Patents by Inventor Yoshiteru Noda

Yoshiteru Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4345371
    Abstract: A hybrid integrated circuit is manufactured byplacing chip-type circuit elements on predetermined portions of a template;preparing a printed circuit board having predetermined conductive patterns thereon and adhesive material at predetermined portions thereof;placing the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material;turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board;hardening the adhesive material to temporarily hold the circuit elements on the circuit board; andsoldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns.
    Type: Grant
    Filed: March 31, 1980
    Date of Patent: August 24, 1982
    Assignee: Sony Corporation
    Inventors: Mitsuo Ohsawa, Yoshiteru Noda, Iwao Ichikawa, Katsumi Yamamoto