulating the travel of the substrate in a horizontal direction. Centrifugal force generated with respect to the substrate when the rotary table rotates about the center axis, urges the periphery of the substrate towards the travel regulating pins so that the resulting frictional force prevents rotary slippage between the substrate and the rotary table as rotation of the latter relates to the latter. The structure of this apparatus is simple because the substrate holding portion does not include a movable portion.

Abstract: An interface apparatus for transferring substrates between processing apparatus which provide various treatments for the substrates. The interface apparatus includes a transfer mechanism which, during a normal operation, receives substrates from an upstream processing apparatus and delivers the substrates to a downstream processing apparatus. Upon occurrence of a trouble in the downstream processing apparatus, the substrates transported from the upstream processing apparatus to the transfer mechanism are deposited in a substrate storage by a depositing and fetching mechanism. After the trouble is eliminated, the transfer mechanism delivers the substrates taken out of the storage to the downstream processing apparatus.

Abstract: An apparatus for heat-treating substrates includes a plurality of heat-treating units arranged in vertical stages, and at least one hollow column for supporting the heat-treating units. Each heat-treating unit has an exhaust line communicating with the column to exhaust gases from the heat-treating units through the column by suction.