Abstract: A method of forming a surface laminated circuit printed circuit board (SLC) where a photosensitive thermosetting resin in solution is applied atop a circuitized substrate. The method starts with the step of concentrating and solidifying the photosensitive thermosetting resin to build up a hardness therein high enough to withstand abrasion. This is done by first dissolving the photosensitive thermosetting resin in a solvent and then applying the solution to a substantially uneven surface. This is followed by evaporating solvent at a temperature below the curing temperature of the photosensitive thermosetting resin. Next, the surface of said resin layer is abraded to form a substantially even surface, and the resin layer is cured by heating the resin high enough to cross link and polymerize the resin.