Patents by Inventor Yoshiteru Masaoka

Yoshiteru Masaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230265285
    Abstract: A moisture curable composition, a method of applying the same, and a composition including the same are disclosed herein. In some embodiments, a curable composition, comprises: a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1): —Si(R13-a)Xa (1) wherein R1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present, a is an integer from 1 to 3, when a is 1, each R1 may be the same or different, and when a is 2 or 3, each X may be the same or different; a component (B) having a chlorinated polyolefin polymer; and a component (C) having a carboxylic acid metal salt.
    Type: Application
    Filed: September 2, 2021
    Publication date: August 24, 2023
    Applicant: Kaneka Americas Holding, Inc.
    Inventors: Jonathan Barrus, Ruolei Wang, Yoshiteru Masaoka
  • Publication number: 20070255005
    Abstract: The present invention has its object to provide a production process of curable resin compositions having thixotropy and comprising an organic polymer containing a reactive silyl group with good productivity and high production efficiency. Furthermore, the present invention provides a process for producing a curable resin composition which comprises at least two steps, namely the mixing step (A) of mixing an organic polymer (a) having at least one reactive silyl group in each molecule with a thixotropic agent (b) and the filling step (B) of packing the mixture obtained in the above step (A) into containers, and the mixture is subjected to heat treatment at a temperature exceeding the temperature in the mixing up in the above step (A) in the filling step (B) and/or after the filling step (B).
    Type: Application
    Filed: July 13, 2005
    Publication date: November 1, 2007
    Inventor: Yoshiteru Masaoka
  • Patent number: 6703442
    Abstract: The invention provides a curing agent for two-pack type curable composition use having excellent storage stability, and also provides a curing agent composition which comprises a hydrolyzable silyl group-containing compound (a), a non-phthalic acid ester based plasticizer (b) having no phthalic acid ester structure in its molecule, and a bivalent tin based curing catalyst (c), that satisfies all of mechanical properties, recoverability and adhesiveness to substrate, can be mixed easily when used and has excellent storage stability, and a two-pack type curable composition which hardens when a base resin composition comprising a curable organic polymer (d) having in its molecule a functional group crosslinkable by a reaction catalyzed by a bivalent tin based curing catalyst (c), an epoxy group-containing silane compound (f) and an epoxy compound (g) is mixed with the above curing agent composition.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: March 9, 2004
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ando, Yoshiteru Masaoka, Atsushi Fukunaga, Fumio Kawakubo
  • Patent number: 6569980
    Abstract: To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: May 27, 2003
    Assignee: Kaneka Corporation
    Inventors: Yoshiteru Masaoka, Atsushi Fukunaga, Hiroshi Ando, Fumio Kawakubo
  • Publication number: 20020198326
    Abstract: A polyolefin resin composition comprising (A) a polyolefin, and (B) 0.1 to 100 parts by weight, per 100 parts by weight of said polyolefin (A), of a modified polyolefin prepared by polymerizing (b) 1 to 500 parts by weight of a vinyl monomer in the presence of (a) 100 parts by weight of a nonpolar polyolefin, wherein the refraction index of said polyolefin (A) is substantially identical to that of said modified polyolefin (B), and having an excellent processability and being capable of providing molded articles having excellent properties such as transparency, impact resistance, rigidity and surface properties.
    Type: Application
    Filed: July 22, 2002
    Publication date: December 26, 2002
    Inventors: Taizo Aoyama, Ryuji Fukuda, Yoshihiko Okimura, Yoshiteru Masaoka, Akinori Kitora Shu, Kiyoyuki Namura
  • Patent number: 6410640
    Abstract: A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: June 25, 2002
    Assignee: Kaneka Corporation
    Inventors: Atsushi Fukunaga, Yoshiteru Masaoka, Hiroshi Ando, Fumio Kawakubo