Patents by Inventor Yoshito II

Yoshito II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive bump and electroless Pt plating bath
    Patent number: 11049838
    Abstract: The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 ?m or less.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: June 29, 2021
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Takuma Maekawa, Yukinori Oda, Toshiaki Shibata, Yoshito Ii, Sho Kanzaki
  • CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
    Publication number: 20200020660
    Abstract: The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 ?m or less.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 16, 2020
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Takuma MAEKAWA, Yukinori ODA, Toshiaki SHIBATA, Yoshito II, Sho KANZAKI