Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element mounted on a substrate by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle for supplying the liquid resin R, and brings the tip of the nozzle close to the optical semiconductor element and then supplies the liquid resin R while raising the nozzle. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element mounted on a substrate by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle for supplying the liquid resin R, and brings the tip of the nozzle close to the optical semiconductor element and then supplies the liquid resin R while raising the nozzle. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: An optical device manufacturing apparatus includes an encapsulating device for encapsulating an optical semiconductor element 4 mounted on a substrate 2 by a liquid resin R in a lens shape, and a curing device for curing the liquid resin R, wherein the encapsulating device includes a dispenser capable of vertically moving a nozzle 25 for supplying the liquid resin R, and brings the tip of the nozzle 25 close to the optical semiconductor element 4 and then supplies the liquid resin R while raising the nozzle 25. According to this optical device manufacturing apparatus, an optical device having the desired optical properties can be obtained promptly and easily.

Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.

Abstract: A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.

Abstract: The present invention provides a silicone resin composition for encapsulating light-emitting elements with which encapsulation using a potting method can be easily accomplished, and which can be easily molded into a lens shape such as hemisphere, parabola, or the like. The composition can impart high transparency to the resulting encapsulating lens molded using a potting method. More particularly, the invention provides a silicone resin composition for encapsulating light-emitting elements, including 2 to 25 wt % of silica with a mean particle size of 1 to 30 nm based on the total amount of Components (A) and (B); and having a viscosity (23° C.) of more than 10 Pa·s and less than 70 Pa·s, and a thixotropic index of 2.0 to 5.5; the composition being used for encapsulation using a potting method.

Abstract: A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic component 6 surrounded by a casing 8, which method includes the steps of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and cutting the substrate 5 into individual lead frames. The step of charging the first resin includes the step of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.